Ho; Shu-Ching
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Shu-Ching.The latest application filed is for "semiconductor package structure and method for manufacturing the same".
- Ho; Shu-Ching - Hsinchu TW
- Ho; Shu-Ching - Tainan TW
- Ho; Shu-Ching - US
- Ho; Shu-Ching - Tainan City TW
| Patent | Date |
|---|---|
| Semiconductor package structure and method for manufacturing the same Grant 7,973,310 - Wang , et al. July 5, 2 | 2011-07-05 |
| Method for preparing a carbon/carbon composite Grant 7,871,592 - Lin , et al. January 18, 2 | 2011-01-18 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20100007001 - Wang; David Wei ; et al. | 2010-01-14 |
| Conductive Structure Of A Chip App 20090283905 - HUANG; Hsiang-Ming ; et al. | 2009-11-19 |
| Conductive Structure Of A Chip And Method For Manufacturing The Same App 20090236741 - HUANG; Hsiang-Ming ; et al. | 2009-09-24 |
| Fabrication processes of a MEMS alloy probe App 20080124828 - Huang; Hsiang-Ming ; et al. | 2008-05-29 |
| Process For Preparing Semi-Metallic Friction Material App 20080090941 - Lin; Jiin-Huey Chern ; et al. | 2008-04-17 |
| Method for Preparing a Carbon/Carbon Composite App 20080025906 - Lin; Jiin-Huey Chern ; et al. | 2008-01-31 |
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