| Patent | Date |
|---|
Semiconductor package and method for fabricating a semiconductor package
Grant 11,410,906 - Hoegerl , et al. August 9, 2 | 2022-08-09 |
Sensor devices having a sensor chip and busbar
Grant 11,385,301 - Hoegerl , et al. July 12, 2 | 2022-07-12 |
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
Grant 11,322,451 - Hohlfeld , et al. May 3, 2 | 2022-05-03 |
Fluid-Cooled Package Having Shielding Layer
App 20220115293 - Grassmann; Andreas ; et al. | 2022-04-14 |
Package cooled with cooling fluid and comprising shielding layer
Grant 11,244,886 - Grassmann , et al. February 8, 2 | 2022-02-08 |
Semiconductor package with passive electrical component and method for the production thereof
Grant 11,217,504 - Hoegerl , et al. January 4, 2 | 2022-01-04 |
Semiconductor package having overlapping electrically conductive regions and method for producing the same
Grant 11,018,072 - Hoegerl , et al. May 25, 2 | 2021-05-25 |
Semiconductor package having symmetrically arranged power terminals and method for producing the same
Grant 11,004,764 - Hoegerl , et al. May 11, 2 | 2021-05-11 |
Double Sided Semiconductor Package
App 20210134697 - Hoegerl; Juergen ; et al. | 2021-05-06 |
Semiconductor package having an electromagnetic shielding structure and method for producing the same
Grant 10,985,110 - Hoegerl , et al. April 20, 2 | 2021-04-20 |
Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane
Grant 10,964,642 - Hoegerl , et al. March 30, 2 | 2021-03-30 |
Sensor Devices Having A Sensor Chip And Busbar
App 20210088600 - HOEGERL; Juergen ; et al. | 2021-03-25 |
Sensor Devices With Sensor Chip And Busbar
App 20210063445 - SCHALLER; Rainer Markus ; et al. | 2021-03-04 |
Semiconductor Package and Method for Fabricating a Semiconductor Package
App 20200395266 - Hoegerl; Juergen ; et al. | 2020-12-17 |
Power Semiconductor Module and Method for Fabricating the Same
App 20200321262 - Schweikert; Christian ; et al. | 2020-10-08 |
Power Semiconductor Arrangement and Method for Fabricating a Power Semiconductor Arrangement
App 20200273778 - Hoegerl; Juergen ; et al. | 2020-08-27 |
Semiconductor module with external power sensor
Grant 10,699,976 - Hoegerl , et al. | 2020-06-30 |
Chip module with spatially limited thermally conductive mounting body
Grant 10,679,978 - Roth , et al. | 2020-06-09 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
Grant 10,615,097 - Grassmann , et al. | 2020-04-07 |
Chip carrier configured for delamination-free encapsulation and stable sintering
Grant 10,586,756 - Roth , et al. | 2020-03-10 |
Semiconductor Package Having an Electromagnetic Shielding Structure and Method for Producing the Same
App 20200035616 - Hoegerl; Juergen ; et al. | 2020-01-30 |
Semiconductor Package with Passive Electrical Component and Method for the Production Thereof
App 20200035581 - Hoegerl; Juergen ; et al. | 2020-01-30 |
Semiconductor Package Having Overlapping Electrically Conductive Regions And Method For Producing The Same
App 20200035580 - Hoegerl; Juergen ; et al. | 2020-01-30 |
Semiconductor Package Having Symmetrically Arranged Power Terminals and Method for Producing the Same
App 20200035579 - Hoegerl; Juergen ; et al. | 2020-01-30 |
Laminate package of chip on carrier and in cavity
Grant 10,522,433 - Hoegerl , et al. Dec | 2019-12-31 |
Package with partially encapsulated cooling channel for cooling an encapsulated chip
Grant 10,461,017 - Grassmann , et al. Oc | 2019-10-29 |
Package with roughened encapsulated surface for promoting adhesion
Grant 10,453,771 - Grassmann , et al. Oc | 2019-10-22 |
