HOEGLAUER; Josef

Patent Applications and Registrations

Patent applications and USPTO patent grants for HOEGLAUER; Josef.The latest application filed is for "package with clip having through hole accommodating component-related structure".

Company Profile

18.85.100

HOEGLAUER; Josef - Heimstetten DE
Hoeglauer; Josef - Helmstetten DE
Hoeglauer; Josef - Haimstetten DE
Hoeglauer; Josef - Kirchheim-Heimstette DE
Hoeglauer; Josef - Muenchen DE
Hoeglauer; Josef - Kirchhein-Heimstetten DE
Hoeglauer; Josef - Kirchheim-Heimstetten DE
Hoeglauer; Josef - Munich N/A DE
Hoeglauer; Josef - Munchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package With Clip Having Through Hole Accommodating Component-related Structure App 20220254696 - KESSLER; Angela ; et al.	2022-08-11
Method Of Fabricating A Semiconductor Package App 20220230941 - Dinkel; Markus ; et al.	2022-07-21
Semiconductor package and method of fabricating a semiconductor package Grant 11,302,610 - Dinkel , et al. April 12, 2	2022-04-12
Semiconductor Module App 20220093573 - Kessler; Angela ; et al.	2022-03-24
Semiconductor Package, Semiconductor Module and Methods for Manufacturing a Semiconductor Package and a Semiconductor Module App 20220084915 - Yuferev; Sergey ; et al.	2022-03-17
Semiconductor Devices Including Parallel Electrically Conductive Layers App 20210287964 - PALM; Petteri ; et al.	2021-09-16
Semiconductor Package Having A Lead Frame And A Clip Frame App 20210166998 - Scharf; Thorsten ; et al.	2021-06-03
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture Grant 10,964,628 - Scharf , et al. March 30, 2	2021-03-30
Methods Of Producing Inductor Modules And Power Semiconductor Systems Having Inductor Modules App 20210036610 - Palm; Petteri ; et al.	2021-02-04
Semiconductor Package Including A Cavity In Its Package Body App 20210035876 - Otremba; Ralf ; et al.	2021-02-04
Method of producing an SMD package with top side cooling Grant 10,903,133 - Otremba , et al. January 26, 2	2021-01-26
Methods of manufacturing inductor modules and power semiconductor systems having inductor modules Grant 10,833,583 - Palm , et al. November 10, 2	2020-11-10
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture App 20200273781 - Scharf; Thorsten ; et al.	2020-08-27
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture App 20200273790 - Tay; Bun Kian ; et al.	2020-08-27
Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules App 20200212798 - Palm; Petteri ; et al.	2020-07-02
SMD package with flat contacts to prevent bottleneck Grant 10,699,987 - Otremba , et al.	2020-06-30
Reinforcement for electrical connectors Grant 10,700,037 - Cho , et al.	2020-06-30
Method of Producing an SMD Package with Top Side Cooling App 20200144150 - Otremba; Ralf ; et al.	2020-05-07
Semiconductor Package and Method of Fabricating a Semiconductor Package App 20200135619 - Dinkel; Markus ; et al.	2020-04-30
Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules Grant 10,601,314 - Palm , et al.	2020-03-24
Method of Manufacturing a Multi-Chip Semiconductor Power Device App 20200083207 - Otremba; Ralf ; et al.	2020-03-12
SMD package with top side cooling Grant 10,566,260 - Otremba , et al. Feb	2020-02-18
Leadframe, Semiconductor Package and Method App 20200051898 - Chiang; Chau Fatt ; et al.	2020-02-13
Reinforcement For Electrical Connectors App 20190148332 - Cho; Eung San ; et al.	2019-05-16
Power Semiconductor Systems Having Inductor Modules, and Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules App 20190081562 - Palm; Petteri ; et al.	2019-03-14
SMD Package with Top Side Cooling App 20190080980 - Otremba; Ralf ; et al.	2019-03-14
Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package Grant 10,224,912 - Otremba , et al.	2019-03-05
Semiconductor chip package having a repeating footprint pattern Grant 10,204,845 - Otremba , et al. Feb	2019-02-12
SMD Package App 20180301398 - Otremba; Ralf ; et al.	2018-10-18
Leadframe and method of manufacturing the same App 20180158758 - OTREMBA; Ralf ; et al.	2018-06-07
Semiconductor component having inner and outer semiconductor component housings Grant 9,991,183 - Hoeglauer , et al. June 5, 2	2018-06-05
Semiconductor Chip Package Having a Repeating Footprint Pattern App 20180061745 - Otremba; Ralf ; et al.	2018-03-01
Chip carrier structure, chip package and method of manufacturing the same Grant 9,824,958 - Otremba , et al. November 21, 2	2017-11-21
Transistor arrangement with semiconductor chips between two substrates Grant 9,806,029 - Otremba , et al. October 31, 2	2017-10-31
Lateral element isolation device Grant 9,786,584 - Otremba , et al. October 10, 2	2017-10-10
Half Bridge Circuit, Method of Operating a Half Bridge Circuit and a Half Bridge Circuit Package App 20170288654 - Otremba; Ralf ; et al.	2017-10-05
Semiconductor housing with rear-side structuring Grant 9,627,292 - Otremba , et al. April 18, 2	2017-04-18
Method of Manufacturing a Multi-Chip Semiconductor Power Device App 20170047315 - Otremba; Ralf ; et al.	2017-02-16
Multi-chip semiconductor power device Grant 9,515,060 - Otremba , et al. December 6, 2	2016-12-06
Device Including a Logic Semiconductor Chip Having a Contact Electrode for Clip Bonding App 20160315033 - Otremba; Ralf ; et al.	2016-10-27
Semiconductor packages having multiple lead frames and methods of formation thereof Grant 9,449,902 - Otremba , et al. September 20, 2	2016-09-20
Chip package and method for manufacturing the same Grant 9,437,548 - Ewe , et al. September 6, 2	2016-09-06
Method for manufacturing a chip arrangement Grant 9,412,626 - Otremba , et al. August 9, 2	2016-08-09
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit Grant 9,397,018 - Otremba , et al. July 19, 2	2016-07-19
Electronic device Grant 9,362,240 - Hosseini , et al. June 7, 2	2016-06-07
Device including two power semiconductor chips and manufacturing thereof Grant 9,331,060 - Otremba , et al. May 3, 2	2016-05-03
Semiconductor Component Having Inner and Outer Semiconductor Component Housings App 20160111346 - Hoeglauer; Josef ; et al.	2016-04-21
Method For Manufacturing A Chip Arrangement App 20160064255 - Otremba; Ralf ; et al.	2016-03-03
Leadframe and method of manufacturing the same App 20160056092 - OTREMBA; Ralf ; et al.	2016-02-25
Power transistor arrangement and package having the same Grant 9,263,440 - Otremba , et al. February 16, 2	2016-02-16
Electronic device and method for fabricating an electronic device Grant 9,230,880 - Otremba , et al. January 5, 2	2016-01-05
Semiconductor Device Package With A Rear Side Metallization Of A Semiconductor Chip Connecting An Internal Node App 20150380348 - Noebauer; Gerhard ; et al.	2015-12-31
Chip arrangements and methods for manufacturing a chip arrangement Grant 9,184,066 - Otremba , et al. November 10, 2	2015-11-10
Semiconductor Device App 20150279782 - Ewe; Henrik ; et al.	2015-10-01
Chip Package And Method For Manufacturing The Same App 20150279783 - Ewe; Henrik ; et al.	2015-10-01
Semiconductor power device having a heat sink Grant 9,147,631 - Otremba , et al. September 29, 2	2015-09-29
Package-in-packages and methods of formation thereof Grant 9,147,628 - Otremba , et al. September 29, 2	2015-09-29
