| Patent | Date |
|---|
Integrated Fan-out (info) Package Structure
App 20220310519 - Ho; Ming-Che ; et al. | 2022-09-29 |
Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
Grant 11,410,918 - Yu , et al. August 9, 2 | 2022-08-09 |
Via structure for packaging and a method of forming
Grant 11,410,953 - Ho , et al. August 9, 2 | 2022-08-09 |
Package structure and method of fabricating the same
Grant 11,398,416 - Lee , et al. July 26, 2 | 2022-07-26 |
Integrated fan-out (info) package structure and method
Grant 11,393,763 - Ho , et al. July 19, 2 | 2022-07-19 |
Integrated circuit package and method
Grant 11,387,191 - Yu , et al. July 12, 2 | 2022-07-12 |
Integrated circuit packages and methods of forming same
Grant 11,289,410 - Yu , et al. March 29, 2 | 2022-03-29 |
Semiconductor Package, Redistribution Structure And Method For Forming The Same
App 20220068869 - Lee; Chiang-Hao ; et al. | 2022-03-03 |
Integrated circuit packages and methods of forming same
Grant 11,239,233 - Wu , et al. February 1, 2 | 2022-02-01 |
Package structure and method of forming the same
Grant 11,217,518 - Lee , et al. January 4, 2 | 2022-01-04 |
Package structures and methods for forming the same
Grant 11,211,261 - Meng , et al. December 28, 2 | 2021-12-28 |
Integrated Fan-out (info) Package Structure And Method
App 20210375767 - Ho; Ming-Che ; et al. | 2021-12-02 |
Semiconductor Package And Manufacturing Method Thereof
App 20210305140 - Hung; Tuan-Yu ; et al. | 2021-09-30 |
Semiconductor Package And Manufacturing Method Of Semiconductor Package
App 20210305112 - Tseng; Shih-Hao ; et al. | 2021-09-30 |
Manufacturing Method Of A Semiconductor Package
App 20210305113 - Tseng; Shih-Hao ; et al. | 2021-09-30 |
Semiconductor Package and Method
App 20210296245 - Tseng; Shih-Hao ; et al. | 2021-09-23 |
Semiconductor Package And Method Of Forming The Same
App 20210242140 - Chen; Ching-Wen ; et al. | 2021-08-05 |
Integrated Circuit Package and Method
App 20210225723 - Huang; Tzu-Sung ; et al. | 2021-07-22 |
Semiconductor package and manufacturing method thereof
Grant 11,056,412 - Tseng , et al. July 6, 2 | 2021-07-06 |
Package Structure And Method Of Fabricating The Same
App 20210175168 - Wu; Yi-Wen ; et al. | 2021-06-10 |
Semiconductor package and method
Grant 11,031,342 - Tseng , et al. June 8, 2 | 2021-06-08 |
Method, image processing device, and system for generating disparity map
Grant 11,024,048 - Li , et al. June 1, 2 | 2021-06-01 |
Semiconductor packages and methods of manufacturing the same
Grant 11,024,581 - Wu , et al. June 1, 2 | 2021-06-01 |
Semiconductor package and manufacturing method thereof
Grant 11,018,083 - Hung , et al. May 25, 2 | 2021-05-25 |
Package structure and method of forming the same
Grant 11,004,812 - Hung , et al. May 11, 2 | 2021-05-11 |
Semiconductor package and method of forming the same
Grant 10,985,116 - Chen , et al. April 20, 2 | 2021-04-20 |
Semiconductor Device and Method
App 20210098397 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210090973 - Lee; Tzung-Hui ; et al. | 2021-03-25 |
Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same
Grant 10,957,645 - Lee , et al. March 23, 2 | 2021-03-23 |
Crystal Grains Copper Columnar Shape Pattern Electrical Connected To A Semiconductor Die
App 20210082830 - Lee; Yu-Ming ; et al. | 2021-03-18 |
Integrated circuit package and method
Grant 10,950,519 - Huang , et al. March 16, 2 | 2021-03-16 |
Integrated fan-out package and method of fabricating the same
Grant 10,930,586 - Wu , et al. February 23, 2 | 2021-02-23 |
Semiconductor Package And Manufacturing Method Thereof
