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Patent applications and USPTO patent grants for Ho; J K.The latest application filed is for "finger pad leadframe".
Patent | Date |
---|---|
Floated singulation Grant 11,437,303 - Ko , et al. September 6, 2 | 2022-09-06 |
Electronic device having inverted lead pins Grant 11,183,450 - Ko , et al. November 23, 2 | 2021-11-23 |
Finger pad leadframe Grant 11,081,429 - Chien , et al. August 3, 2 | 2021-08-03 |
Finger Pad Leadframe App 20210111103 - Chien; Jason ;   et al. | 2021-04-15 |
Leads For Semiconductor Package App 20210020549 - CHIEN; Jason ;   et al. | 2021-01-21 |
Electronic device having inverted lead pins Grant 10,714,418 - Ko , et al. | 2020-07-14 |
Tape And Reel Cover Tape To Improve Die Sticking Issues App 20150108038 - Hsu; Randy ;   et al. | 2015-04-23 |
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