Cooling Techniques For Semiconductor Package
App 20190318976 - Hoegerl; Juergen ; et al. | 2019-10-17 |
Electronic module comprising a plurality of encapsulation layers and a method for producing it
Grant 10,418,313 - Fuergut , et al. Sept | 2019-09-17 |
Package with roughened encapsulated surface for promoting adhesion
Grant 10410949 - | 2019-09-10 |
Cooling techniques for semiconductor package
Grant 10,373,890 - Hoegerl , et al. | 2019-08-06 |
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power
App 20190221521 - Hohlfeld; Olaf ; et al. | 2019-07-18 |
Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe
Grant 10,304,751 - Grassmann , et al. | 2019-05-28 |
Package with interconnections having different melting temperatures
App 20190157192 - Grassmann; Andreas ; et al. | 2019-05-23 |
Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
Grant 10,242,969 - Hohlfeld , et al. | 2019-03-26 |
Package with interconnections having different melting temperatures
Grant 10,211,133 - Grassmann , et al. Feb | 2019-02-19 |
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
Grant 10,211,158 - Hohlfeld , et al. Feb | 2019-02-19 |
Package with vertically spaced partially encapsulated contact structures
Grant 10,128,165 - Hable , et al. November 13, 2 | 2018-11-13 |
Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
Grant 10,115,646 - Hoegerl , et al. October 30, 2 | 2018-10-30 |
Chip Module With Spatially Limited Thermally Conductive Mounting Body
App 20180301444 - Roth; Alexander ; et al. | 2018-10-18 |
Semiconductor chip having a dense arrangement of contact terminals
Grant 10,090,251 - Ossimitz , et al. October 2, 2 | 2018-10-02 |
Semiconductor chip package comprising laterally extending connectors
Grant 10,079,195 - Hable , et al. September 18, 2 | 2018-09-18 |
Semiconductor Module Comprising Transistor Chips, Diode Chips And Driver Chips Arranged In A Common Plane
App 20180211917 - Hoegerl; Juergen ; et al. | 2018-07-26 |
Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates
Grant 10,002,821 - Hoegerl June 19, 2 | 2018-06-19 |
Method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Grant 9,984,928 - Hohlfeld , et al. May 29, 2 | 2018-05-29 |
Insulated die
Grant 9,978,720 - Theuss , et al. May 22, 2 | 2018-05-22 |
Package with interconnections having different melting temperatures
App 20180138111 - Grassmann; Andreas ; et al. | 2018-05-17 |
Chip assemblage, press pack cell and method for operating a press pack cell
Grant 9,972,596 - Hohlfeld , et al. May 15, 2 | 2018-05-15 |
Package with vertically spaced partially encapsulated contact structures
App 20180122720 - HABLE; Wolfram ; et al. | 2018-05-03 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
App 20180102302 - GRASSMANN; Andreas ; et al. | 2018-04-12 |
Chip carrier configured for delamination-free encapsulation and stable sintering
App 20180096919 - ROTH; Alexander ; et al. | 2018-04-05 |
Package with roughened encapsulated surface for promoting adhesion
App 20180082921 - GRASSMANN; Andreas ; et al. | 2018-03-22 |
Package cooled with cooling fluid and comprising shielding layer
App 20180082925 - GRASSMANN; Andreas ; et al. | 2018-03-22 |
Power semiconductor module and method for producing a power semiconductor module
Grant 9,924,594 - Arens , et al. March 20, 2 | 2018-03-20 |
Package with partially encapsulated cooling channel for cooling an encapsulated chip
App 20180040537 - GRASSMANN; Andreas ; et al. | 2018-02-08 |
Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
Grant 9,818,730 - Beer , et al. November 14, 2 | 2017-11-14 |
