Hoffmeyer; Mark K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoffmeyer; Mark K..The latest application filed is for "liquid metal infiltration rework of electronic assembly".

Company Profile

24.46.42

Hoffmeyer; Mark K. - Rochester MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reliability enhancement of press fit connectors Grant 11,456,548 - Hoffmeyer , et al. September 27, 2	2022-09-27
Thermal interface material structures for directing heat in a three-dimensional space Grant 11,416,045 - Hoffmeyer , et al. August 16, 2	2022-08-16
Fixture facilitating heat sink fabrication Grant 11,404,287 - Isaacs , et al. August 2, 2	2022-08-02
Liquid Metal Infiltration Rework Of Electronic Assembly App 20220232746 - Hoffmeyer; Mark K. ; et al.	2022-07-21
Liquid metal infiltration rework of electronic assembly Grant 11,310,950 - Hoffmeyer , et al. April 19, 2	2022-04-19
Land grid array electrical contact coating Grant 11,289,836 - O'Connell , et al. March 29, 2	2022-03-29
Liquid metal infiltration rework of electronic assembly Grant 11,278,977 - Hoffmeyer , et al. March 22, 2	2022-03-22
Land Grid Array Electrical Contact Coating App 20220029326 - O'Connell; Kevin ; et al.	2022-01-27
Connecting a component to a substrate by adhesion to an oxidized solder surface Grant 11,228,124 - Hoffmeyer , et al. January 18, 2	2022-01-18
Thermal interface materials with radiative coupling heat transfer Grant 11,198,807 - Yuksel , et al. December 14, 2	2021-12-14
Integrated circuit module with a structurally balanced package using a bottom side interposer Grant 11,195,789 - Hoffmeyer December 7, 2	2021-12-07
Thermal Interface Material Structures For Directing Heat In A Three-dimensional Space App 20210318734 - HOFFMEYER; MARK K. ; et al.	2021-10-14
Pierced Thermal Interface Constructions App 20210318077 - HOFFMEYER; MARK K.	2021-10-14
Tamper-respondent sensors with liquid crystal polymer layers Grant 11,122,682 - Busby , et al. September 14, 2	2021-09-14
Multi layer thermal interface material Grant 11,037,860 - Hoffmeyer , et al. June 15, 2	2021-06-15
Thermal interface material structures Grant 11,013,147 - Hoffmeyer , et al. May 18, 2	2021-05-18
Computer system with modified module socket Grant 10,993,324 - Arvin , et al. April 27, 2	2021-04-27
Liquid Metal Infiltration Rework Of Electronic Assembly App 20210120713 - Hoffmeyer; Mark K. ; et al.	2021-04-22
Liquid Metal Infiltration Rework Of Electronic Assembly App 20210114126 - Hoffmeyer; Mark K. ; et al.	2021-04-22
Integrated Circuit Module With A Structurally Balanced Package Using A Bottom Side Interposer App 20210111112 - Hoffmeyer; Mark K.	2021-04-15
Fixture Facilitating Heat Sink Fabrication App 20210111037 - ISAACS; Phillip D. ; et al.	2021-04-15
Fixture facilitating heat sink fabrication Grant 10,978,313 - Isaacs , et al. April 13, 2	2021-04-13
Thermal Interface Materials With Radiative Coupling Heat Transfer App 20210087450 - Yuksel; Anil ; et al.	2021-03-25
Reliability Enhancement Of Press Fit Connectors App 20210083410 - Hoffmeyer; Mark K. ; et al.	2021-03-18
Computer System With Modified Module Socket App 20200412045 - Arvin; Charles Leon ; et al.	2020-12-31
Multi Layer Thermal Interface Material App 20200411411 - Hoffmeyer; Mark K. ; et al.	2020-12-31
Applying A Solderable Surface To Conductive Ink App 20200404795 - HOFFMEYER; MARK K. ; et al.	2020-12-24
Implementing reworkable strain relief packaging structure for electronic component interconnects Grant 10,834,811 - Hoffmeyer November 10, 2	2020-11-10
Integrated circuit device assembly Grant 10,779,391 - Barron , et al. Sept	2020-09-15
Efficient placement of grid array components Grant 10,756,009 - Hoffmeyer , et al. A	2020-08-25
Thermal Interface Material Structures App 20200221602 - HOFFMEYER; MARK K. ; et al.	2020-07-09
Integrated Circuit Module With A Structurally Balanced Package Using A Bottom Side Interposer App 20200176368 - Hoffmeyer; Mark K.	2020-06-04
Thermal interface material structures Grant 10,653,037 - Hoffmeyer , et al.	2020-05-12
Adhesive-bonded thermal interface structures Grant 10,607,859 - Stathakis , et al.	2020-03-31
Tamper-respondent Sensors With Liquid Crystal Polymer Layers App 20190313526 - BUSBY; James A. ; et al.	2019-10-10
Adhesive-bonded Thermal Interface Structures App 20190267254 - Stathakis; Karl ; et al.	2019-08-29
Adhesive-bonded Thermal Interface Structures App 20190267253 - Stathakis; Karl ; et al.	2019-08-29
Fixture Facilitating Heat Sink Fabrication App 20190259632 - ISAACS; Phillip D. ; et al.	2019-08-22
Adhesive-bonded thermal interface structures Grant 10,319,609 - Stathakis , et al.	2019-06-11
Adhesive-bonded thermal interface structures Grant 10,304,699 - Stathakis , et al.	2019-05-28
Thermal Interface Material Structures App 20190116686 - HOFFMEYER; MARK K. ; et al.	2019-04-18
Adhesive-bonded thermal interface structures for integrated circuit cooling Grant 10,236,189 - Stathakis , et al.	2019-03-19
