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Patent applications and USPTO patent grants for Hoebener; Karl G..The latest application filed is for "method for forming bumps on a substrate".
Patent | Date |
---|---|
Method for forming bumps on a substrate Grant 5,762,259 - Hubacher , et al. June 9, 1 | 1998-06-09 |
Solder ball interconnected assembly Grant 5,591,941 - Acocella , et al. January 7, 1 | 1997-01-07 |
Fine pitch solder deposits on printed circuit board process and product Grant 5,492,266 - Hoebener , et al. February 20, 1 | 1996-02-20 |
Interconnection structure and test method Grant 5,147,084 - Behun , et al. September 15, 1 | 1992-09-15 |
Interconnection structure and test method Grant 5,060,844 - Behun , et al. October 29, 1 | 1991-10-29 |
Method of attaching electronic components Grant 4,998,342 - Bonnell , et al. March 12, 1 | 1991-03-12 |
Solder deposition control Grant 4,919,970 - Hoebener , et al. April 24, 1 | 1990-04-24 |
Single step solder process Grant 4,761,881 - Bora , et al. August 9, 1 | 1988-08-09 |
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