Electronic Sub-Module Including a Leadframe and a Semiconductor Chip Disposed on the Leadframe
App 20170316999 - Grassmann; Andreas ; et al. | 2017-11-02 |
Laminate package of chip on carrier and in cavity
App 20170316994 - HOEGERL; Juergen ; et al. | 2017-11-02 |
Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery
Grant 9,748,611 - Elian , et al. August 29, 2 | 2017-08-29 |
Printed circuit board including a leadframe with inserted packaged semiconductor chips
Grant 9,721,863 - Grassmann , et al. August 1, 2 | 2017-08-01 |
Semiconductor Chip Package Comprising Laterally Extending Connectors
App 20170200666 - Hable; Wolfram ; et al. | 2017-07-13 |
Chip card with integrated active components
Grant 9,672,459 - Pueschner , et al. June 6, 2 | 2017-06-06 |
Smart card module arrangement
Grant 9,633,303 - Pueschner , et al. April 25, 2 | 2017-04-25 |
Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
Grant 9,620,459 - Beer , et al. April 11, 2 | 2017-04-11 |
Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement
App 20170098580 - Hohlfeld; Olaf ; et al. | 2017-04-06 |
Spring contact for semiconductor chip
Grant 9,595,502 - Hohlfeld , et al. March 14, 2 | 2017-03-14 |
Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Grant 9,589,859 - Beer , et al. March 7, 2 | 2017-03-07 |
Semiconductor Chip Having a Dense Arrangement of Contact Terminals
App 20170025357 - Ossimitz; Peter ; et al. | 2017-01-26 |
Insulated die
App 20170011982 - THEUSS; Horst ; et al. | 2017-01-12 |
Electronic module and method of manufacturing the same
Grant 9,532,459 - Winter , et al. December 27, 2 | 2016-12-27 |
Semiconductor Arrangement, Semiconductor System And Method Of Forming A Semiconductor Arrangement
App 20160365295 - HOEGERL; Juergen ; et al. | 2016-12-15 |
Semiconductor device having solderable and bondable electrical contact pads
Grant 9,496,237 - Beer , et al. November 15, 2 | 2016-11-15 |
Printed Circuit Board Including a Leadframe with Inserted Packaged Semiconductor Chips
App 20160293524 - Grassmann; Andreas ; et al. | 2016-10-06 |
Microphone Module and Method of Manufacturing Thereof
App 20160167947 - Hoegerl; Juergen ; et al. | 2016-06-16 |
Electronic component with sheet-like redistribution structure
Grant 9,349,709 - Hoegerl , et al. May 24, 2 | 2016-05-24 |
Semiconductor component with moisture barrier for sealing semiconductor body
Grant 9,337,155 - Beer , et al. May 10, 2 | 2016-05-10 |
Semiconductor Arrangement, Method For Producing A Semiconductor Chip
App 20160126211 - Hohlfeld; Olaf ; et al. | 2016-05-05 |
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power Module
App 20160126192 - Hohlfeld; Olaf ; et al. | 2016-05-05 |
Chip Assemblage, Press Pack Cell And Method For Operating A Press Pack Cell
App 20160126212 - Hohlfeld; Olaf ; et al. | 2016-05-05 |
Chip, chip package and die
Grant 9,331,059 - Allinger , et al. May 3, 2 | 2016-05-03 |
Electronic Module Comprising a Plurality of Encapsulation Layers and a Method for Producing It
App 20160099207 - Fuergut; Edward ; et al. | 2016-04-07 |
Chip Card With Integrated Active Components
App 20160004947 - Pueschner; Frank ; et al. | 2016-01-07 |
Chip arrangement and a method for manufacturing a chip arrangement
Grant 9,224,695 - Pueschner , et al. December 29, 2 | 2015-12-29 |
Semiconductor package comprising two semiconductor modules and laterally extending connectors
Grant 9,196,510 - Hohlfeld , et al. November 24, 2 | 2015-11-24 |
Semiconductor Device Having Solderable and Bondable Electrical Contact Pads
App 20150333023 - Beer; Gottfried ; et al. | 2015-11-19 |