App 20210020559 - Hung; Tuan-Yu ; et al. | 2021-01-21 |
Integrated Circuit Package and Method
App 20210020584 - Yu; Chen-Hua ; et al. | 2021-01-21 |
Integrated circuit packages and methods of forming same
Grant 10,872,885 - Wu , et al. December 22, 2 | 2020-12-22 |
Semiconductor package and method of fabricating the same
Grant 10,867,793 - Liu , et al. December 15, 2 | 2020-12-15 |
Plating apparatus and plating method
Grant 10,865,496 - Hung , et al. December 15, 2 | 2020-12-15 |
Semiconductor device and method
Grant 10,867,941 - Yu , et al. December 15, 2 | 2020-12-15 |
Electronic device and manufacturing method thereof
Grant 10,868,353 - Lu , et al. December 15, 2 | 2020-12-15 |
Integrated fan-out packages and methods of forming the same
Grant 10,861,814 - Lee , et al. December 8, 2 | 2020-12-08 |
Integrated Circuit Package and Method
App 20200381325 - Huang; Tzu-Sung ; et al. | 2020-12-03 |
Via Structure for Packaging and a Method of Forming
App 20200365541 - Ho; Ming-Che ; et al. | 2020-11-19 |
Bonding package components through plating
Grant 10,840,212 - Lim , et al. November 17, 2 | 2020-11-17 |
Forming Bonding Structures By Using Template Layer as Templates
App 20200328153 - Lii; Mirng-Ji ; et al. | 2020-10-15 |
Semiconductor Package And Method Of Forming The Same
App 20200294937 - Chen; Ching-Wen ; et al. | 2020-09-17 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20200273805 - Wu; Yi-Wen ; et al. | 2020-08-27 |
Via structure for packaging and a method of forming
Grant 10,734,341 - Ho , et al. | 2020-08-04 |
Forming bonding structures by using template layer as templates
Grant 10,700,001 - Lii , et al. | 2020-06-30 |
Plating Apparatus And Plating Method
App 20200131664 - Hung; Tuan-Yu ; et al. | 2020-04-30 |
Semiconductor Package And Method Of Fabricating The Same
App 20200135453 - Liu; Zi-Jheng ; et al. | 2020-04-30 |
Package Structure And Method Of Forming The Same
App 20200118914 - Lee; Tzung-Hui ; et al. | 2020-04-16 |
Electronic Device And Manufacturing Method Thereof
App 20200106156 - Lu; Chun-Lin ; et al. | 2020-04-02 |
Target tracking method and system adaptable to multi-target tracking
Grant 10,599,942 - Kuo , et al. | 2020-03-24 |
Package Structure And Method Of Forming The Same
App 20200091097 - Hung; Tuan-Yu ; et al. | 2020-03-19 |
Via Structure for Packaging and a Method of Forming
App 20200058613 - Ho; Ming-Che ; et al. | 2020-02-20 |
Bonding Package Components Through Plating
App 20200020662 - Lim; Zheng-Yi ; et al. | 2020-01-16 |
Integrated Circuit Packages And Methods Of Forming Same
App 20200013704 - Yu; Chen-Hua ; et al. | 2020-01-09 |
Integrated Circuit Packages and Methods of Forming Same
App 20190393216 - Wu; Yi-Wen ; et al. | 2019-12-26 |
Packae structure, RDL structure and method of forming the same
Grant 10,510,646 - Lee , et al. Dec | 2019-12-17 |
Method of selectively removing tungsten over silicon oxide
Grant 10,501,660 - Ho , et al. Dec | 2019-12-10 |
Bonding package components through plating
Grant 10,483,230 - Lim , et al. Nov | 2019-11-19 |
Semicondcutor Package And Manufacturing Method Thereof
App 20190341322 - Tseng; Shih-Hao ; et al. | 2019-11-07 |
Via structure for packaging and a method of forming
Grant 10,461,051 - Ho , et al. Oc | 2019-10-29 |
Method, system, and computer-readable recording medium for long-distance person identification
Grant 10,423,848 - Syu , et al. Sept | 2019-09-24 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190279929 - Wu; Yi-Wen ; et al. | 2019-09-12 |
Semiconductor Device and Method
App 20190273055 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Packae Structure, Rdl Structure And Method Of Forming The Same
