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name:-0.0046060085296631
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Hoechbauer; Tobias Franz Wolfgang Patent Filings

Hoechbauer; Tobias Franz Wolfgang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoechbauer; Tobias Franz Wolfgang.The latest application filed is for "methods for processing a semiconductor substrate".

Company Profile
7.3.6
  • Hoechbauer; Tobias Franz Wolfgang - Villach AT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate
Grant 11,373,863 - Rupp , et al. June 28, 2
2022-06-28
Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers
Grant 11,107,732 - Santos Rodriguez , et al. August 31, 2
2021-08-31
Methods For Processing A Semiconductor Substrate
App 20210159115 - SCHUSTEREDER; Werner ;   et al.
2021-05-27
Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device
Grant 10,903,078 - Schulze , et al. January 26, 2
2021-01-26
Method of Manufacturing a Silicon Carbide Device and Wafer Composite Including Laser Modified Zones in a Handle Substrate
App 20200357637 - Rupp; Roland ;   et al.
2020-11-12
Semiconductor Device With A Porous Portion, Wafer Composite And Method Of Manufacturing A Semiconductor Device
App 20200286730 - MODER; Iris ;   et al.
2020-09-10
Carrier, Laminate And Method Of Manufacturing Semiconductor Devices
App 20200068709 - SCHULZE; Hans-Joachim ;   et al.
2020-02-27
Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbide Semiconductor Device
App 20190362972 - Schulze; Hans-Joachim ;   et al.
2019-11-28
Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods for Forming a Plurality of Thin Wide Band Gap Semiconductor
App 20190348328 - Santos Rodriguez; Francisco Javier ;   et al.
2019-11-14

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