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Patent applications and USPTO patent grants for Ho; Ching-Hsin.The latest application filed is for "multi-layer printed circuit boards with dimensional stability".
Patent | Date |
---|---|
Multi-layer printed circuit boards with dimensional stability Grant 9,955,569 - Kuo , et al. April 24, 2 | 2018-04-24 |
Multi-layer Printed Circuit Boards With Dimensional Stability App 20170079134 - KUO; Ya-Wen ;   et al. | 2017-03-16 |
Multi-layer printed circuit boards with dimensional stability Grant 9,545,018 - Kuo , et al. January 10, 2 | 2017-01-10 |
Multi-layer Printed Circuit Boards With Dimensional Stability App 20160128180 - KUO; Ya-Wen ;   et al. | 2016-05-05 |
Method For Manufacturing Metal Base Laminate App 20110274877 - Yu; Li-Chih ;   et al. | 2011-11-10 |
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