App 20190267314 - Lee; Tzung-Hui ; et al. | 2019-08-29 |
Semicondcutor package and manufacturing method thereof
Grant 10,361,139 - Tseng , et al. | 2019-07-23 |
Method, Image Processing Device, And System For Generating Disparity Map
App 20190213749 - Li; Chong-Wei ; et al. | 2019-07-11 |
Method Of Selectively Removing Tungsten Over Silicon Oxide
App 20190203073 - Ho; Yun-Lung ; et al. | 2019-07-04 |
Integrated fan-out package and method of fabricating the same
Grant 10,297,544 - Wu , et al. | 2019-05-21 |
Semiconductor device and method
Grant 10,297,560 - Yu , et al. | 2019-05-21 |
Semicondcutor Package And Manufacturing Method Thereof
App 20190148255 - Tseng; Shih-Hao ; et al. | 2019-05-16 |
Semiconductor Package and Method
App 20190148302 - Tseng; Shih-Hao ; et al. | 2019-05-16 |
Intergrated Circuit Packages and Methods of Forming Same
App 20190148274 - Yu; Chen-Hua ; et al. | 2019-05-16 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20190131269 - Lee; Tzung-Hui ; et al. | 2019-05-02 |
Target Tracking Method And System Adaptable To Multi-target Tracking
App 20190114501 - Kuo; Shih-Hao ; et al. | 2019-04-18 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190096802 - Wu; Yi-Wen ; et al. | 2019-03-28 |
Via Structure for Packaging and a Method of Forming
App 20190088609 - Ho; Ming-Che ; et al. | 2019-03-21 |
Analysis method of lane stripe images, image analysis device, and non-transitory computer readable medium thereof
Grant 10,235,576 - Yeh , et al. | 2019-03-19 |
Integrated Circuit Packages and Methods of Forming Same
App 20190006354 - Wu; Yi-Wen ; et al. | 2019-01-03 |
Integrated fan-out package, redistribution circuit structure, and method of fabricating the same
Grant 10,163,832 - Huang , et al. Dec | 2018-12-25 |
Package Structures and Methods for Forming the Same
App 20180342404 - Meng; Hsien-Liang ; et al. | 2018-11-29 |
Via structure for packaging and a method of forming
Grant 10,134,700 - Ho , et al. November 20, 2 | 2018-11-20 |
Method, System, And Computer-readable Recording Medium For Long-distance Person Identification
App 20180276487 - Syu; You-Jyun ; et al. | 2018-09-27 |
Packaging devices and methods
Grant 10,079,200 - Liang , et al. September 18, 2 | 2018-09-18 |
Method of fabricating redistribution circuit structure
Grant 10,074,623 - Lee , et al. September 11, 2 | 2018-09-11 |
Package structures and methods for forming the same
Grant 10,049,894 - Meng , et al. August 14, 2 | 2018-08-14 |
Bonding Structures and Methods Forming the Same
App 20180226342 - Lii; Mirng-Ji ; et al. | 2018-08-09 |
Device for generating depth information, method for generating depth information, and stereo camera
Grant 10,033,987 - Wu , et al. July 24, 2 | 2018-07-24 |
Image calibration system and calibration method of a stereo camera
Grant 10,009,595 - Lin , et al. June 26, 2 | 2018-06-26 |
Semiconductor Device and Method
App 20180158789 - Yu; Chen-Hua ; et al. | 2018-06-07 |
Method Of Fabricating Redistribution Circuit Structure
App 20180151521 - Lee; Tzung-Hui ; et al. | 2018-05-31 |
Method of forming post-passivation interconnect structure
Grant 9,953,891 - Wu , et al. April 24, 2 | 2018-04-24 |
Bonding structures and methods forming the same
Grant 9,935,047 - Lii , et al. April 3, 2 | 2018-04-03 |
Integrated fan-out package, redistribution circuit structure, and method of fabricating the same
Grant 9,899,342 - Lee , et al. February 20, 2 | 2018-02-20 |
Semiconductor device and method
Grant 9,871,009 - Yu , et al. January 16, 2 | 2018-01-16 |
Semiconductor Device and Method
App 20170365564 - Yu; Chen-Hua ; et al. | 2017-12-21 |
