Hoge; Carl E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoge; Carl E..The latest application filed is for "system and method for processor power delivery and thermal management".

Company Profile

1.11.10

Hoge; Carl E. - San Diego CA
Hoge; Carl E. - San Diago CA
Hoge; Carl E. - Encinitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System and method for processor power delivery and thermal management Grant 7,881,072 - Dibene, II , et al. February 1, 2	2011-02-01
System And Method For Processor Power Delivery And Thermal Management App 20100325882 - DiBene, II; Joseph Ted ; et al.	2010-12-30
System And Method For Processor Power Delivery And Thermal Management App 20070268677 - DiBene; Joseph Ted II ; et al.	2007-11-22
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management Grant 7,245,507 - DiBene, II , et al. July 17, 2	2007-07-17
System and method for processor power delivery and thermal management App 20070004240 - Dibene; Joseph Ted II ; et al.	2007-01-04
System and method for processor power delivery and thermal management App 20050277310 - Dibene, Joseph Ted II ; et al.	2005-12-15
Ultra-low impedance power interconnection system for electronic packages Grant 6,847,529 - Dibene, II , et al. January 25, 2	2005-01-25
System and method for processor power delivery and thermal management App 20030214800 - Dibene, Joseph Ted II ; et al.	2003-11-20
Apparatus for delivering power to high performance electronic assemblies Grant 6,618,268 - Dibene, II , et al. September 9, 2	2003-09-09
Ultra-low impedance power interconnection system for electronic packages Grant 6,556,455 - Dibene, II , et al. April 29, 2	2003-04-29
Ultra-low impedance power interconnection system for electronic packages App 20030002268 - Dibene, Joseph Ted II ; et al.	2003-01-02
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management App 20020196614 - DiBene, Joseph T. II ; et al.	2002-12-26
Apparatus for providing power to a microprocessor with integrated thermal and EMI management Grant 6,452,113 - Dibene, II , et al. September 17, 2	2002-09-17
Ultra-low impedance power interconnection system for electronic packages App 20020114129 - Dibene, Joseph T. II ; et al.	2002-08-22
Method and apparatus for delivering power to high performance electronic assemblies App 20010036066 - Dibene, Joseph T. II ; et al.	2001-11-01
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management App 20010032738 - Dibene, Joseph Ted II ; et al.	2001-10-25
Directionally conductive polymer Grant 5,213,715 - Patterson , et al. May 25, 1	1993-05-25
Polymer film interconnect Grant 5,147,210 - Patterson , et al. September 15, 1	1992-09-15
Plated plastic castellated interconnect for electrical components Grant 5,069,626 - Patterson , et al. December 3, 1	1991-12-03
Integrated circuit chip mounting and packaging assembly Grant 4,843,188 - Patterson , et al. June 27, 1	1989-06-27
Semiconductor die-attach technique and composition therefor Grant 4,487,638 - Hoge December 11, 1	1984-12-11

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