Hoffarth; Joseph G.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hoffarth; Joseph G..The latest application filed is for "high density circuit board and method of making same".
- Hoffarth; Joseph G. - Binghamton NY
| Patent | Date |
|---|---|
| High density circuit board and method of making same Grant 5,191,174 - Chang , et al. March 2, 1 | 1993-03-02 |
| Method of making multilayer circuit boards having conformal Insulating layers Grant 5,114,518 - Hoffarth , et al. May 19, 1 | 1992-05-19 |
| High performance circuit boards Grant 4,868,350 - Hoffarth , et al. September 19, 1 | 1989-09-19 |
| Interlaminate adhesion between polymeric materials and electrolytic copper surfaces Grant 4,810,326 - Babu , et al. March 7, 1 | 1989-03-07 |
| Plasma etch enhancement with large mass inert gas Grant 4,797,178 - Bui , et al. January 10, 1 | 1989-01-10 |
| Method of removing seed particles from circuit board substrate surface Grant 4,718,972 - Babu , et al. January 12, 1 | 1988-01-12 |
| Plasma etching with tracer Grant 4,599,134 - Babu , et al. July 8, 1 | 1986-07-08 |
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