| Patent | Date |
|---|
Chip package and manufacturing method thereof
Grant 11,038,077 - Ho , et al. June 15, 2 | 2021-06-15 |
Manufacturing Method Of Chip Package
App 20210066379 - HO; Yen-Shih ; et al. | 2021-03-04 |
Semiconductor structure and method for manufacturing semiconductor structure
Grant 10,461,117 - Ho , et al. Oc | 2019-10-29 |
Chip package and method for forming the same
Grant 10,424,540 - Ho , et al. Sept | 2019-09-24 |
Chip Package And Manufacturing Method Thereof
App 20190273175 - HO; Yen-Shih ; et al. | 2019-09-05 |
Wafer coating system and method of manufacturing chip package
Grant 10,388,541 - Chen , et al. A | 2019-08-20 |
Touch panel-sensing chip package module complex and a manufacturing method thereof
Grant 10,318,784 - Chang , et al. | 2019-06-11 |
Chip Package And Manufacturing Method Thereof
App 20180358398 - HO; Yen-Shih ; et al. | 2018-12-13 |
Chip scale sensing chip package and a manufacturing method thereof
Grant 10,152,180 - Chang , et al. Dec | 2018-12-11 |
Chip package and method for forming the same
Grant 10,153,237 - Ho , et al. Dec | 2018-12-11 |
Electronic device package and fabrication method thereof
Grant 10,109,559 - Lin , et al. October 23, 2 | 2018-10-23 |
Semiconductor structure and manufacturing method thereof
Grant 10,096,635 - Chien , et al. October 9, 2 | 2018-10-09 |
Chip package and method for forming the same
Grant 10,050,006 - Shen , et al. August 14, 2 | 2018-08-14 |
Chip package and fabrication method thereof
Grant 10,049,252 - Ho , et al. August 14, 2 | 2018-08-14 |
Semiconductor Structure And Method For Manufacturing Semiconductor Structure
App 20180175101 - Ho; Yen-Shih ; et al. | 2018-06-21 |
Chip package and method for forming the same
Grant 9,997,473 - Ho , et al. June 12, 2 | 2018-06-12 |
Photosensitive module and method for forming the same
Grant 9,978,788 - Ho , et al. May 22, 2 | 2018-05-22 |
Chip package and manufacturing method thereof
Grant 9,947,716 - Ho , et al. April 17, 2 | 2018-04-17 |
Chip Package And Method For Forming The Same
App 20180102321 - HO; Yen-Shih ; et al. | 2018-04-12 |
Sensing chip package and a manufacturing method thereof
Grant 9,887,229 - Ho , et al. February 6, 2 | 2018-02-06 |
Chip package and method for fabricating the same
Grant 9,881,889 - Huang , et al. January 30, 2 | 2018-01-30 |
Chip package and manufacturing method thereof
Grant 9,875,912 - Ho , et al. January 23, 2 | 2018-01-23 |
Chip package and manufacturing method thereof
Grant 9,793,234 - Ho , et al. October 17, 2 | 2017-10-17 |
Semiconductor structure and manufacturing method thereof
Grant 9,780,251 - Suen , et al. October 3, 2 | 2017-10-03 |
Chip Package And Method For Forming The Same
App 20170271276 - HO; Yen-Shih ; et al. | 2017-09-21 |
Passive component structure and manufacturing method thereof
Grant 9,761,555 - Lai , et al. September 12, 2 | 2017-09-12 |
Chip Package And Method For Forming The Same
App 20170213805 - SHEN; Chia-Lun ; et al. | 2017-07-27 |
Chip Package And Method For Forming The Same
App 20170207182 - HO; Yen-Shih ; et al. | 2017-07-20 |
Method for forming chip package
Grant 9,711,403 - Chen , et al. July 18, 2 | 2017-07-18 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170179330 - SUEN; Wei-Luen ; et al. | 2017-06-22 |
Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus
Grant 9,685,354 - Ho , et al. June 20, 2 | 2017-06-20 |
Chip Package And Manufacturing Method Thereof
App 20170148694 - HO; Yen-Shih ; et al. | 2017-05-25 |
Chip Package And Manufacturing Method Thereof
App 20170148752 - HO; Yen-Shih ; et al. | 2017-05-25 |
Chip Package And Manufacturing Method Thereof
App 20170148844 - HO; Yen-Shih ; et al. | 2017-05-25 |
Chip package and method for forming the same
Grant 9,653,422 - Shen , et al. May 16, 2 | 2017-05-16 |
