HO; Wei-De
Patent Applications and Registrations
Patent applications and USPTO patent grants for HO; Wei-De.The latest application filed is for "thin-film non-uniform stress evaluation".
- HO; Wei-De - Hsinchu City TW
- Ho; Wei-De - Hsinchu TW
| Patent | Date |
|---|---|
| Thin-film Non-uniform Stress Evaluation App 20210066139 - HO; Wei-De ; et al. | 2021-03-04 |
| Cut-mask patterning process for FIN-like field effect transistor (FINFET) device Grant 9,904,163 - Ho , et al. February 27, 2 | 2018-02-27 |
| Overlay measurement and compensation in semiconductor fabrication Grant 9,786,569 - Ho , et al. October 10, 2 | 2017-10-10 |
| Two-dimensional process window improvement Grant 9,703,918 - Ho , et al. July 11, 2 | 2017-07-11 |
| Cut-Mask Patterning Process for FIN-Like Field Effect Transistor (FINFET) Device App 20160124300 - Ho; Wei-De ; et al. | 2016-05-05 |
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