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Ho; Ching-Hsin Patent Filings

Ho; Ching-Hsin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ho; Ching-Hsin.The latest application filed is for "multi-layer printed circuit boards with dimensional stability".

Company Profile
0.2.3
  • Ho; Ching-Hsin - Taoyuan TW
  • HO; Ching-Hsin - Taoyuan County TW
  • Ho; Ching-Hsin - Tao-Yuan Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-layer printed circuit boards with dimensional stability
Grant 9,955,569 - Kuo , et al. April 24, 2
2018-04-24
Multi-layer Printed Circuit Boards With Dimensional Stability
App 20170079134 - KUO; Ya-Wen ;   et al.
2017-03-16
Multi-layer printed circuit boards with dimensional stability
Grant 9,545,018 - Kuo , et al. January 10, 2
2017-01-10
Multi-layer Printed Circuit Boards With Dimensional Stability
App 20160128180 - KUO; Ya-Wen ;   et al.
2016-05-05
Method For Manufacturing Metal Base Laminate
App 20110274877 - Yu; Li-Chih ;   et al.
2011-11-10

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