Analysis Method Of Lane Stripe Images, Image Analysis Device, And Non-transitory Computer Readable Medium Thereof
App 20170351925 - YEH; Shang-Min ; et al. | 2017-12-07 |
Bonding Package Components Through Plating
App 20170294402 - Lim; Zheng-Yi ; et al. | 2017-10-12 |
Integrated Fan-out Package, Redistribution Circuit Structure, And Method Of Fabricating The Same
App 20170271283 - Lee; Tzung-Hui ; et al. | 2017-09-21 |
Slurry Composition, Use Thereof, And Polishing Method
App 20170253766 - Ho; Yun-Lung ; et al. | 2017-09-07 |
Packaging Devices and Methods
App 20170250129 - Liang; Shih-Wei ; et al. | 2017-08-31 |
Chemical mechanical polishing slurry
Grant 9,718,991 - Yang , et al. August 1, 2 | 2017-08-01 |
Via Structure For Packaging And A Method Of Forming
App 20170194276 - Ho; Ming-Che ; et al. | 2017-07-06 |
Bonding package components through plating
Grant 9,691,738 - Lim , et al. June 27, 2 | 2017-06-27 |
Rinsing wafers using composition-tunable rinse water in chemical mechanical polish
Grant 9,659,796 - Chan , et al. May 23, 2 | 2017-05-23 |
Packaging devices and methods
Grant 9,653,418 - Liang , et al. May 16, 2 | 2017-05-16 |
Bonding Structures And Methods Forming The Same
App 20170110401 - Lii; Mirng-Ji ; et al. | 2017-04-20 |
Via structure for packaging and a method of forming
Grant 9,601,355 - Ho , et al. March 21, 2 | 2017-03-21 |
Chemical Mechanical Polishing Slurry
App 20160347971 - YANG; YI HAN ; et al. | 2016-12-01 |
Polishing composition
Grant 9,493,678 - Ho , et al. November 15, 2 | 2016-11-15 |
Copper-containing layer on under-bump metallization layer
Grant 9,472,524 - Chen , et al. October 18, 2 | 2016-10-18 |
Package Structures and Methods for Forming the Same
App 20160268145 - Meng; Hsien-Liang ; et al. | 2016-09-15 |
Adjusting sizes of connectors of package components
Grant 9,430,605 - Lai , et al. August 30, 2 | 2016-08-30 |
Zero stand-off bonding system and method
Grant 9,418,956 - Lin , et al. August 16, 2 | 2016-08-16 |
Polishing Composition
App 20160208141 - Ho; Yun Lung ; et al. | 2016-07-21 |
Package on package devices and methods of packaging semiconductor dies
Grant 9,397,080 - Hsu , et al. July 19, 2 | 2016-07-19 |
Image capturing method for image recognition and system thereof
Grant 9,373,035 - Wu , et al. June 21, 2 | 2016-06-21 |
Methods and apparatus of packaging semiconductor devices
Grant 9,368,462 - Wu , et al. June 14, 2 | 2016-06-14 |
Package structures and methods for forming the same
Grant 9,362,236 - Meng , et al. June 7, 2 | 2016-06-07 |
Via Structure For Packaging And A Method Of Forming
App 20160155650 - Ho; Ming-Che ; et al. | 2016-06-02 |
Image Calibration System And Calibration Method Of A Stereo Camera
App 20160073092 - Lin; Wen-Kuo ; et al. | 2016-03-10 |
Via structure for packaging and a method of forming
Grant 9,263,302 - Ho , et al. February 16, 2 | 2016-02-16 |
Method of fabricating bump structure and bump structure
Grant 9,257,401 - Hsu , et al. February 9, 2 | 2016-02-09 |
Copper-containing Layer On Under-bump Metallization Layer
App 20160020186 - CHEN; Yu-Feng ; et al. | 2016-01-21 |
Bonding Package Components Through Plating
App 20150364449 - Lim; Zheng-Yi ; et al. | 2015-12-17 |
Adjusting Sizes of Connectors of Package Components
App 20150347663 - Lai; Chih-Wei ; et al. | 2015-12-03 |
Method Of Forming Post-passivation Interconnect Structure
App 20150325539 - WU; Yi-Wen ; et al. | 2015-11-12 |
Zero Stand-Off Bonding System and Method
App 20150303161 - Lin; Chun-Hung ; et al. | 2015-10-22 |
