loadpatents
Patent applications and USPTO patent grants for Ho; Yen-Hsung.The latest application filed is for "method of testing wafer".
Patent | Date |
---|---|
Method of testing wafer Grant 11,430,733 - Ho , et al. August 30, 2 | 2022-08-30 |
Method Of Testing Wafer App 20210043566 - HO; Yen-Hsung ;   et al. | 2021-02-11 |
Semiconductor structure, testing and fabricating methods thereof Grant 10,818,595 - Ho , et al. October 27, 2 | 2020-10-27 |
Semiconductor structure, testing and fabricating method thereof Grant 10,037,927 - Ho , et al. July 31, 2 | 2018-07-31 |
Semiconductor Structure, Testing And Fabricating Methods Thereof App 20180151458 - Ho; Yen-Hsung ;   et al. | 2018-05-31 |
Semiconductor Structure, Testing And Fabricating Method Thereof App 20180151459 - HO; Yen-Hsung ;   et al. | 2018-05-31 |
Stress release layout and associated methods and devices Grant 9,478,578 - Jeng , et al. October 25, 2 | 2016-10-25 |
Stress Release Layout and Associated Methods and Devices App 20160043129 - Jeng; Chi-Cherng ;   et al. | 2016-02-11 |
Stress release layout and associated methods and devices Grant 9,196,642 - Tsai , et al. November 24, 2 | 2015-11-24 |
Stress Release Layout and Associated Methods and Devices App 20140070352 - Tsai; Tsung-Han ;   et al. | 2014-03-13 |
Implanting method for forming photodiode Grant 8,652,868 - Shih , et al. February 18, 2 | 2014-02-18 |
Implanting Method for Forming Photodiode App 20130230941 - Shih; Yu-Shen ;   et al. | 2013-09-05 |
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