Ho; Kai-Kuang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Kai-Kuang.The latest application filed is for "structure of surface acoustic wave device and method for fabricating the same".
- Ho; Kai-Kuang - Hsinchu City TW
- Ho; Kai-Kuang - Hsin-Chu TW
- Ho; Kai-Kuang - Hsin-Chu City TW
- Ho; Kai-Kuang - Hsinchu TW
- Ho, Kai-Kuang - Feng-Shan City TW
- HO, KAI-KUANG - KAOHSIUNG HSIEN TW
- Ho; Kai-Kuang - Feng-Shan TW
| Patent | Date |
|---|---|
| Structure Of Surface Acoustic Wave Device And Method For Fabricating The Same App 20220166402 - Wang; Chen-Hsiao ; et al. | 2022-05-26 |
| Semiconductor Device And Method For Fabricating The Same App 20220165684 - CHIANG; Meng-Ting ; et al. | 2022-05-26 |
| Semiconductor Device Package Structure And Method For Fabricating The Same App 20210202340 - HUANG; YU-YUAN ; et al. | 2021-07-01 |
| Semiconductor structure with UBM layer and method of fabricating the same Grant 9,502,366 - Ho , et al. November 22, 2 | 2016-11-22 |
| Semiconductor Structure With Ubm Layer And Method Of Fabricating The Same App 20160190077 - Ho; Kai-Kuang ; et al. | 2016-06-30 |
| Metal structure Grant 7,696,606 - Kuo , et al. April 13, 2 | 2010-04-13 |
| Semiconductor wafer Grant 7,649,268 - Kuo , et al. January 19, 2 | 2010-01-19 |
| Chip Package And Process Thereof App 20090218679 - Hsuan; Min-Chih ; et al. | 2009-09-03 |
| Method For Dicing Wafer App 20090137097 - Lin; Chu-Fu ; et al. | 2009-05-28 |
| Chip packaging process Grant 7,534,653 - Hsuan , et al. May 19, 2 | 2009-05-19 |
| Chip Package And Process Thereof App 20080185710 - Hsuan; Min-Chih ; et al. | 2008-08-07 |
| Integrated die bumping process Grant 7,399,695 - Ho , et al. July 15, 2 | 2008-07-15 |
| Metal Structure App 20080142997 - Kuo; Chien-Li ; et al. | 2008-06-19 |
| Method For Forming A Metal Structure App 20080146024 - Kuo; Chien-Li ; et al. | 2008-06-19 |
| Semiconductor Wafer App 20080142798 - Kuo; Chien-Li ; et al. | 2008-06-19 |
| Method for forming a metal structure Grant 7,387,950 - Kuo , et al. June 17, 2 | 2008-06-17 |
| Fabrication of semiconductor integrated circuit chips Grant 7,268,440 - Lin , et al. September 11, 2 | 2007-09-11 |
| Integrated die bumping process Grant 7,241,678 - Ho , et al. July 10, 2 | 2007-07-10 |
| Pre-process before cutting a wafer and method of cutting a wafer Grant 7,211,500 - Chen , et al. May 1, 2 | 2007-05-01 |
| Chip Packaging Process App 20070085206 - HSUAN; MIN-CHIH ; et al. | 2007-04-19 |
| Integrated Die Bumping Process App 20070054483 - Ho; Kai-Kuang ; et al. | 2007-03-08 |
| Method for manufacturing wafer level chip scale package structure Grant 7,170,167 - Hsuan , et al. January 30, 2 | 2007-01-30 |
| Fabrication Of Semiconductor Integrated Circuit Chips App 20060278957 - Lin; Zong-Huei ; et al. | 2006-12-14 |
| Electrical Package Structure Including Chip With Polymer Thereon App 20060231932 - Ho; Kai-Kuang ; et al. | 2006-10-19 |
| Compact Camera Module With Reduced Thickness App 20060219862 - Ho; Kai-Kuang ; et al. | 2006-10-05 |
| Fabrication Of Semiconductor Integrated Circuit Chips App 20060151875 - Lin; Zong-Huei ; et al. | 2006-07-13 |
| Integrated Die Bumping Process App 20060148231 - Ho; Kai-Kuang ; et al. | 2006-07-06 |
| Pre-process before cutting a wafer and method of cutting a wafer App 20060073676 - Chen; Kuo-Ming ; et al. | 2006-04-06 |
| Electrical Package Structure Including Chip With Polymer Thereon App 20060071305 - Ho; Kai-Kuang ; et al. | 2006-04-06 |
| Method For Manufacturing Wafer Level Chip Scale Package Structure App 20060065976 - Hsuan; Min-Chih ; et al. | 2006-03-30 |
| Chip package and process thereof App 20050212132 - Hsuan, Min-Chih ; et al. | 2005-09-29 |
| Integrated circuit packages and the method for making the same Grant 6,846,697 - Ho , et al. January 25, 2 | 2005-01-25 |
| Microelectronic package App 20050002167 - Hsuan, John ; et al. | 2005-01-06 |
| Dram module package App 20030051908 - Ho, Kai-Kuang | 2003-03-20 |
| Integrated circuit packages and the method for the same App 20020111008 - Ho, Kai-Kuang ; et al. | 2002-08-15 |
| Integrated circuit packages and the method for the same App 20020102833 - Ho, Kai-Kuang ; et al. | 2002-08-01 |
| Wire bonding method App 20020092892 - Ho, Kai-Kuang | 2002-07-18 |
| Wafer-level Package App 20020053450 - YANG, TE-SHENG ; et al. | 2002-05-09 |
| Wafer-level chip scale package Grant 6,204,562 - Ho , et al. March 20, 2 | 2001-03-20 |
| Method of fabricating wafer-level package Grant 6,043,109 - Yang , et al. March 28, 2 | 2000-03-28 |
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