Hoier; Magdalena

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoier; Magdalena.The latest application filed is for "power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power ".

Company Profile

2.7.7

Hoier; Magdalena - Seubersdorf DE
Hoier; Magdalena - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Grant 11,322,451 - Hohlfeld , et al. May 3, 2	2022-05-03
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power App 20190221521 - Hohlfeld; Olaf ; et al.	2019-07-18
Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same Grant 10,242,969 - Hohlfeld , et al.	2019-03-26
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Grant 10,211,158 - Hohlfeld , et al. Feb	2019-02-19
Power semiconductor module and method for producing a power semiconductor module Grant 9,924,594 - Arens , et al. March 20, 2	2018-03-20
Method of forming a bondpad and bondpad Grant 9,780,053 - Hoier , et al. October 3, 2	2017-10-03
Electronic device and method of fabricating an electronic device Grant 9,756,726 - Heinrich , et al. September 5, 2	2017-09-05
Method of forming a bondpad and bondpad App 20160141259 - HOIER; Magdalena ; et al.	2016-05-19
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power Module App 20160126192 - Hohlfeld; Olaf ; et al.	2016-05-05
Semiconductor package comprising two semiconductor modules and laterally extending connectors Grant 9,196,510 - Hohlfeld , et al. November 24, 2	2015-11-24
Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same App 20150130071 - Hohlfeld; Olaf ; et al.	2015-05-14
Semiconductor Package Comprising Two Semiconductor Modules and Laterally Extending Connectors App 20150130048 - Hohlfeld; Olaf ; et al.	2015-05-14
Electronic Device and Method of Fabricating an Electronic Device App 20150124420 - Heinrich; Alexander ; et al.	2015-05-07
Power Semiconductor Module and Method for Producing a Power Semiconductor Module App 20150092376 - Arens; Andre ; et al.	2015-04-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.