Hoebener; Karl Grant
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hoebener; Karl Grant.The latest application filed is for "solder ball connections and assembly process".
- Hoebener; Karl Grant - Georgetown TX
| Patent | Date |
|---|---|
| Solder ball connections and assembly process Grant 6,504,105 - Acocella , et al. January 7, 2 | 2003-01-07 |
| Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment Grant 5,825,629 - Hoebener , et al. October 20, 1 | 1998-10-20 |
| Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias Grant 5,758,413 - Chong , et al. June 2, 1 | 1998-06-02 |
| Fine dimension stacked vias for a multiple layer circuit board structure Grant 5,699,613 - Chong , et al. December 23, 1 | 1997-12-23 |
| Solder ball connections and assembly process Grant 5,675,889 - Acocella , et al. October 14, 1 | 1997-10-14 |
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