Electrical contact structure with a redistribution layer connected to a stud
Grant 9,640,683 - Suen , et al. May 2, 2 | 2017-05-02 |
Chip package and method for forming the same
Grant 9,640,488 - Lin , et al. May 2, 2 | 2017-05-02 |
Chip Package And Method For Forming The Same
App 20170117242 - HO; Yen-Shih ; et al. | 2017-04-27 |
Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
Grant 9,633,935 - Ho , et al. April 25, 2 | 2017-04-25 |
Chip Package And Manufacturing Method Thereof
App 20170110495 - WU; Jyun-Liang ; et al. | 2017-04-20 |
Method for forming chip package
Grant 9,611,143 - Ho , et al. April 4, 2 | 2017-04-04 |
Semiconductor structure and manufacturing method thereof
Grant 9,613,904 - Chen , et al. April 4, 2 | 2017-04-04 |
Chip package including recess in side edge
Grant 9,601,460 - Ho , et al. March 21, 2 | 2017-03-21 |
Chip package and method for forming the same
Grant 9,570,398 - Chang , et al. February 14, 2 | 2017-02-14 |
Sensing Chip Package And A Manufacturing Method Thereof
App 20170040372 - HO; Yen-Shih ; et al. | 2017-02-09 |
Chip package and manufacturing method thereof
Grant 9,548,265 - Ho , et al. January 17, 2 | 2017-01-17 |
Chip Package And Manufacturing Method Thereof
App 20170012081 - SHEN; Chia-Lun ; et al. | 2017-01-12 |
Touch Panel-sensing Chip Package Module Complex And A Manufacturing Method Thereof
App 20160379040 - CHANG; Shu-Ming ; et al. | 2016-12-29 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160329283 - CHEN; Yu-Tung ; et al. | 2016-11-10 |
Semiconductor Electroplating System
App 20160315048 - HO; Yen-Shih ; et al. | 2016-10-27 |
Chip Package And Manufacturing Method Thereof
App 20160315061 - HO; Yen-Shih ; et al. | 2016-10-27 |
Chip Package And Manufacturing Method Thereof
App 20160315043 - HO; Yen-Shih ; et al. | 2016-10-27 |
Wafer Coating System And Method Of Manufacturing Chip Package
App 20160307779 - CHEN; Yu-Tung ; et al. | 2016-10-20 |
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof
App 20160284751 - HO; Yen-Shih ; et al. | 2016-09-29 |
Manufacturing method of semiconductor structure
Grant 9,450,015 - Chien , et al. September 20, 2 | 2016-09-20 |
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof
App 20160266680 - CHANG; Shu-Ming ; et al. | 2016-09-15 |
Chip package and method for forming the same
Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
Chip package
Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof
App 20160239699 - CHANG; Shu-Ming ; et al. | 2016-08-18 |
Chip Package And Manufacturing Method Thereof
App 20160240520 - Ho; Yen-Shih ; et al. | 2016-08-18 |
Manufacturing method of semiconductor structure with protein tape
Grant 9,419,050 - Ho , et al. August 16, 2 | 2016-08-16 |
Chip package and manufacturing method thereof
Grant 9,406,590 - Lin , et al. August 2, 2 | 2016-08-02 |
Photosensitive Module And Method For Forming The Same
App 20160218133 - HO; Yen-Shih ; et al. | 2016-07-28 |
Manufacturing Method Of Semiconductor Structure
App 20160218140 - CHIEN; Wei-Ming ; et al. | 2016-07-28 |
Chip package and method thereof
Grant 9,373,597 - Ho , et al. June 21, 2 | 2016-06-21 |
Chip Package And Fabrication Method Thereof
App 20160171273 - HO; Yen-Shih ; et al. | 2016-06-16 |
Chip package and method for forming the same
Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
Chip Package And Method For Forming The Same
App 20160141254 - LIN; Yi-Min ; et al. | 2016-05-19 |
Chip package and method for forming the same
Grant 9,334,158 - Huang , et al. May 10, 2 | 2016-05-10 |
Chip package and method thereof
Grant 9,334,156 - Lin , et al. May 10, 2 | 2016-05-10 |
Semiconductor structure with sensor chip and landing pads
Grant 9,331,256 - Chien , et al. May 3, 2 | 2016-05-03 |
IC wafer having electromagnetic shielding effects and method for making the same
