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Hoetzel; Berndt Patent Filings

Hoetzel; Berndt

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoetzel; Berndt.The latest application filed is for "method and device for cutting flat work pieces made of a brittle material".

Company Profile
0.3.3
  • Hoetzel; Berndt - Woerrstadt DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and device for cutting flat work pieces made of a brittle material
Grant 7,014,082 - Hauer , et al. March 21, 2
2006-03-21
Method and device for cutting flat work pieces made of a brittle material
App 20050029321 - Hauer, Dirk ;   et al.
2005-02-10
Method and device for the separation of flat workpieces made from a brittle material
Grant 6,811,069 - Hauer , et al. November 2, 2
2004-11-02
Method and device for cutting flat work pieces of a brittle material
Grant 6,635,848 - Hauer , et al. October 21, 2
2003-10-21
Method and device for the separation of flat workpieces made from a brittle material
App 20020179667 - Hauer, Dirk ;   et al.
2002-12-05
Method and device for cutting flat work pieces made of a brittle material
App 20020170895 - Hauer, Dirk ;   et al.
2002-11-21

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