Patent | Date |
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Fabrication methods for nanodelivery systems for long term controlled delivery of active pharmaceutical ingredients Grant 11,103,460 - Ho , et al. August 31, 2 | 2021-08-31 |
Capped through-silicon-vias for 3D integrated circuits Grant 10,727,165 - Ho , et al. | 2020-07-28 |
CAPPED THROUGH-SILICON-VIAs FOR 3D INTEGRATED CIRCUITS App 20190139864 - Ho; Paul S. ;   et al. | 2019-05-09 |
Fabrication Methods For Nanodelivery Systems For Long Term Controlled Delivery Of Active Pharmaceutical Ingredients App 20190038565 - HO; Paul S. ;   et al. | 2019-02-07 |
Capped through-silicon-vias for 3D integrated circuits Grant 10,170,399 - Ho , et al. J | 2019-01-01 |
Methods for Making Controlled Delivery Devices Having Zero Order Kinetics App 20180042549 - HO; Paul S. ;   et al. | 2018-02-15 |
CAPPED THROUGH-SILICON-VIAs FOR 3D INTEGRATED CIRCUITS App 20180012824 - Ho; Paul S. ;   et al. | 2018-01-11 |
Self-aligned masks and methods of use Grant 9,403,675 - Ho , et al. August 2, 2 | 2016-08-02 |
Methods Of Fabricating Silicon Nanowires And Devices Containing Silicon Nanowires App 20160172457 - Ho; Paul S. ;   et al. | 2016-06-16 |
Methods for Making Controlled Delivery Devices Having Zero Order Kinetics App 20150208982 - HO; Paul S. ;   et al. | 2015-07-30 |
Methods for making controlled delivery devices having zero order kinetics Grant 9,005,649 - Ho , et al. April 14, 2 | 2015-04-14 |
Self-aligned Masks And Methods Of Use App 20150054135 - Ho; Paul S. ;   et al. | 2015-02-26 |
Methods for Making Controlled Delivery Devices Having Zero Order Kinetics App 20120177716 - Ho; Paul S. ;   et al. | 2012-07-12 |
Therapeutic Methods Using Controlled Delivery Devices Having Zero Order Kinetics App 20120130300 - Stavchansky; Salomon S. ;   et al. | 2012-05-24 |
Assisted selective growth of highly dense and vertically aligned carbon nanotubes App 20100117764 - Wang; Yunyu ;   et al. | 2010-05-13 |
Multiple copper vias for integrated circuit metallization Grant 7,078,817 - Ho , et al. July 18, 2 | 2006-07-18 |
Multiple copper vias for integrated circuit metallization and methods of fabricating same Grant 6,919,639 - Ho , et al. July 19, 2 | 2005-07-19 |
Multiple copper vias for integrated circuit metallization App 20050093163 - Ho, Paul S. ;   et al. | 2005-05-05 |
Multiple copper vias for integrated circuit metallization and methods of fabricating same App 20040070078 - Ho, Paul S. ;   et al. | 2004-04-15 |
Electromigration early failure distribution in submicron interconnects App 20020017906 - Ho, Paul S. ;   et al. | 2002-02-14 |
Metal-polymer adhesion by low energy bombardment Grant 4,886,681 - Clabes , et al. December 12, 1 | 1989-12-12 |
Nickel-gold-nickel conductors for solid state devices Grant 4,319,264 - Gangulee , et al. March 9, 1 | 1982-03-09 |
Metal/silicon contact and methods of fabrication thereof Grant 4,316,209 - Ho , et al. February 16, 1 | 1982-02-16 |
Electromigration resistance in gold thin film conductors Grant 4,166,279 - Gangulee , et al. August 28, 1 | 1979-08-28 |
Method for forming intermetallic layers in thin films for improved electromigration resistance Grant 4,154,874 - Howard , et al. May 15, 1 | 1979-05-15 |