Thermal interface material structures Grant 10,182,514 - Hoffmeyer , et al. Ja	2019-01-15
Testing printed circuit board assembly Grant 10,168,383 - Hoffmeyer , et al. J	2019-01-01
Adhesive-bonded Thermal Interface Structures For Integrated Circuit Cooling App 20180374715 - Stathakis; Karl ; et al.	2018-12-27
Adhesive-bonded Thermal Interface Structures App 20180374716 - Stathakis; Karl ; et al.	2018-12-27
Adhesive-bonded Thermal Interface Structures App 20180374714 - Stathakis; Karl ; et al.	2018-12-27
Testing Printed Circuit Board Assembly App 20180328980 - Hoffmeyer; Mark K. ; et al.	2018-11-15
Implementing reworkable strain relief packaging structure for electronic component interconnects Grant 10,111,322 - Hoffmeyer October 23, 2	2018-10-23
Testing printed circuit board assembly Grant 10,048,312 - Hoffmeyer , et al. August 14, 2	2018-08-14
Implementing Reworkable Strain Relief Packaging Structure For Electronic Component Interconnects App 20180228022 - Hoffmeyer; Mark K.	2018-08-09
Implementing Reworkable Strain Relief Packaging Structure For Electronic Component Interconnects App 20180168030 - Hoffmeyer; Mark K.	2018-06-14
Integrated Circuit Device Assembly App 20180160524 - BARRON; David ; et al.	2018-06-07
Integrated circuit device assembly Grant 9,913,361 - Barron , et al. March 6, 2	2018-03-06
Thermal Interface Material Structures App 20170374759 - HOFFMEYER; MARK K. ; et al.	2017-12-28
Integrated Circuit Device Assembly App 20170196075 - Barron; David ; et al.	2017-07-06
Eye-of-needle compliant pin Grant 9,647,356 - Hoffmeyer May 9, 2	2017-05-09
Twisted eye-of-needle compliant pin Grant 9,640,934 - Hoffmeyer May 2, 2	2017-05-02
Eye-of-needle Compliant Pin App 20170093058 - Hoffmeyer; Mark K.	2017-03-30
Twisted Eye-of-needle Compliant Pin App 20170093110 - Hoffmeyer; Mark K.	2017-03-30
Area array device connection structures with complimentary warp characteristics Grant 9,609,744 - Hoffmeyer , et al. March 28, 2	2017-03-28
Method of making a solder tail extender connector Grant 9,537,234 - Brodsky , et al. January 3, 2	2017-01-03
Eye-of-needle compliant pin Grant 9,472,876 - Hoffmeyer October 18, 2	2016-10-18
Twisted eye-of-needle compliant pin Grant 9,472,877 - Hoffmeyer October 18, 2	2016-10-18
Electronic component assembly Grant 9,402,320 - Hoffmeyer , et al. July 26, 2	2016-07-26
Area array device connection structures with complimentary warp characteristics Grant 9,247,636 - Hoffmeyer , et al. January 26, 2	2016-01-26
Area Array Device Connection Structures With Complimentary Warp Characteristics App 20150195901 - Hoffmeyer; Mark K. ; et al.	2015-07-09
Implementing Production Of Solder Tail Extender Connectors From Compliant Pin Connectors App 20150041212 - Brodsky; William L. ; et al.	2015-02-12
Implementing hybrid molded solder-embedded pin contacts and connectors Grant 8,864,536 - Hoffmeyer October 21, 2	2014-10-21
Area Array Device Connection Structures With Complimentary Warp Characteristics App 20140268603 - Hoffmeyer; Mark K. ; et al.	2014-09-18
Electronic Component Assembly App 20140133122 - Hoffmeyer; Mark K. ; et al.	2014-05-15
Implementing Hybrid Molded Solder-embedded Pin Contacts And Connectors App 20130295797 - Hoffmeyer; Mark K.	2013-11-07
Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing Grant 8,267,701 - Beaman , et al. September 18, 2	2012-09-18
Meeting Calendar Optimization App 20110320237 - Beaman; Brian S. ; et al.	2011-12-29
Large Scale Hybrid Socket For An Area Array Device App 20110287638 - Beaman; Brian S. ; et al.	2011-11-24
Implementing enhanced connector guide block structures for robust SMT assembly Grant 7,985,095 - Brodsky , et al. July 26, 2	2011-07-26
Implementing Enhanced Connector Guide Block Structures For Robust Smt Assembly App 20110008994 - Brodsky; William L. ; et al.	2011-01-13
Heat sink Grant 7,856,341 - Carlson , et al. December 21, 2	2010-12-21
Heat Sink Method, System, And Program Product App 20090210190 - Carlson; Brian L. ; et al.	2009-08-20
Backplane Connector With High Density Broadside Differential Signaling Conductors App 20080318455 - Beaman; Brian S. ; et al.	2008-12-25
Heatsink and package structures with fusible release layer Grant 6,084,775 - Bartley , et al. July 4, 2	2000-07-04
Universal surface finish for DCA, SMT and pad on pad interconnections Grant 5,910,644 - Goodman , et al. June 8, 1	1999-06-08
Method of performing solder joint analysis of semi-conductor components Grant 5,651,493 - Bielick , et al. July 29, 1	1997-07-29
Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization Grant 5,632,438 - Hoffmeyer , et al. May 27, 1	1997-05-27
Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor Grant 5,601,675 - Hoffmeyer , et al. February 11, 1	1997-02-11
Metal substrate double sided circuit board Grant H1,471 - Braun , et al. August 1, 1	1995-08-01