Hoang; John

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoang; John.The latest application filed is for "conformal damage-free encapsulation of chalcogenide materials".

Company Profile

3.7.12

Hoang; John - Fremont CA
Hoang; John - Anaheim CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conformal Damage-free Encapsulation Of Chalcogenide Materials App 20220115592 - Sims; James Samuel ; et al.	2022-04-14
Film Stack Simplification For High Aspect Ratio Patterning And Vertical Scaling App 20220051938 - Wu; Hui-Jung ; et al.	2022-02-17
Conformal damage-free encapsulation of chalcogenide materials Grant 11,239,420 - Sims , et al. February 1, 2	2022-02-01
Automated Robotic System And Method For Sanitization And Disinfection App 20220001061 - Hoang; Sherylinn ; et al.	2022-01-06
Self-aligned Vertical Integration Of Three-terminal Memory Devices App 20210391355 - LILL; Thorsten ; et al.	2021-12-16
Cobalt etch back Grant 10,784,086 - Yang , et al. Sept	2020-09-22
Conformal Damage-free Encapsulation Of Chalcogenide Materials App 20200066987 - Sims; James Samuel ; et al.	2020-02-27
Liner and barrier applications for subtractive metal integration Grant 10,199,235 - Wu , et al. Fe	2019-02-05
Liner And Barrier Applications For Subtractive Metal Integration App 20180211846 - Wu; Hui-Jung ; et al.	2018-07-26
Cobalt Etch Back App 20180102236 - Yang; Jialing ; et al.	2018-04-12
Liner and barrier applications for subtractive metal integration Grant 9,899,234 - Wu , et al. February 20, 2	2018-02-20
Cobalt etch back Grant 9,870,899 - Yang , et al. January 16, 2	2018-01-16
Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber Grant 9,589,853 - Titus , et al. March 7, 2	2017-03-07
Method to etch copper barrier film Grant 9,570,320 - Shen , et al. February 14, 2	2017-02-14
Cobalt Etch Back App 20160314985 - Yang; Jialing ; et al.	2016-10-27
Novel Method To Etch Copper Barrier Film App 20160104630 - SHEN; Meihua ; et al.	2016-04-14
Liner And Barrier Applications For Subtractive Metal Integration App 20150380272 - Wu; Hui-Jung ; et al.	2015-12-31
Method Of Planarizing An Upper Surface Of A Semiconductor Substrate In A Plasma Etch Chamber App 20150249016 - Titus; Monica ; et al.	2015-09-03

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