HOFFMAN; Paul Robert

Patent Applications and Registrations

Patent applications and USPTO patent grants for HOFFMAN; Paul Robert.The latest application filed is for "liquid flow determination and control in a hypodermic needle device".

Company Profile

9.8.14

HOFFMAN; Paul Robert - San Diego CA
Hoffman; Paul Robert - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Control Of Drug Administration Via Hypodermic Needle Devices App 20190054234 - GANTON; Robert ; et al.	2019-02-21
Temperature Thresholding In Drug Dispensing Devices App 20190053981 - NIZNIK; Brian ; et al.	2019-02-21
Liquid Flow Determination And Control In A Hypodermic Needle Device App 20190054254 - HOFFMAN; Paul Robert ; et al.	2019-02-21
Impedance-based Determination Of Whether A Hypodermic Needle Is Inserted Into The Skin App 20190054244 - AMSCHLER; John Earl ; et al.	2019-02-21
Medicine Delivery Device App 20190054246 - GANTON; Robert ; et al.	2019-02-21
Optical Methods For Measuring Dosage In A Medicine Delivery Device App 20190054252 - AMSCHLER; John Earl ; et al.	2019-02-21
Drug Delivery Measurement In A Medicine Delivery Device App 20190054250 - AMSCHLER; John Earl ; et al.	2019-02-21
Medicine Delivery Device App 20190054251 - PIERONEK; James ; et al.	2019-02-21
Medicine Delivery Device App 20190054247 - DANTSKER; Eugene ; et al.	2019-02-21
Breathprint Sensor Systems, Smart Inhalers And Methods For Personal Identification App 20170164892 - Sezan; Muhammed Ibrahim ; et al.	2017-06-15
Breathprint Sensor Systems, Smart Inhalers And Methods For Personal Identification App 20160106935 - Sezan; Muhammed Ibrahim ; et al.	2016-04-21
Lead-frame method and assembly for interconnecting circuits within a circuit module Grant 7,176,062 - Miks , et al. February 13, 2	2007-02-13
Structures for improving heat dissipation in stacked semiconductor packages Grant 6,919,631 - Hoffman , et al. July 19, 2	2005-07-19
Lead-frame method and assembly for interconnecting circuits within a circuit module Grant 6,900,527 - Miks , et al. May 31, 2	2005-05-31
Look Down Image Sensor Package App 20050051859 - Hoffman, Paul Robert	2005-03-10
Surface mountable antenna App 20040222927 - Hoffman, Paul Robert ; et al.	2004-11-11
Quick sealing glass-lidded package fabrication method Grant 6,759,266 - Hoffman July 6, 2	2004-07-06
Structures for improving heat dissipation in stacked semiconductor packages Grant 6,737,750 - Hoffman , et al. May 18, 2	2004-05-18
Personalized circuit module package and method for packaging circuit modules Grant 6,632,997 - Hoffman , et al. October 14, 2	2003-10-14
Sensor module with integrated discrete components mounted on a window Grant 6,630,661 - Hoffman October 7, 2	2003-10-07
Quick sealing glass-lidded package Grant 6,603,183 - Hoffman August 5, 2	2003-08-05
Personalized circuit module package and method for packaging Circuit modules App 20030000722 - Hoffman, Paul Robert ; et al.	2003-01-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.