Method For Making Up A Skin Tone Of A Human Body In An Image, Device For Making Up A Skin Tone Of A Human Body In An Image, Method For Adjusting A Skin Tone Luminance Of A Human Body In An Image, And Device For Adjusting A Skin Tone Luminance Of A Human Body In An Image
App 20150302564 - Ho; Ming-Che ; et al. | 2015-10-22 |
Crack stopper on under-bump metallization layer
Grant 9,159,686 - Chen , et al. October 13, 2 | 2015-10-13 |
Packaging Devices and Methods
App 20150243615 - Liang; Shih-Wei ; et al. | 2015-08-27 |
Via Structure For Packaging And A Method Of Forming
App 20150243531 - Ho; Ming-Che ; et al. | 2015-08-27 |
Bonding package components through plating
Grant 9,117,772 - Lim , et al. August 25, 2 | 2015-08-25 |
Adjusting sizes of connectors of package components
Grant 9,111,064 - Lai , et al. August 18, 2 | 2015-08-18 |
Post-passivation interconnect structure and method of forming the same
Grant 9,099,396 - Wu , et al. August 4, 2 | 2015-08-04 |
Device For Generating Depth Information, Method For Generating Depth Information, And Stereo Camera
App 20150208057 - Wu; Ben ; et al. | 2015-07-23 |
Method Of Fabricating Bump Structure And Bump Structure
App 20150194402 - HSU; Chun-Lei ; et al. | 2015-07-09 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20150187746 - Hsu; Chun-Lei ; et al. | 2015-07-02 |
Zero stand-off bonding system and method
Grant 9,064,880 - Lin , et al. June 23, 2 | 2015-06-23 |
Packaging devices and methods
Grant 9,030,010 - Liang , et al. May 12, 2 | 2015-05-12 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20150123276 - Wu; Yi-Wen ; et al. | 2015-05-07 |
Image Calibration System And Calibration Method Of A Stereo Camera
App 20150103147 - Ho; Ming-Che ; et al. | 2015-04-16 |
Method of fabricating bump structure
Grant 8,993,431 - Hsu , et al. March 31, 2 | 2015-03-31 |
Package on package devices and methods of packaging semiconductor dies
Grant 8,981,559 - Hsu , et al. March 17, 2 | 2015-03-17 |
Methods and apparatus of packaging semiconductor devices
Grant 8,937,388 - Wu , et al. January 20, 2 | 2015-01-20 |
UBM formation for integrated circuits
Grant 8,865,586 - Wu , et al. October 21, 2 | 2014-10-21 |
Method of forming post passivation interconnects
Grant 8,865,585 - Chou , et al. October 21, 2 | 2014-10-21 |
Adjusting Sizes of Connectors of Package Components
App 20140308764 - Lai; Chih-Wei ; et al. | 2014-10-16 |
Package Structures and Methods for Forming the Same
App 20140252594 - Meng; Hsien-Liang ; et al. | 2014-09-11 |
Wafer's ambiance control
Grant 8,827,695 - Hsiao , et al. September 9, 2 | 2014-09-09 |
Adjusting sizes of connectors of package components
Grant 8,791,579 - Lai , et al. July 29, 2 | 2014-07-29 |
Zero Stand-Off Bonding System and Method
App 20140183746 - Lin; Chun-Hung ; et al. | 2014-07-03 |
Activation treatments in plating processes
Grant 8,703,546 - Lin , et al. April 22, 2 | 2014-04-22 |
Packaging Devices and Methods
App 20140077369 - Liang; Shih-Wei ; et al. | 2014-03-20 |
Mechanisms for forming copper pillar bumps
Grant 8,659,155 - Cheng , et al. February 25, 2 | 2014-02-25 |
Polishing composition for planarizing metal layer
Grant 8,641,920 - Chang , et al. February 4, 2 | 2014-02-04 |
Method of Forming Post Passivation Interconnects
App 20140015122 - Chou; Meng-Wei ; et al. | 2014-01-16 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20130341786 - Hsu; Chun-Lei ; et al. | 2013-12-26 |
Bonding Package components Through Plating
App 20130334692 - Lim; Zheng-Yi ; et al. | 2013-12-19 |
Preventing UBM oxidation in bump formation processes
Grant 8,609,526 - Liu , et al. December 17, 2 | 2013-12-17 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20130328190 - Wu; Yi-Wen ; et al. | 2013-12-12 |