Grant 9,331,024 - Chen , et al. May 3, 2 | 2016-05-03 |
Chip package and method for forming the same
Grant 9,305,843 - Chen , et al. April 5, 2 | 2016-04-05 |
Semiconductor chip package and method for manufacturing thereof
Grant 9,287,417 - Suen , et al. March 15, 2 | 2016-03-15 |
Semiconductor structure having stage difference surface and manufacturing method thereof
Grant 9,275,963 - Tsai , et al. March 1, 2 | 2016-03-01 |
Chip package and method for forming the same
Grant 9,275,958 - Lin , et al. March 1, 2 | 2016-03-01 |
Chip Package And Method Thereof
App 20160039662 - LIN; Chien-Min ; et al. | 2016-02-11 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160043123 - CHIEN; Wei-Ming ; et al. | 2016-02-11 |
Chip package
Grant 9,236,320 - Chang , et al. January 12, 2 | 2016-01-12 |
Chip Package And Method For Forming The Same
App 20160005787 - HO; Yen-Shih ; et al. | 2016-01-07 |
Electrical contact structure with a redistribution layer connected to a stud
Grant 9,214,579 - Chien , et al. December 15, 2 | 2015-12-15 |
Manufacturing Method Of Semiconductor Structure
App 20150340403 - HO; Yen-Shih ; et al. | 2015-11-26 |
Semiconductor stack structure and fabrication method thereof
Grant 9,177,862 - Ho , et al. November 3, 2 | 2015-11-03 |
Stacked Chip Package And Method For Forming The Same
App 20150311175 - HO; Yen-Shih ; et al. | 2015-10-29 |
Chip package comprising alignment mark and method for forming the same
Grant 9,165,890 - Ho , et al. October 20, 2 | 2015-10-20 |
Method For Forming Chip Package
App 20150284244 - HO; Yen-Shih ; et al. | 2015-10-08 |
Separation Apparatus And A Method For Separating A Cap Layer From A Chip Package By Means Of The Separation Apparatus
App 20150287619 - HO; Yen-Shih ; et al. | 2015-10-08 |
Chip package and method for forming the same
Grant 9,153,528 - Lin , et al. October 6, 2 | 2015-10-06 |
Chip package and method for forming the same
Grant 9,153,707 - Ho , et al. October 6, 2 | 2015-10-06 |
Chip Package And Method For Forming The Same
App 20150279808 - SHEN; Chia-Lun ; et al. | 2015-10-01 |
Chip Package And Method Thereof
App 20150270236 - HO; Yen-Shih ; et al. | 2015-09-24 |
Chip package and manufacturing method thereof
Grant 9,136,241 - Yen , et al. September 15, 2 | 2015-09-15 |
Chip Package And Method For Forming The Same
App 20150228536 - HO; Yen-Shih ; et al. | 2015-08-13 |
Passive Component Structure And Manufacturing Method Thereof
App 20150214162 - LAI; Jiun-Yen ; et al. | 2015-07-30 |
Semiconductor Device And Manufacturing Method Thereof
App 20150206916 - LEE; Po-Han ; et al. | 2015-07-23 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150179831 - SUEN; Wei-Luen ; et al. | 2015-06-25 |
Chip Package And Method For Forming The Same
App 20150162245 - CHEN; Bing-Siang ; et al. | 2015-06-11 |
Chip package structure and manufacturing method thereof
Grant 9,054,114 - Lee , et al. June 9, 2 | 2015-06-09 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150123231 - CHIEN; Wei-Ming ; et al. | 2015-05-07 |
Chip package and method for forming the same
Grant 9,024,437 - Yen , et al. May 5, 2 | 2015-05-05 |
Chip Package And Method For Fabricating The Same
App 20150097286 - SUEN; Wei-Luen ; et al. | 2015-04-09 |
Chip package structure and method for forming the same
Grant 8,981,497 - Yiu , et al. March 17, 2 | 2015-03-17 |
Chip package
Grant 8,975,755 - Ho , et al. March 10, 2 | 2015-03-10 |
Electronic Device Package And Fabrication Method Thereof
App 20150061102 - LIN; Chia-Sheng ; et al. | 2015-03-05 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150054002 - CHIEN; Wei-Ming ; et al. | 2015-02-26 |
Stacked chip package and method for forming the same
Grant 8,963,312 - Ho , et al. February 24, 2 | 2015-02-24 |
Semiconductor package and fabrication method thereof
Grant 8,928,098 - Lee , et al. January 6, 2 | 2015-01-06 |
