HO; Ying Ying

Patent Applications and Registrations

Patent applications and USPTO patent grants for HO; Ying Ying.The latest application filed is for "encapsulants to retain wires at bond pads".

Company Profile

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HO; Ying Ying - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Encapsulants To Retain Wires At Bond Pads App 20170182786 - Angulo Navarro; Emilio ; et al.	2017-06-29

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