| Patent | Date |
|---|
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
Grant 7,064,009 - McCann , et al. June 20, 2 | 2006-06-20 |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
Grant 7,045,883 - McCann , et al. May 16, 2 | 2006-05-16 |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
Grant 6,873,032 - McCann , et al. March 29, 2 | 2005-03-29 |
System and method for the targeted distribution of promotional information over a network
App 20040054574 - Kaufman, Arthur H. ; et al. | 2004-03-18 |
Thermally enhanced chip scale lead on chip semiconductor package
Grant 6,597,059 - McCann , et al. July 22, 2 | 2003-07-22 |
Semiconductor package having a ground or power ring and a metal substrate
Grant 5,877,551 - Tostado , et al. March 2, 1 | 1999-03-02 |
Ball grid array electronic package standoff design
Grant 5,805,427 - Hoffman September 8, 1 | 1998-09-08 |
Components for housing an integrated circuit device
Grant 5,578,869 - Hoffman , et al. November 26, 1 | 1996-11-26 |
Electronic package having improved wire bonding capability
Grant 5,506,446 - Hoffman , et al. April 9, 1 | 1996-04-09 |
Polymer plug for electronic packages
Grant 5,477,008 - Pasqualoni , et al. December 19, 1 | 1995-12-19 |
Semiconductor package with chip redistribution interposer
Grant 5,455,387 - Hoffman , et al. October 3, 1 | 1995-10-03 |
Chamfered electronic package component
Grant 5,455,386 - Brathwaite , et al. October 3, 1 | 1995-10-03 |
Metal electronic package with reduced seal width
Grant 5,399,805 - Tyler , et al. March 21, 1 | 1995-03-21 |
Multi-chip electronic package module utilizing an adhesive sheet
Grant 5,360,942 - Hoffman , et al. November 1, 1 | 1994-11-01 |
Metal electronic package with reduced seal width
Grant 5,324,888 - Tyler , et al. June 28, 1 | 1994-06-28 |
Pearlscent pigment and process for producing the same
Grant 5,266,107 - Hoffman November 30, 1 | 1993-11-30 |
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
Grant 5,189,363 - Bregman , et al. February 23, 1 | 1993-02-23 |
Playing card coding system and apparatus for dealing coded cards
Grant 4,534,562 - Cuff , et al. August 13, 1 | 1985-08-13 |
Floppy disc drive
Grant 4,359,763 - Hoffman November 16, 1 | 1982-11-16 |
Food processor tool holder
Grant D255,753 - Hoffman , et al. July 8, 1 | 1980-07-08 |
Food processor tool holder
Grant D252,491 - Hoffman , et al. July 31, 1 | 1979-07-31 |
Food processor tool holder
Grant 4,146,131 - Hoffman , et al. March 27, 1 | 1979-03-27 |
Liquid jet droplet generator
Grant 4,005,435 - Lundquist , et al. January 25, 1 | 1977-01-25 |
Air turbulence control of inflight ink droplets in non-impact recorders
Grant 3,972,051 - Lundquist , et al. July 27, 1 | 1976-07-27 |
Tapeless Paper Motion Control System Providing Sensing Circuits To Govern Motor Incrementing
Grant 3,857,471 - Hoffman , et al. December 31, 1 | 1974-12-31 |
Form Index Pulse Generator
Grant 3,843,917 - Hoffman October 22, 1 | 1974-10-22 |
Golf Green
Grant 3,595,581 - Anderson , et al. July 27, 1 | 1971-07-27 |
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