Hodge; Robin H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hodge; Robin H..The latest application filed is for "package integrated circuit having thermal enhancement and reduced footprint size".
- Hodge; Robin H. - Portola Valley CA
- Hodge; Robin H. - Menlo Park CA
| Patent | Date |
|---|---|
| Package integrated circuit having thermal enhancement and reduced footprint size Grant 5,874,321 - Templeton, Jr. , et al. February 23, 1 | 1999-02-23 |
| Packaged integrated circuit having thermal enhancement and reduced footprint size Grant 5,766,975 - Templeton, Jr. , et al. June 16, 1 | 1998-06-16 |
| Electrically tested and burned-in semiconductor die and method for producing same Grant 5,448,165 - Hodge , et al. September 5, 1 | 1995-09-05 |
| Thermally balanced leadless microelectronic circuit chip carrier Grant 4,420,767 - Hodge , et al. December 13, 1 | 1983-12-13 |
| Integrated circuit package utilizing novel heat sink structure Grant 3,930,114 - Hodge December 30, 1 | 1975-12-30 |
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