Chip Package
App 20150001710 - CHANG; Yi-Ming ; et al. | 2015-01-01 |
Chip package and method for forming the same
Grant 8,900,924 - Chang , et al. December 2, 2 | 2014-12-02 |
Stacked Chip Package And Method For Forming The Same
App 20140332983 - HO; Yen-Shih ; et al. | 2014-11-13 |
Chip Package And Method For Forming The Same
App 20140332969 - HO; Yen-Shih ; et al. | 2014-11-13 |
Chip Package
App 20140332968 - HO; Yen-Shih ; et al. | 2014-11-13 |
Chip Package And Method For Forming The Same
App 20140332908 - HO; Yen-Shih ; et al. | 2014-11-13 |
Chip Package And Manufacturing Method Thereof
App 20140312478 - LIN; Chia-Sheng ; et al. | 2014-10-23 |
Chip Package And Method For Fabricating The Same
App 20140306343 - HUANG; Yu-Lung ; et al. | 2014-10-16 |
Chip Package And Method For Forming The Same
App 20140264785 - LIN; Yi-Min ; et al. | 2014-09-18 |
Chip Package Structure And Manufacturing Method Thereof
App 20140264771 - LEE; Hung-Jen ; et al. | 2014-09-18 |
Semiconductor stacked package and method of fabricating the same
Grant 8,836,134 - Lin , et al. September 16, 2 | 2014-09-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20140252659 - TSAI; Yung-Tai ; et al. | 2014-09-11 |
Chip Package
App 20140225276 - HO; Yen-Shih ; et al. | 2014-08-14 |
Semiconductor Chip Package And Method For Manufacturing Thereof
App 20140203387 - SUEN; Wei-Luen ; et al. | 2014-07-24 |
Chip package structure and manufacturing method thereof
Grant 8,779,558 - Lee , et al. July 15, 2 | 2014-07-15 |
Chip package
Grant 8,779,452 - Hung , et al. July 15, 2 | 2014-07-15 |
Image Sensor Chip Package And Method For Forming The Same
App 20140154830 - HUANG; Yu-Lung ; et al. | 2014-06-05 |
Chip Package And Method For Forming The Same
App 20140154840 - CHANG; Shu-Ming ; et al. | 2014-06-05 |
Interposer and method for forming the same
Grant 8,692,300 - Yang , et al. April 8, 2 | 2014-04-08 |
Image sensor chip package and method for forming the same
Grant 8,692,358 - Huang , et al. April 8, 2 | 2014-04-08 |
Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same
App 20140091441 - CHEN; Yao-Hsiang ; et al. | 2014-04-03 |
Chip package and method for forming the same
Grant 8,674,518 - Chang , et al. March 18, 2 | 2014-03-18 |
Chip package structure and manufacturing method thereof
Grant 8,673,686 - Lee , et al. March 18, 2 | 2014-03-18 |
Chip package and method for forming the same
Grant 8,643,070 - Chang , et al. February 4, 2 | 2014-02-04 |
Chip Package And Method For Forming The Same
App 20140015111 - HO; Yen-Shih ; et al. | 2014-01-16 |
IC wafer having electromagnetic shielding effects and method for making the same
Grant 8,624,362 - Chen , et al. January 7, 2 | 2014-01-07 |
Chip Package And Method For Forming The Same
App 20130341747 - LIN; Po-Shen ; et al. | 2013-12-26 |
Chip package and method for forming the same
Grant 8,614,488 - Wen , et al. December 24, 2 | 2013-12-24 |
Chip Package And Method For Forming The Same
App 20130328147 - HO; Yen-Shih ; et al. | 2013-12-12 |
Chip Package And Method For Forming The Same
App 20130320559 - HUANG; Yu-Ting ; et al. | 2013-12-05 |
Chip Package And Method For Forming The Same
App 20130307161 - CHANG; Shu-Ming ; et al. | 2013-11-21 |
Chip Package And Method For Forming The Same
App 20130307137 - LIN; Po-Shen ; et al. | 2013-11-21 |
Chip Package Structure And Manufacturing Method Thereof
App 20130207240 - LEE; Hung-Jen ; et al. | 2013-08-15 |
Semiconductor Stacked Package And Method Of Fabricating The Same
App 20130187263 - Lin; Po-Shen ; et al. | 2013-07-25 |
Semiconductor Package And Fabrication Method Thereof
App 20130168784 - Lee; Hung-Jen ; et al. | 2013-07-04 |
Chip package structure and manufacturing method thereof
Grant 8,409,925 - Lee , et al. April 2, 2 | 2013-04-02 |
Chip Package Structure And Method For Forming The Same
