Ho; Tzong-Da

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ho; Tzong-Da.The latest application filed is for "fabrication method of semiconductor package with heat sink".

Company Profile

0.18.18

Ho; Tzong-Da - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making semiconductor package with heat spreader Grant RE39,957 - Huang , et al. December 25, 2	2007-12-25
Ball grid array substrate strip with warpage-preventive linkage structure Grant 7,148,561 - Huang , et al. December 12, 2	2006-12-12
Fabrication method of semiconductor package with heat sink Grant 7,074,645 - Huang , et al. July 11, 2	2006-07-11
Fabrication method of semiconductor package with heat sink App 20050095875 - Huang, Chien-Ping ; et al.	2005-05-05
Flash-preventing semiconductor package Grant 6,867,487 - Huang , et al. March 15, 2	2005-03-15
Semiconductor package with heat sink Grant 6,844,622 - Huang , et al. January 18, 2	2005-01-18
Thermally enhanced wafer-level chip scale package and method of fabricating the same App 20040106291 - Ho, Tzong Da ; et al.	2004-06-03
Semiconductor package with crack-preventing member Grant 6,707,167 - Huang , et al. March 16, 2	2004-03-16
Quad flat non-leaded semiconductor package and method of fabricating the same Grant 6,703,691 - Chen , et al. March 9, 2	2004-03-09
Substrate of semiconductor package Grant 6,699,731 - Huang , et al. March 2, 2	2004-03-02
Semicondctor package Grant 6,657,296 - Ho , et al. December 2, 2	2003-12-02
Semiconductor package with stacked chips Grant 6,650,006 - Huang , et al. November 18, 2	2003-11-18
Stacked multi-chip package structure with on-chip integration of passive component Grant 6,611,434 - Lo , et al. August 26, 2	2003-08-26
Semiconductor package with crack-preventing member App 20030094676 - Huang, Chien -Ping ; et al.	2003-05-22
Semiconductor package App 20030057534 - Ho, Tzong-Da ; et al.	2003-03-27
Quad flat non-leaded semiconductor package and method of fabricating the same App 20030042583 - Chen, Nan-Jang ; et al.	2003-03-06
Semiconductor package with heat sink App 20020180035 - Huang, Chien-Ping ; et al.	2002-12-05
Semiconductor package and method for fabricating the same App 20020180024 - Huang, Chien-Ping ; et al.	2002-12-05
Semiconductor package with stacked chips App 20020175401 - Huang, Chien-Ping ; et al.	2002-11-28
Thermally enhanced wafer-level chip scale package and method of fabricating the same App 20020173077 - Ho, Tzong Da ; et al.	2002-11-21
Ball grid array substrate strip with warpage-preventive linkage structure App 20020171129 - Huang, Chien Ping ; et al.	2002-11-21
Semiconductor package with embedded heat-dissipating device App 20020163075 - Ho, Tzong Da ; et al.	2002-11-07
Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same Grant 6,469,897 - Ho , et al. October 22, 2	2002-10-22
Substrate Of Semiconductor Package App 20020137257 - Huang, Chien-Ping ; et al.	2002-09-26
Ball grid array package with interdigitated power ring and ground ring Grant 6,449,169 - Ho , et al. September 10, 2	2002-09-10
Method of making semiconductor package with heat spreader Grant 6,444,498 - Huang , et al. September 3, 2	2002-09-03
Ball Grid Array Package With Interdigitated Power Ring And Ground Ring App 20020118522 - Ho, Tzong-Da ; et al.	2002-08-29
Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same App 20020114133 - Ho, Tzong-Da ; et al.	2002-08-22
Substrate of semiconductor package App 20020112881 - Huang, Chien-Ping ; et al.	2002-08-22
Method Of Fabricating A Flip-chip Ball-grid-array Package With Molded Underfill App 20020095192 - Pu, Han-Ping ; et al.	2002-07-18
Semiconductor package with heat dissipating element App 20020079570 - Ho, Tzong-Da ; et al.	2002-06-27
Layout method for thin and fine ball grid array package substrate with palting bus App 20020058354 - Huang, Chien-Ping ; et al.	2002-05-16
Externally-embedded heat-dissipating device for ball grid array integrated circuit package Grant 6,369,455 - Ho , et al. April 9, 2	2002-04-09
Ball grid array integrated circuit package structure Grant 6,359,341 - Huang , et al. March 19, 2	2002-03-19
Layout method for thin and fine ball grid array package substrate with plating bus Grant 6,319,750 - Huang , et al. November 20, 2	2001-11-20
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same Grant 6,282,094 - Lo , et al. August 28, 2	2001-08-28

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