Hoefer; Holger
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hoefer; Holger.The latest application filed is for "method for producing a micromechanical device having a damper structure".
- Hoefer; Holger - Juelich DE
- Hoefer; Holger - Sonnenbuehl DE
| Patent | Date |
|---|---|
| Method For Producing A Micromechanical Device Having A Damper Structure App 20210179422 - Hoefer; Holger ; et al. | 2021-06-17 |
| Sensor and/or sound detection device and manufacturing method for a sensor and/or sound detection device Grant 10,684,185 - Haug , et al. | 2020-06-16 |
| Method for producing thin MEMS chips on SOI substrate and micromechanical component Grant 10,584,029 - Reinmuth , et al. | 2020-03-10 |
| Method For Producing Thin Mems Chips On Soi Substrate And Micromechanical Component App 20190039885 - Reinmuth; Jochen ; et al. | 2019-02-07 |
| Sensor And/or Sound Detection Device And Manufacturing Method For A Sensor And/or Sound Detection Device App 20180372573 - Haug; Daniel ; et al. | 2018-12-27 |
| Damping device for a micromechanical sensor device Grant 9,222,955 - Hoefer , et al. December 29, 2 | 2015-12-29 |
| Solder joint inspection Grant 8,810,252 - Ochs , et al. August 19, 2 | 2014-08-19 |
| Sensor system Grant 8,671,752 - Hoefer , et al. March 18, 2 | 2014-03-18 |
| Damping Device For A Micromechanical Sensor Device App 20130199295 - HOEFER; Holger ; et al. | 2013-08-08 |
| Method for sealing an opening Grant 8,304,845 - Bischof , et al. November 6, 2 | 2012-11-06 |
| Solder Joint Inspection App 20120025863 - Ochs; Eric ; et al. | 2012-02-02 |
| Sensor system App 20110203369 - Hoefer; Holger ; et al. | 2011-08-25 |
| Devices And Method For Manufacturing A Device App 20110049505 - Grabowski; Johannes ; et al. | 2011-03-03 |
| Microstructured sensor Grant 7,564,033 - Reichenbach , et al. July 21, 2 | 2009-07-21 |
| Method for Sealing an Opening App 20090174148 - Bischof; Udo ; et al. | 2009-07-09 |
| Micromechanical Structure Having A Substrate And A Thermoelement, Temperature Sensor And/or Radiation Sensor, And Method For Manufacturing A Micromechanical Structure App 20090168836 - Hoefer; Holger ; et al. | 2009-07-02 |
| Microstructured Infrared Sensor App 20080061237 - Franz; Jochen ; et al. | 2008-03-13 |
| Microstructured Sensor App 20080053254 - Reichenbach; Frank ; et al. | 2008-03-06 |
| Ceramic substrate and method of manufacturing same Grant 6,974,515 - Neubert , et al. December 13, 2 | 2005-12-13 |
| Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device App 20050118742 - Henning, Frank ; et al. | 2005-06-02 |
| Ceramic substrate and method of manufacturing same App 20050074638 - Neubert, Anja ; et al. | 2005-04-07 |
| Method for processing substrates Grant 6,620,735 - Pinter , et al. September 16, 2 | 2003-09-16 |
| Method for processing substrates App 20020061653 - Pinter, Stefan ; et al. | 2002-05-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 