Hohlfeld; Olaf

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hohlfeld; Olaf.The latest application filed is for "power module with metal substrate".

Company Profile

10.36.43

Hohlfeld; Olaf - Warstein DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power Module With Metal Substrate App 20220310465 - Li; Wu Hu ; et al.	2022-09-29
Semiconductor module and method for producing the same Grant 11,437,311 - Hohlfeld , et al. September 6, 2	2022-09-06
Power module with metal substrate Grant 11,404,336 - Li , et al. August 2, 2	2022-08-02
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Grant 11,322,451 - Hohlfeld , et al. May 3, 2	2022-05-03
Power Module with Metal Substrate App 20210407873 - Li; Wu Hu ; et al.	2021-12-30
Method for Producing a Substrate App 20210398821 - Craes; Fabian ; et al.	2021-12-23
Method For Producing Power Semiconductor Module Arrangement App 20210335682 - Roth; Alexander ; et al.	2021-10-28
Power semiconductor module arrangement Grant 11,081,414 - Roth , et al. August 3, 2	2021-08-03
Semiconductor Module and Method for Producing the Same App 20210074624 - Hohlfeld; Olaf ; et al.	2021-03-11
Semiconductor module and method for producing the same Grant 10,867,902 - Hohlfeld , et al. December 15, 2	2020-12-15
Power Semiconductor Module and Method for Fabricating the Same App 20200321262 - Schweikert; Christian ; et al.	2020-10-08
Semiconductor Arrangement and Method for Producing the Same App 20200266171 - Hohlfeld; Olaf	2020-08-20
Power Semiconductor Module Arrangement, Substrate Arrangement, and Method for Producing the Same App 20200083138 - Hohlfeld; Olaf	2020-03-12
Power Semiconductor Module Arrangement and Method for Producing the Same App 20190237372 - Roth; Alexander ; et al.	2019-08-01
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power App 20190221521 - Hohlfeld; Olaf ; et al.	2019-07-18
Semiconductor Module and Method for Producing the Same App 20190189553 - Hohlfeld; Olaf ; et al.	2019-06-20
Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same Grant 10,242,969 - Hohlfeld , et al.	2019-03-26
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Grant 10,211,158 - Hohlfeld , et al. Feb	2019-02-19
An Electronic Device Package App 20180350780 - Fuergut; Edward ; et al.	2018-12-06
Method for producing a power semiconductor module Grant 10,096,584 - Hohlfeld , et al. October 9, 2	2018-10-09
Electronic device package having a dielectric layer and an encapsulant Grant 10,043,782 - Fuergut , et al. August 7, 2	2018-08-07
Method for producing a number of chip assemblies and method for producing a semiconductor arrangement Grant 9,984,928 - Hohlfeld , et al. May 29, 2	2018-05-29
Chip assemblage, press pack cell and method for operating a press pack cell Grant 9,972,596 - Hohlfeld , et al. May 15, 2	2018-05-15
Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement Grant 9,818,730 - Beer , et al. November 14, 2	2017-11-14
Electronic Device Package Having a Dielectric Layer and an Encapsulant App 20170287880 - Fuergut; Edward ; et al.	2017-10-05
Method for producing a composite and a power semiconductor module Grant 9,688,060 - Bayerer , et al. June 27, 2	2017-06-27
Method for Producing a Power Semiconductor Module App 20170125395 - Hohlfeld; Olaf ; et al.	2017-05-04
Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material Grant 9,640,511 - Hohlfeld May 2, 2	2017-05-02
Semiconductor module, semiconductor module arrangement and method for operating a semiconductor module Grant 9,627,356 - Hohlfeld April 18, 2	2017-04-18
Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement Grant 9,620,459 - Beer , et al. April 11, 2	2017-04-11
Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement App 20170098580 - Hohlfeld; Olaf ; et al.	2017-04-06
Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board Grant 9,609,748 - Hohlfeld March 28, 2	2017-03-28
Spring contact for semiconductor chip Grant 9,595,502 - Hohlfeld , et al. March 14, 2	2017-03-14
Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement Grant 9,589,859 - Beer , et al. March 7, 2	2017-03-07
Semiconductor Module, Semiconductor Module Arrangement and Method for Operating a Semiconductor Module App 20160365333 - Hohlfeld; Olaf	2016-12-15
Method for Producing a Circuit Carrier Arrangement Having a Carrier which has a Surface Formed by an Aluminum/Silicon Carbide Metal Matrix Composite Material App 20160284664 - Hohlfeld; Olaf	2016-09-29
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power Module App 20160126192 - Hohlfeld; Olaf ; et al.	2016-05-05
