Ho; Sheng-Hsiung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Sheng-Hsiung.The latest application filed is for "reel-type package of flexible printed circuit borads and method for supplying thereof".
- Ho; Sheng-Hsiung - Hsinchu Hsien TW
- Ho; Sheng-Hsiung - Chu Tung Chen TW
- Ho; Sheng-Hsiung - Jhudong Township Hsinchu County TW
| Patent | Date |
|---|---|
| Reel-type package of flexible printed circuit boards and method for supplying thereof Grant 7,686,909 - Cheng , et al. March 30, 2 | 2010-03-30 |
| Reel-type package of flexible printed circuit borads and method for supplying thereof App 20070295444 - Cheng; Ping-Chin ; et al. | 2007-12-27 |
| Anisotropic conductive film bonding pad Grant 7,038,327 - Ho , et al. May 2, 2 | 2006-05-02 |
| Anisotropic conductive film bonding pad App 20050098902 - Ho, Sheng-Hsiung ; et al. | 2005-05-12 |
| Reel-type package of flexible printed circuit boards and method for supplying thereof App 20040177919 - Cheng, Ping-Chin ; et al. | 2004-09-16 |
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