HO; CHUNG-HSIUNG
Patent Applications and Registrations
Patent applications and USPTO patent grants for HO; CHUNG-HSIUNG.The latest application filed is for "method for manufacturing side wettable package".
- HO; CHUNG-HSIUNG - Kaohsiung City TW
- Ho; Chung-Hsiung - Kaohsiung TW
| Patent | Date |
|---|---|
| Method For Manufacturing Side Wettable Package App 20220246561 - HO; CHUNG-HSIUNG ; et al. | 2022-08-04 |
| Side wettable package Grant 11,387,203 - Ho , et al. July 12, 2 | 2022-07-12 |
| Thin Semiconductor Package And Manufacturing Method Thereof App 20220157707 - Ho; Chung-Hsiung ; et al. | 2022-05-19 |
| Method For Manufacturing A Semiconductor Package Having A Conductive Pad With An Anchor Flange App 20220122904 - HO; CHUNG-HSIUNG ; et al. | 2022-04-21 |
| Side Wettable Package And Method For Manufacturing The Same App 20220077086 - HO; CHUNG-HSIUNG ; et al. | 2022-03-10 |
| Semiconductor Package And Method For Manufacturing The Same App 20220005749 - HO; CHUNG-HSIUNG ; et al. | 2022-01-06 |
| Semiconductor Package Structure And Fabricating Method Of The Same App 20210225662 - Ho; Chung-Hsiung ; et al. | 2021-07-22 |
| Chip-scale package device Grant 11,049,781 - Ho June 29, 2 | 2021-06-29 |
| Semiconductor device with conductive film shielding Grant 10,825,781 - Kang , et al. November 3, 2 | 2020-11-03 |
| Semiconductor Device With Conductive Film Shielding App 20200043862 - Kang; Chia Hao ; et al. | 2020-02-06 |
| Solderless inter-component joints Grant 10,390,440 - Lo , et al. A | 2019-08-20 |
| Solderless Inter-component Joints App 20190239361 - Lo; Tsung Nan ; et al. | 2019-08-01 |
| Wafer Level Package And Method Of Assembling Same App 20190088504 - HO; CHUNG HSIUNG | 2019-03-21 |
| IC packaging method and a packaged IC device Grant 10,211,071 - Ho , et al. Feb | 2019-02-19 |
| Multi-via redistribution layer for integrated circuits having solder balls Grant 10,192,837 - Ho , et al. Ja | 2019-01-29 |
| Integrated circuits and methods therefor Grant 10,177,021 - Ho , et al. J | 2019-01-08 |
| Wafer level package with EMI shielding Grant 10,008,454 - Ho June 26, 2 | 2018-06-26 |
| Wafer-level chip scale package with side protection Grant 9,892,989 - Ho , et al. February 13, 2 | 2018-02-13 |
| Ic Packaging Method And A Packaged Ic Device App 20170221728 - Ho; Chung Hsiung ; et al. | 2017-08-03 |
| Integrated Circuits And Methods Therefor App 20170200657 - Ho; Chung Hsiung ; et al. | 2017-07-13 |
| Dicing Of Low-k Wafers App 20160148842 - Ho; Chung Hsiung ; et al. | 2016-05-26 |
| Metal Shielding on Die Level App 20140264784 - Ho; Chung Hsiung ; et al. | 2014-09-18 |
| Film Based Ic Packaging Method And A Packaged Ic Device App 20130299955 - Chang; Ching Hui ; et al. | 2013-11-14 |
| Stacked-die Package And Method Therefor App 20130157414 - Ho; Chung Hsiung ; et al. | 2013-06-20 |
| Non-metal Stiffener Ring For Fcbga App 20120188721 - HO; Chung Hsiung ; et al. | 2012-07-26 |
| Substrate testing apparatus with full contact configuration App 20060091384 - Ho; Chung-Hsiung ; et al. | 2006-05-04 |
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