Semiconductor Arrangement, Method For Producing A Semiconductor Chip App 20160126211 - Hohlfeld; Olaf ; et al.	2016-05-05
Chip Assemblage, Press Pack Cell And Method For Operating A Press Pack Cell App 20160126212 - Hohlfeld; Olaf ; et al.	2016-05-05
Explosion-protected semiconductor module Grant 9,214,432 - Boenig , et al. December 15, 2	2015-12-15
Semiconductor package comprising two semiconductor modules and laterally extending connectors Grant 9,196,510 - Hohlfeld , et al. November 24, 2	2015-11-24
Semiconductor Assembly Comprising Chip Arrays App 20150287698 - Hohlfeld; Olaf	2015-10-08
Semiconductor module and a method for fabrication thereof by extended embedding technologies Grant 9,064,869 - Hoegerl , et al. June 23, 2	2015-06-23
Semiconductor Package Comprising Two Semiconductor Modules and Laterally Extending Connectors App 20150130048 - Hohlfeld; Olaf ; et al.	2015-05-14
Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same App 20150130071 - Hohlfeld; Olaf ; et al.	2015-05-14
Explosion-Protected Semiconductor Module App 20150091148 - Boenig; Guido ; et al.	2015-04-02
Semiconductor Module Comprising Printed Circuit Board and Method for Producing a Semiconductor Module Comprising a Printed Circuit Board App 20150092380 - Hohlfeld; Olaf	2015-04-02
Explosion-protected semiconductor module Grant 8,981,545 - Hohlfeld , et al. March 17, 2	2015-03-17
Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement App 20150061100 - Beer; Gottfried ; et al.	2015-03-05
Semiconductor Arrangement, Method for Producing a Semiconductor Module, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement App 20150061144 - Beer; Gottfried ; et al.	2015-03-05
Semiconductor Module and a Method for Fabrication Thereof By Extended Embedding Technologies App 20150054159 - Hoegerl; Juergen ; et al.	2015-02-26
Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement App 20150054166 - Beer; Gottfried ; et al.	2015-02-26
Semiconductor device including cladded base plate Grant 8,963,321 - Lenniger , et al. February 24, 2	2015-02-24
Explosion-Protected Semiconductor Module App 20140035117 - Hohlfeld; Olaf ; et al.	2014-02-06
Semiconductor module comprising an insert Grant 8,587,116 - Hohlfeld , et al. November 19, 2	2013-11-19
Semiconductor device including cladded base plate Grant 8,519,532 - Lenniger , et al. August 27, 2	2013-08-27
Power semiconductor module including substrates spaced from each other Grant 8,514,579 - Stolze , et al. August 20, 2	2013-08-20
Method for Producing a Composite and a Power Semiconductor Module App 20130203218 - Bayerer; Reinhold ; et al.	2013-08-08
Semiconductor Device Including Cladded Base Plate App 20130134572 - Lenniger; Andreas ; et al.	2013-05-30
Semiconductor Device Including Cladded Base Plate App 20130062750 - Lenniger; Andreas ; et al.	2013-03-14
Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly Grant 8,319,335 - Bayerer , et al. November 27, 2	2012-11-27
Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond Grant 8,298,867 - Hohlfeld , et al. October 30, 2	2012-10-30
Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module Grant 8,159,822 - Kanschat , et al. April 17, 2	2012-04-17
Semiconductor Module Comprising an Insert and Method for Producing a Semiconductor Module Comprising an Insert App 20120080799 - Hohlfeld; Olaf ; et al.	2012-04-05
Twist-secured assembly of a power semiconductor module mountable on a heat sink Grant 8,134,837 - Hohlfeld , et al. March 13, 2	2012-03-13
Method for Fabricating a Circuit Substrate Assembly and a Power Electronics Module Comprising an Anchoring Structure for Producing a Changing Temperature-Stable Solder Bond App 20110053319 - Hohlfeld; Olaf ; et al.	2011-03-03
Power Semiconductor Module Featuring Resiliently Supported Substrates And Method For Fabricating A Power Semiconductor Module App 20100302741 - Kanschat; Peter ; et al.	2010-12-02
Power Semiconductor Module Including Substrates Spaced from Each Other App 20100284155 - Stolze; Thilo ; et al.	2010-11-11
Twist-Secured Assembly of a Power Semiconductor Module Mountable on a Heat Sink App 20100284153 - Hohlfeld; Olaf ; et al.	2010-11-11
Module including a rough solder joint Grant 7,821,130 - Hohlfeld , et al. October 26, 2	2010-10-26
Power Semiconductor Module, Power Semiconductor Module Assembly and Method for Fabricating a Power Semiconductor Module Assembly App 20100252922 - Bayerer; Reinhold ; et al.	2010-10-07
Module Including A Stable Solder Joint App 20100068552 - Goerlich; Jens ; et al.	2010-03-18
Module Including A Rough Solder Joint App 20090243089 - Hohlfeld; Olaf ; et al.	2009-10-01

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