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Patent applications and USPTO patent grants for Ho; Chung Wen.The latest application filed is for "high density cavity-up wire bond bga".
Patent | Date |
---|---|
High density cavity-up wire bond BGA Grant 6,455,926 - Ho September 24, 2 | 2002-09-24 |
High density cavity-up wire bond BGA App 20010046725 - Ho, Chung Wen | 2001-11-29 |
Low cost decal material used for packaging Grant 6,287,890 - Ho September 11, 2 | 2001-09-11 |
Low cost decal material used for packaging App 20010016370 - Ho, Chung Wen | 2001-08-23 |
BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology Grant 6,277,672 - Ho August 21, 2 | 2001-08-21 |
Packaging and interconnect system for integrated circuits Grant 5,998,859 - Griswold , et al. December 7, 1 | 1999-12-07 |
Package for multiple removable integrated circuits Grant 5,267,867 - Agahdel , et al. December 7, 1 | 1993-12-07 |
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