HOANG; Dinhphuoc V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for HOANG; Dinhphuoc V..The latest application filed is for "methods related to fabrication of shielded radio-frequency module".

Company Profile

0.12.9

HOANG; Dinhphuoc V. - Anaheim CA
Hoang; Dinhphuoc V. - Stanton CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods Related To Fabrication Of Shielded Radio-frequency Module App 20150255403 - HOANG; Dinhphuoc V. ; et al.	2015-09-10
Packaged Radio-frequency Module Having Wirebond Shielding App 20150255402 - HOANG; Dinhphuoc V. ; et al.	2015-09-10
Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding Grant 9,054,115 - Hoang , et al. June 9, 2	2015-06-09
Overmolded semiconductor package with wirebonds for electromagnetic shielding Grant 9,041,168 - Hoang , et al. May 26, 2	2015-05-26
Reducing coupling coefficient variation by using angled connecting traces Grant 8,941,449 - Li , et al. January 27, 2	2015-01-27
Reducing coupling coefficient variation by using capacitors Grant 8,928,426 - Li , et al. January 6, 2	2015-01-06
Reducing coupling coefficient variation using intended width mismatch Grant 8,928,427 - Li , et al. January 6, 2	2015-01-06
Overmolded semiconductor package with a wirebond cage for EMI shielding Grant 8,399,972 - Hoang , et al. March 19, 2	2013-03-19
Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding App 20120146178 - Hoang; Dinhphuoc V. ; et al.	2012-06-14
Methods For Fabricating An Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding App 20120137514 - Hoang; Dinhphuoc V. ; et al.	2012-06-07
Reducing Coupling Coefficient Variation By Using Angled Connecting Traces App 20120038433 - Li; Yang ; et al.	2012-02-16
Reducing Coupling Coefficient Variation Using Intended Width Mismatch App 20120038436 - Li; Yang ; et al.	2012-02-16
Reducing Coupling Coefficient Variation By Using Capacitors App 20120032735 - Li; Yang ; et al.	2012-02-09
Self Compensated Directional Coupler App 20120019335 - Hoang; Dinhphuoc V. ; et al.	2012-01-26
Overmolded semiconductor package with a wirebond cage for EMI shielding App 20070241440 - Hoang; Dinhphuoc V. ; et al.	2007-10-18

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