Image Capturing Method For Image Recognition And System Thereof
App 20130329947 - Wu; Ben ; et al. | 2013-12-12 |
Protection layer for preventing UBM layer from chemical attack and oxidation
Grant 8,569,897 - Liu , et al. October 29, 2 | 2013-10-29 |
Stereoscopic Image Processor, Stereoscopic Image Interaction System, and Stereoscopic Image Displaying Method thereof
App 20130215112 - Ho; Ming-Che ; et al. | 2013-08-22 |
Crack Stopper On Under-bump Metallization Layer
App 20130187277 - Chen; Yu-Feng ; et al. | 2013-07-25 |
UBM Formation for Integrated Circuits
App 20130175685 - Wu; Yi-Wen ; et al. | 2013-07-11 |
Adjusting Sizes of Connectors of Package Components
App 20130127059 - Lai; Chih-Wei ; et al. | 2013-05-23 |
Post-passivation Interconnect Structure And Method Of Forming The Same
App 20130113094 - WU; Yi-Wen ; et al. | 2013-05-09 |
Conductive pillar for semiconductor substrate and method of manufacture
Grant 8,405,199 - Lu , et al. March 26, 2 | 2013-03-26 |
Doping Minor Elements into Metal Bumps
App 20120286423 - Cheng; Ming-Da ; et al. | 2012-11-15 |
Image Interaction Device, Interactive Image Operating System, and Interactive Image Operating Method thereof
App 20120268551 - Wu; Ben ; et al. | 2012-10-25 |
Doping minor elements into metal bumps
Grant 8,227,334 - Cheng , et al. July 24, 2 | 2012-07-24 |
CMP by controlling polish temperature
Grant 8,172,641 - Ho , et al. May 8, 2 | 2012-05-08 |
Doping Minor Elements into Metal Bumps
App 20120018878 - Cheng; Ming-Da ; et al. | 2012-01-26 |
Conductive Pillar For Semiconductor Substrate And Method Of Manufacture
App 20120007228 - LU; Wen-Hsiung ; et al. | 2012-01-12 |
Activation Treatments in Plating Processes
App 20110287628 - Lin; Chih-Wei ; et al. | 2011-11-24 |
Method Of Fabricating Bump Structure
App 20110278716 - HSU; Chun-Lei ; et al. | 2011-11-17 |
Mechanisms For Forming Copper Pillar Bumps
App 20110101527 - CHENG; Ming-Da ; et al. | 2011-05-05 |
Preventing UBM Oxidation in Bump Formation Processes
App 20110092064 - Liu; Chung-Shi ; et al. | 2011-04-21 |
Protection Layer For Preventing Ubm Layer From Chemical Attack And Oxidation
App 20110062580 - LIU; Chung-Shi ; et al. | 2011-03-17 |
Chemical Mechanical Polishing Composition
App 20100193728 - CHANG; Song-Yuan ; et al. | 2010-08-05 |
Polishing Composition for Planarizing Metal Layer
App 20100163784 - CHANG; Song-Yuan ; et al. | 2010-07-01 |
Rinsing Wafers Using Composition-Tunable Rinse Water in Chemical Mechanical Polish
App 20100018029 - Chan; Cheng Hsun ; et al. | 2010-01-28 |
CMP by Controlling Polish Temperature
App 20100015894 - Ho; Ming-Che ; et al. | 2010-01-21 |
Novel Wafer's Ambiance Control
App 20090317214 - Hsiao; Yi-Li ; et al. | 2009-12-24 |
Method for manufacturing thin film transistor, thin film transistor and pixel structure
App 20070054442 - Liu; Po-Chih ; et al. | 2007-03-08 |
Method of forming thin film transistor and poly silicon layer of low-temperature poly silicon thin film transistor
App 20070051993 - Ho; Ming-Che ; et al. | 2007-03-08 |
Masked identification code registration system and masked registration method
App 20030027573 - Chien, Ming-Long ; et al. | 2003-02-06 |
System and method for status settings of semiconductor equipment with multi chambers
App 20020095754 - Yao, Jack ; et al. | 2002-07-25 |
System and method for status settings of semiconductor equipment with multi chambers
App 20020098600 - Yao, Jack ; et al. | 2002-07-25 |
Power-transforming device
Grant 6,233,167 - Chen , et al. May 15, 2 | 2001-05-15 |
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