Chip module, an insulation material and a method for fabricating a chip module Grant 9,117,786 - Otremba , et al. August 25, 2	2015-08-25
Power transistor arrangement and method for manufacturing the same Grant 9,099,441 - Otremba , et al. August 4, 2	2015-08-04
Electronic Device and Method for Fabricating an Electronic Device App 20150214133 - Otremba; Ralf ; et al.	2015-07-30
Semiconductor device Grant 9,059,083 - Ewe , et al. June 16, 2	2015-06-16
Chip package and method for manufacturing the same Grant 9,059,155 - Ewe , et al. June 16, 2	2015-06-16
Electronic Device App 20150162287 - Hosseini; Khalil ; et al.	2015-06-11
Device Including Two Power Semiconductor Chips and Manufacturing Thereof App 20150155271 - Otremba; Ralf ; et al.	2015-06-04
Packaged device comprising non-integer lead pitches and method of manufacturing the same Grant 9,035,437 - Otremba , et al. May 19, 2	2015-05-19
Semiconductor device having a clip contact Grant 9,018,744 - Otremba , et al. April 28, 2	2015-04-28
Transistor arrangement with semiconductor chips between two substrates App 20150092375 - Otremba; Ralf ; et al.	2015-04-02
Chip module and a method for manufacturing a chip module Grant 8,987,880 - Hoeglauer , et al. March 24, 2	2015-03-24
Device including two power semiconductor chips and manufacturing thereof Grant 8,975,711 - Otremba , et al. March 10, 2	2015-03-10
Semiconductor device using diffusion soldering Grant 8,975,117 - Otremba , et al. March 10, 2	2015-03-10
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof App 20150060878 - Otremba; Ralf ; et al.	2015-03-05
Chip module and method for fabricating a chip module Grant 8,970,032 - Otremba , et al. March 3, 2	2015-03-03
Semiconductor chip package Grant 8,933,555 - Otremba , et al. January 13, 2	2015-01-13
Semiconductor packages having multiple lead frames and methods of formation thereof Grant 8,896,106 - Otremba , et al. November 25, 2	2014-11-25
Manufacturing electronic device having contact elements with a specified cross section Grant 8,871,630 - Otremba , et al. October 28, 2	2014-10-28
Semiconductor Power Device Having a Heat Sink App 20140312360 - Otremba; Ralf ; et al.	2014-10-23
Chip And Chip Arrangement App 20140306331 - Otremba; Ralf ; et al.	2014-10-16
Package arrangement and a method of manufacturing a package arrangement Grant 8,853,849 - Otremba , et al. October 7, 2	2014-10-07
Chip arrangements, a chip package and a method for manufacturing a chip arrangement Grant 8,853,835 - Otremba , et al. October 7, 2	2014-10-07
Multi-Chip Semiconductor Power Device App 20140284777 - Otremba; Ralf ; et al.	2014-09-25
Packaged Device Comprising Non-Integer Lead Pitches and Method of Manufacturing the Same App 20140264798 - Otremba; Ralf ; et al.	2014-09-18
Chip Package And Method For Manufacturing The Same App 20140264790 - Ewe; Henrik ; et al.	2014-09-18
Electronic module Grant 8,836,113 - Landau , et al. September 16, 2	2014-09-16
Chip Carrier Structure, Chip Package And Method Of Manufacturing The Same App 20140252577 - Otremba; Ralf ; et al.	2014-09-11
Package Arrangement And A Method Of Manufacturing A Package Arrangement App 20140252537 - Otremba; Ralf ; et al.	2014-09-11
Power Transistor Arrangement And Package Having The Same App 20140225124 - Otremba; Ralf ; et al.	2014-08-14
Power Transistor Arrangement And Method For Manufacturing The Same App 20140217596 - Otremba; Ralf ; et al.	2014-08-07
Chip Arrangement, A Method For Manufacturing A Chip Arrangement, Integrated Circuits And A Method For Manufacturing An Integrated Circuit App 20140197552 - Otremba; Ralf ; et al.	2014-07-17
