HO; Chok W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for HO; Chok W..The latest application filed is for "forming metal cap layer over through-glass-vias (tgvs)".

Company Profile

0.5.5

HO; Chok W. - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs) App 20180254239 - SUKUMARAN; Vijay ; et al.	2018-09-06
Use of ammonia for etching organic low-k dielectrics Grant 7,105,454 - Ho , et al. September 12, 2	2006-09-12
Use of ammonia for etching organic low-k dielectrics Grant 6,893,969 - Ho , et al. May 17, 2	2005-05-17
Use of ammonia for etching organic low-k dielectrics App 20050003676 - Ho, Chok W. ; et al.	2005-01-06
Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications Grant 6,777,344 - Annapragada , et al. August 17, 2	2004-08-17
Use of hydrocarbon addition for the elimination of micromasking during etching of organic low-k dielectrics Grant 6,620,733 - Ho September 16, 2	2003-09-16
Ultra-high oxide to photoresist selective etch of high-aspect-ratio openings in a low-pressure, high-density plasma Grant 6,486,070 - Ho , et al. November 26, 2	2002-11-26
Use of ammonia for etching organic low-k dielectrics App 20020108929 - Ho, Chok W. ; et al.	2002-08-15
Use of hydrocarbon addition for the elimination of micromasking during etching App 20020110992 - Ho, Chok W.	2002-08-15
Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications App 20020111041 - Annapragada, Rao V. ; et al.	2002-08-15

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