App 20130020693 - Yiu; Ho-Yin ; et al. | 2013-01-24 |
Chip Package And Method For Forming The Same
App 20120319297 - YEN; Yu-Lin ; et al. | 2012-12-20 |
Chip Package Structure And Manufacturing Method Thereof
App 20120313261 - LEE; Hung-Jen ; et al. | 2012-12-13 |
Chip Package Structure And Manufacturing Method Thereof
App 20120313222 - LEE; Hung-Jen ; et al. | 2012-12-13 |
Chip Package And Method For Forming The Same
App 20120267780 - CHEN; Bing-Siang ; et al. | 2012-10-25 |
Chip Package And Manufacturing Method Thereof
App 20120261809 - YEN; Yu-Lin ; et al. | 2012-10-18 |
Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same
App 20120241923 - CHEN; Yao-Hsiang ; et al. | 2012-09-27 |
Interposer And Method For Forming The Same
App 20120193811 - YANG; Ming-Kun ; et al. | 2012-08-02 |
Method For Forming Chip Package
App 20120184070 - CHEN; Chien-Hui ; et al. | 2012-07-19 |
Chip Package And Method For Forming The Same
App 20120168939 - CHANG; Shu-Ming ; et al. | 2012-07-05 |
Chip Package And Manufacturing Method Thereof
App 20120146111 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
Chip Package And Method For Forming The Same
App 20120146108 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
Chip Package And Method For Forming The Same
App 20120146153 - WEN; Ying-Nan ; et al. | 2012-06-14 |
Chip Package
App 20120056226 - HUNG; Tzu-Hsiang ; et al. | 2012-03-08 |
Image Sensor Chip Package And Method For Forming The Same
App 20120049307 - HUANG; Yu-Lung ; et al. | 2012-03-01 |
Electronic Name Card And Electronic Name Card System Using Radio Frequency Or Microwave Identification
App 20110192896 - HO; YEN-SHIH | 2011-08-11 |
Planar spiral inductor structure having enhanced Q value
Grant 7,592,891 - Hsu , et al. September 22, 2 | 2009-09-22 |
Planar spiral inductor structure having enhanced Q value
App 20080174398 - Hsu; Heng-Ming ; et al. | 2008-07-24 |
Method of fabricating a planar spiral inductor structure having an enhanced Q value
Grant 7,370,403 - Hsu , et al. May 13, 2 | 2008-05-13 |
Method of making a metal-insulator-metal capacitor in the CMOS process
Grant 7,294,544 - Ho , et al. November 13, 2 | 2007-11-13 |
Planar spiral inductor structure with patterned microelectronic structure integral thereto
Grant 7,038,294 - Ma , et al. May 2, 2 | 2006-05-02 |
Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
Grant 6,881,996 - Chen , et al. April 19, 2 | 2005-04-19 |
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
App 20050029566 - Chen, Chun-Hon ; et al. | 2005-02-10 |
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
Grant 6,812,088 - Chen , et al. November 2, 2 | 2004-11-02 |
Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process
Grant 6,667,217 - Hsu , et al. December 23, 2 | 2003-12-23 |
Dual damascene interconnect structures that include radio frequency capacitors and inductors
Grant 6,472,721 - Ma , et al. October 29, 2 | 2002-10-29 |
Planar spiral inductor structure with patterned microelectronic structure integral thereto
App 20020142512 - Ma, Ssu-Pin ; et al. | 2002-10-03 |
Copper MIM structure and process for mixed-signal and Rf capacitors and inductors
App 20020019123 - Ma, Ssu-Pin ; et al. | 2002-02-14 |
Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow
Grant 6,329,234 - Ma , et al. December 11, 2 | 2001-12-11 |
Uniform sidewall profile etch method for forming low contact leakage schottky diode contact
Grant 6,096,629 - Tsai , et al. August 1, 2 | 2000-08-01 |
Method for manufacturing a silicide to silicide capacitor
Grant 6,051,475 - Ho , et al. April 18, 2 | 2000-04-18 |
Method of increasing end point detection capability of reactive ion etching by adding pad area
Grant 6,004,829 - Chang , et al. December 21, 1 | 1999-12-21 |
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