Hogerl; Jurgen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hogerl; Jurgen.The latest application filed is for "electronic module and method of manufacturing the same".

Company Profile

0.10.9

Hogerl; Jurgen - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic module and method of manufacturing the same Grant 9,847,274 - Winter , et al. December 19, 2	2017-12-19
Electronic module and method of manufacturing the same App 20170092563 - WINTER; Frank ; et al.	2017-03-30
Electronic component with electronic chip between redistribution structure and mounting structure Grant 9,385,111 - Mengel , et al. July 5, 2	2016-07-05
Placement system for populating a substrate with electronic components Grant 7,500,305 - Hogerl , et al. March 10, 2	2009-03-10
Method for populating a substrate with electronic components Grant 7,069,647 - Hogerl , et al. July 4, 2	2006-07-04
Placement system for populating a substrate with electronic components App 20060123624 - Hogerl; Jurgen ; et al.	2006-06-15
Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor product Grant 6,960,829 - Hogerl November 1, 2	2005-11-01
Electronic component with a semiconductor chip and method for producing the electronic component Grant 6,851,598 - Gebauer , et al. February 8, 2	2005-02-08
Semiconductor assembly with a semiconductor module Grant 6,774,483 - Hogerl , et al. August 10, 2	2004-08-10
Method and placement system for populating a substrate with electronic components App 20040111875 - Hogerl, Jurgen ; et al.	2004-06-17
Configuration of a plurality of circuit modules Grant 6,737,581 - Hogerl May 18, 2	2004-05-18
Module unit for memory modules and method for its production Grant 6,665,182 - Hogerl December 16, 2	2003-12-16
Semiconductor module having interconnected semiconductor chips disposed one above the other Grant 6,646,333 - Hogerl November 11, 2	2003-11-11
Semiconductor assembly with a semiconductor module App 20030193085 - Hogerl, Jurgen ; et al.	2003-10-16
Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor product App 20030186487 - Hogerl, Jurgen	2003-10-02
Electronic component with a semiconductor chip and method for producing the electronic component App 20030038157 - Gebauer, Uta ; et al.	2003-02-27
Module unit for memory modules and method for its production App 20030012001 - Hogerl, Jurgen	2003-01-16
Configuration of a plurality of circuit modules App 20020050376 - Hogerl, Jurgen	2002-05-02
Housing for semiconductor chips App 20010030359 - Hogerl, Jurgen ; et al.	2001-10-18

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