Ho; Wen Seng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Wen Seng.The latest application filed is for "semiconductor package having an interfacial adhesive layer".
- Ho; Wen Seng - Singapore SG
| Patent | Date |
|---|---|
| Semiconductor package having an interfacial adhesive layer Grant 7,445,963 - Ho , et al. November 4, 2 | 2008-11-04 |
| Semiconductor package having an interfacial adhesive layer App 20070080434 - Ho; Wen Seng ; et al. | 2007-04-12 |
| Substrate for a semiconductor device App 20050078434 - Ho, Wen Seng | 2005-04-14 |
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