Chip Module, an Insulation Material and a Method for Fabricating a Chip Module App 20140151856 - Otremba; Ralf ; et al.	2014-06-05
Chip Arrangements And Methods For Manufacturing A Chip Arrangement App 20140138803 - Otremba; Ralf ; et al.	2014-05-22
Multi-chip package and method of manufacturing thereof Grant 8,698,293 - Otremba , et al. April 15, 2	2014-04-15
Chip Arrangements, A Chip Package And A Method For Manufacturing A Chip Arrangement App 20140097528 - Otremba; Ralf ; et al.	2014-04-10
Die arrangement and method of forming a die arrangement Grant 8,686,569 - Daeche , et al. April 1, 2	2014-04-01
Semiconductor Device Having a Clip Contact App 20140084433 - Otremba; Ralf ; et al.	2014-03-27
Semiconductor Housing with Rear-Side Structuring App 20140084449 - Otremba; Ralf ; et al.	2014-03-27
Lateral Element Isolation Device App 20140063766 - Otremba; Ralf ; et al.	2014-03-06
Power semiconductor chip having two metal layers on one face Grant 8,643,176 - Otremba , et al. February 4, 2	2014-02-04
Semiconductor module Grant 8,637,341 - Otremba , et al. January 28, 2	2014-01-28
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof App 20140008702 - Otremba; Ralf ; et al.	2014-01-09
Package-In-Packages and Methods of Formation Thereof App 20140001615 - Otremba; Ralf ; et al.	2014-01-02
Die structure, die arrangement and method of processing a die Grant 8,610,274 - Hosseini , et al. December 17, 2	2013-12-17
Multi-Chip Package and Method of Manufacturing Thereof App 20130313712 - Otremba; Ralf ; et al.	2013-11-28
Semiconductor Device Using Diffusion Soldering App 20130200532 - Otremba; Ralf ; et al.	2013-08-08
Semiconductor Device and Fabrication Method App 20130154123 - Poh; Yong Chern ; et al.	2013-06-20
Device Including Two Power Semiconductor Chips and Manufacturing Thereof App 20130146991 - Otremba; Ralf ; et al.	2013-06-13
Power semiconductor device Grant 8,461,645 - Otremba , et al. June 11, 2	2013-06-11
Chip Module and Method for Fabricating a Chip Module App 20130069243 - Otremba; Ralf ; et al.	2013-03-21
Chip Module And A Method For Manufacturing A Chip Module App 20130062722 - Hoeglauer; Josef ; et al.	2013-03-14
Power Semiconductor Chip Having Two Metal Layers on One Face App 20130027113 - Otremba; Ralf ; et al.	2013-01-31
Stacked semiconductor chips with separate encapsulations Grant 8,334,586 - Otremba , et al. December 18, 2	2012-12-18
Electronic Module App 20120306069 - Landau; Stefan ; et al.	2012-12-06
Electronic Device And Manufacturing Thereof App 20120286293 - Otremba; Ralf ; et al.	2012-11-15
Power Semiconductor Device App 20120235227 - Otremba; Ralf ; et al.	2012-09-20
Electronic module Grant 8,253,241 - Landau , et al. August 28, 2	2012-08-28
Electronic device having contact elements with a specified cross section and manufacturing thereof Grant 8,227,908 - Otremba , et al. July 24, 2	2012-07-24
Die Arrangement And Method Of Forming A Die Arrangement App 20120146201 - Daeche; Frank ; et al.	2012-06-14
Semiconductor component and method for producing the same Grant 8,169,063 - Otremba , et al. May 1, 2	2012-05-01
Panel, semiconductor device and method for the production thereof Grant 8,164,173 - Koller , et al. April 24, 2	2012-04-24
Die Structure, Die Arrangement And Method Of Processing A Die App 20120061835 - Hosseini; Khalil ; et al.	2012-03-15
Semiconductor module Grant 8,084,816 - Otremba , et al. December 27, 2	2011-12-27
Stacked Semiconductor Chips App 20110215460 - Otremba; Ralf ; et al.	2011-09-08
Stacked semiconductor chips with separate encapsulations Grant 7,969,018 - Otremba , et al. June 28, 2	2011-06-28