Secure epass booklet based on double chip technology
Grant 9,177,181 - Hoegerl , et al. November 3, 2 | 2015-11-03 |
Smart card module for a smart card
Grant 9,141,902 - Pueschner , et al. September 22, 2 | 2015-09-22 |
Smart card module, smart card and method for producing a smart card module
Grant 9,135,549 - Hoegerl , et al. September 15, 2 | 2015-09-15 |
Smart card module and method for producing a smart card module
Grant 9,070,067 - Hoegerl , et al. June 30, 2 | 2015-06-30 |
Semiconductor module and a method for fabrication thereof by extended embedding technologies
Grant 9,064,869 - Hoegerl , et al. June 23, 2 | 2015-06-23 |
Chip, Chip Package And Die
App 20150162318 - Allinger; Robert ; et al. | 2015-06-11 |
Electronic component with sheet-like redistribution structure
App 20150155267 - HOEGERL; Juergen ; et al. | 2015-06-04 |
Electronic component with electronic chip between redistribution structure and mounting structure
App 20150145111 - MENGEL; Manfred ; et al. | 2015-05-28 |
Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same
App 20150130071 - Hohlfeld; Olaf ; et al. | 2015-05-14 |
Semiconductor Package Comprising Two Semiconductor Modules and Laterally Extending Connectors
App 20150130048 - Hohlfeld; Olaf ; et al. | 2015-05-14 |
Power Semiconductor Module and Method for Producing a Power Semiconductor Module
App 20150092376 - Arens; Andre ; et al. | 2015-04-02 |
Chip card module
Grant 8,991,711 - Pueschner , et al. March 31, 2 | 2015-03-31 |
Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
App 20150061100 - Beer; Gottfried ; et al. | 2015-03-05 |
Semiconductor Arrangement, Method for Producing a Semiconductor Module, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
App 20150061144 - Beer; Gottfried ; et al. | 2015-03-05 |
Semiconductor Module and a Method for Fabrication Thereof By Extended Embedding Technologies
App 20150054159 - Hoegerl; Juergen ; et al. | 2015-02-26 |
Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement
App 20150054166 - Beer; Gottfried ; et al. | 2015-02-26 |
Electronic module and method of manufacturing the same
App 20150043169 - WINTER; Frank ; et al. | 2015-02-12 |
Apparatus For Determining A State Of A Rechargeable Battery Or Of A Battery, A Rechargeable Battery Or A Battery, And A Method For Determining A State Of A Rechargeable Battery Or Of A Battery
App 20150004451 - Elian; Klaus ; et al. | 2015-01-01 |
Smart Card Module and Method for Producing a Smart Card Module
App 20140353387 - Hoegerl; Juergen ; et al. | 2014-12-04 |
Smart Card Module, Smart Card And Method For Producing A Smart Card Module
App 20140353384 - HOEGERL; Juergen ; et al. | 2014-12-04 |
Chip Arrangement, Chip Card Arrangement And Method For Manufacturing A Chip Arrangement
App 20140328032 - Pueschner; Frank ; et al. | 2014-11-06 |
Microphone Module and Method of Manufacturing Thereof
App 20140312439 - Hoegerl; Juergen ; et al. | 2014-10-23 |
Semiconductor Component, Semiconductor Module and Methods for Producing a Semiconductor Component and a Semiconductor Module
App 20140284624 - Beer; Gottfried ; et al. | 2014-09-25 |
Smart Card Module Arrangement
App 20140263663 - Pueschner; Frank ; et al. | 2014-09-18 |
Chip Arrangement And A Method For Manufacturing A Chip Arrangement
App 20140239428 - Pueschner; Frank ; et al. | 2014-08-28 |
Chip Arrangement And A Method For Manufacturing A Chip Arrangement
App 20140239474 - Pueschner; Frank ; et al. | 2014-08-28 |
Data carrier for contactless data transmission and a method for producing such a data carrier
