Ho; Ming Lun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Ming Lun.The latest application filed is for "method for flip chip bonding by utilizing an interposer with embedded bumps".
- Ho; Ming Lun - Fairport NY
- Ho; Ming-Lun - Kaohsiung TW
- Ho; Ming-Lun - Kaohsiung County TW
| Patent | Date |
|---|---|
| Process and apparatus for trimming polymeric parts Grant 7,811,492 - Ennis , et al. October 12, 2 | 2010-10-12 |
| Flip chip stacked package Grant 7,291,924 - Wang , et al. November 6, 2 | 2007-11-06 |
| Process of cutting electronic package Grant 7,220,619 - Ho , et al. May 22, 2 | 2007-05-22 |
| Method for flip chip bonding by utilizing an interposer with embedded bumps App 20060088953 - Ho; Ming-Lun ; et al. | 2006-04-27 |
| Flip chip package structure Grant 7,019,407 - Chen , et al. March 28, 2 | 2006-03-28 |
| Chip package structure with dual heat sinks Grant 7,002,246 - Ho , et al. February 21, 2 | 2006-02-21 |
| Flip-chip Substrate And Flip-chip Bonding Process Thereof App 20050282311 - Chen, Yu-Wen ; et al. | 2005-12-22 |
| Process Of Cutting Electronic Package App 20050148159 - Ho, Ming-Lun ; et al. | 2005-07-07 |
| Flip chip stacked package App 20050046040 - Wang, Sung-Fei ; et al. | 2005-03-03 |
| Process and apparatus for trimming polymeric parts App 20050000332 - Ennis, Gary D. ; et al. | 2005-01-06 |
| [chip Package Structure] App 20050001311 - Ho, Ming-Lun ; et al. | 2005-01-06 |
| [flip Chip Package Structure] App 20040124540 - CHEN, YU-WEN ; et al. | 2004-07-01 |
| [flip-chip Substrate And Flip-chip Bonding Process Thereof] App 20040119171 - Chen, Yu-Wen ; et al. | 2004-06-24 |
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