Semiconductor module Grant 7,879,652 - Otremba , et al. February 1, 2	2011-02-01
Multi-chip module Grant 7,872,350 - Otremba , et al. January 18, 2	2011-01-18
Semiconductor device Grant 7,851,908 - Otremba , et al. December 14, 2	2010-12-14
Semiconductor Chip Package App 20100289135 - Otremba; Ralf ; et al.	2010-11-18
Power semiconductor device having lines within a housing Grant 7,821,128 - Ewe , et al. October 26, 2	2010-10-26
Panel, Semiconductor Device and Method for the Production Thereof App 20100264523 - Koller; Adolf ; et al.	2010-10-21
Semiconductor module Grant 7,807,504 - Otremba , et al. October 5, 2	2010-10-05
Panel, semiconductor device and method for the production thereof Grant 7,772,693 - Koller , et al. August 10, 2	2010-08-10
Semiconductor module Grant 7,759,163 - Kroeninger , et al. July 20, 2	2010-07-20
Power semiconductor component, power semiconductor device as well as methods for their production Grant 7,667,326 - Hoeglauer , et al. February 23, 2	2010-02-23
Stacked Semiconductor Chips App 20100013106 - Otremba; Ralf ; et al.	2010-01-21
Electronic Device And Manufacturing Thereof App 20100001291 - Otremba; Ralf ; et al.	2010-01-07
Semiconductor device with front side metallization and method for the production thereof Grant 7,632,759 - Hoeglauer , et al. December 15, 2	2009-12-15
Electrically conductive connection, electronic component and method for their production Grant 7,626,262 - Otremba , et al. December 1, 2	2009-12-01
Electronic Module App 20090289354 - Landau; Stefan ; et al.	2009-11-26
Semiconductor Module App 20090261468 - Kroeninger; Werner ; et al.	2009-10-22
Semiconductor Module App 20090230535 - Otremba; Ralf ; et al.	2009-09-17
Semiconductor device comprising a vertical semiconductor component and method for producing the same Grant 7,589,413 - Otremba , et al. September 15, 2	2009-09-15
Semiconductor Module App 20090181495 - Otremba; Ralf ; et al.	2009-07-16
Semiconductor Component And Method For Producing The Same App 20090179311 - Otremba; Ralf ; et al.	2009-07-16
Semiconductor Module App 20090174056 - Otremba; Ralf ; et al.	2009-07-09
Semiconductor component and method for producing the same Grant 7,528,010 - Otremba , et al. May 5, 2	2009-05-05
Semiconductor Device App 20090072379 - Ewe; Henrik ; et al.	2009-03-19
Semiconductor Module App 20090026601 - Otremba; Ralf ; et al.	2009-01-29
Semiconductor Device App 20090001562 - Otremba; Ralf ; et al.	2009-01-01
Semiconductor Device With Integrated Coils App 20080290992 - Hoeglauer; Josef ; et al.	2008-11-27
Multi-Chip Module App 20080251912 - Otremba; Ralf ; et al.	2008-10-16
Panel, semiconductor device and method for the production thereof App 20080191359 - Koller; Adolf ; et al.	2008-08-14
Semiconductor Component And Method For Producing The Same App 20080012119 - Otremba; Ralf ; et al.	2008-01-17
Electrically Conductive Connection, Electronic Component and Method for Their Production App 20070290337 - Otremba; Ralf ; et al.	2007-12-20
Power Semiconductor Component, Power Semiconductor Device As Well As Methods For Their Production App 20070246838 - Hoeglauer; Josef ; et al.	2007-10-25
Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device App 20070200194 - Graf; Alfons ; et al.	2007-08-30
Semiconductor Device Comprising A Vertical Semiconductor Component And Method For Producing The Same App 20070138634 - Otremba; Ralf ; et al.	2007-06-21
Semiconductor device with front side metallization and method for the production thereof App 20070080391 - Hoeglauer; Josef ; et al.	2007-04-12
Power semiconductor device having lines within a housing App 20070045745 - Ewe; Henrik ; et al.	2007-03-01