Grant 8,724,340 - Hoegerl , et al. May 13, 2 | 2014-05-13 |
Semiconductor Housing for Smart Cards
App 20140091450 - Pueschner; Frank ; et al. | 2014-04-03 |
Cover structure with integrated chip and antenna
Grant 8,684,273 - Scherl , et al. April 1, 2 | 2014-04-01 |
Chip Card Module With Separate Antenna And Chip Card Inlay Using Same
App 20140042230 - Pueschner; Frank ; et al. | 2014-02-13 |
Chip Card Module
App 20140021264 - PUESCHNER; Frank ; et al. | 2014-01-23 |
Secure Epass Booklet Based On Double Chip Technology
App 20130278378 - Hoegerl; Juergen ; et al. | 2013-10-24 |
Molding Apparatus and a Method for Molding
App 20130161867 - Fuergut; Edward ; et al. | 2013-06-27 |
Smart Card Module for a Smart Card
App 20130082112 - Pueschner; Frank ; et al. | 2013-04-04 |
Cover Structure With Integrated Chip And Antenna
App 20130075478 - Scherl; Peter ; et al. | 2013-03-28 |
Data Carrier For Contactless Data Transmission And A Method For Producing Such A Data Carrier
App 20120188736 - HOEGERL; Juergen ; et al. | 2012-07-26 |
Semiconductor component with surface mountable devices and method for producing the same
Grant 8,071,433 - Syri , et al. December 6, 2 | 2011-12-06 |
Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape
Grant 8,026,618 - Syri , et al. September 27, 2 | 2011-09-27 |
Semiconductor device
Grant 7,998,797 - Killer , et al. August 16, 2 | 2011-08-16 |
Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same
Grant 7,945,231 - Hoegerl , et al. May 17, 2 | 2011-05-17 |
Semiconductor Component with Surface Mountable Devices and Method for Producing the Same
App 20100323479 - Syri; Erich ; et al. | 2010-12-23 |
Semiconductor module including semiconductor chips in a plastic housing in separate regions
Grant 7,825,506 - Syri , et al. November 2, 2 | 2010-11-02 |
Semiconductor component with surface mountable devices and method for producing the same
Grant 7,804,178 - Syri , et al. September 28, 2 | 2010-09-28 |
Semiconductor Device
App 20100140785 - Killer; Thomas ; et al. | 2010-06-10 |
Cooling system for devices having power semiconductors and method for cooling the device
Grant 7,688,592 - Gruendler , et al. March 30, 2 | 2010-03-30 |
Semiconductor Module Including Semiconductor Chips In A Plastic Housing In Separate Regions
App 20090057874 - Syri; Erich ; et al. | 2009-03-05 |
Semiconductor Device Comprising A Plastic Housing, A Semiconductor Chip and an Interposer, and Method For Producing the Same
App 20080150124 - Syri; Erich ; et al. | 2008-06-26 |
Heat sink for surface-mounted semiconductor devices and mounting method
Grant 7,355,858 - Gruendler , et al. April 8, 2 | 2008-04-08 |
Method and device for packaging and transporting electronic components
Grant 7,318,307 - Hoegerl , et al. January 15, 2 | 2008-01-15 |
Cooling System For Device Having Power Semiconductors And Method For Cooling The Device
App 20070285895 - Gruendler; Gerold ; et al. | 2007-12-13 |
Semiconductor Component with Surface Mountable Devices and Method for Producing the Same
App 20070262433 - Syri; Erich ; et al. | 2007-11-15 |
Semiconductor Device for an Ultra Wideband Standard for Ultra-High-Frequency Communication, and Method for Producing the Same
App 20070200748 - Hoegerl; Juergen ; et al. | 2007-08-30 |
Heat sink for surface-mounted semiconductor devices and mounting method
App 20060209513 - Gruendler; Gerold ; et al. | 2006-09-21 |
Method and device for packaging and transporting electronic components
App 20060011508 - Hoegerl; Juergen ; et al. | 2006-01-19 |
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