Ho; Tsz Yin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Tsz Yin.The latest application filed is for "integrated circuit package in package system".
- Ho; Tsz Yin - Tuen Mun HK
- Ho; Tsz Yin - Singapore SG
| Patent | Date |
|---|---|
| Integrated circuit leaded stacked package system Grant 8,513,542 - Kuan , et al. August 20, 2 | 2013-08-20 |
| Integrated circuit package in package system Grant 8,164,172 - Ho , et al. April 24, 2 | 2012-04-24 |
| Integrated Circuit Package In Package System App 20110248411 - Ho; Tsz Yin ; et al. | 2011-10-13 |
| Integrated circuit package on package system Grant 7,986,043 - Merilo , et al. July 26, 2 | 2011-07-26 |
| Integrated circuit package in package system Grant 7,981,702 - Ho , et al. July 19, 2 | 2011-07-19 |
| Multichip module package and fabrication method Grant 7,928,564 - Shim , et al. April 19, 2 | 2011-04-19 |
| Integrated circuit package system including high-density small footprint system-in-package Grant 7,622,325 - Shim , et al. November 24, 2 | 2009-11-24 |
| Integrated circuit package system including die stacking Grant 7,619,314 - Filoteo, Jr. , et al. November 17, 2 | 2009-11-17 |
| Multichip Module Package And Fabrication Method App 20090014866 - Shim; Il Kwon ; et al. | 2009-01-15 |
| Multichip module package and fabrication method Grant 7,445,955 - Shim , et al. November 4, 2 | 2008-11-04 |
| Integrated Circuit Package System Including Die Stacking App 20080029862 - Filoteo; Dario S. JR. ; et al. | 2008-02-07 |
| Integrated circuit package system including die stacking Grant 7,298,038 - Filoteo, Jr. , et al. November 20, 2 | 2007-11-20 |
| Integrated Circuit Leaded Stacked Package System App 20070209834 - Kuan; Heap Hoe ; et al. | 2007-09-13 |
| Integrated Circuit Package In Package System App 20070210424 - Ho; Tsz Yin ; et al. | 2007-09-13 |
| Integrated Circuit Package On Package System App 20070210443 - Merilo; Dioscoro A. ; et al. | 2007-09-13 |
| Integrated Circuit Package System Including Die Stacking App 20070200205 - Filoteo; Dario S. JR. ; et al. | 2007-08-30 |
| Integrated Circuit Package System Including High-density Small Footprint System-in-package App 20070096282 - Shim; IL Kwon ; et al. | 2007-05-03 |
| Multichip Module Package And Fabrication Method App 20060043560 - SHIM; IL Kwon ; et al. | 2006-03-02 |
| Multichip module package and fabrication method Grant 6,943,057 - Shim , et al. September 13, 2 | 2005-09-13 |
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