Ho; Chin-Hsiung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ho; Chin-Hsiung.The latest application filed is for "process for wafer bonding".

Company Profile

0.9.3

Ho; Chin-Hsiung - Hsinchu City TW
Ho; Chin-Hsiung - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ; et al.	2008-08-14
Method for depositing silicon oxide incorporating an outgassing step Grant 6,716,740 - Wang , et al. April 6, 2	2004-04-06
Electrostatic charge-free solvent-type dryer for semiconductor wafers Grant 6,647,998 - Twu , et al. November 18, 2	2003-11-18
Method for preventing Cu CMP corrosion Grant 6,555,477 - Lu , et al. April 29, 2	2003-04-29
Method for depositing silicon oxide incorporating an outgassing step App 20030068902 - Wang, Shih-Ming ; et al.	2003-04-10
Electrostatic charge-free solvent-type dryer for semiconductor wafers App 20020195130 - Twu, Jih-Churng ; et al.	2002-12-26
Method for producing shallow trench isolation structure Grant 6,103,581 - Lin , et al. August 15, 2	2000-08-15
Borderless contact Grant 6,083,824 - Tsai , et al. July 4, 2	2000-07-04
Simplified process for the fabrication of deep clear laser marks using a photoresist mask Grant 6,063,695 - Lin , et al. May 16, 2	2000-05-16
Silicon and arsenic double implanted pre-amorphization process for salicide technology Grant 6,037,204 - Chang , et al. March 14, 2	2000-03-14
Dual damascene interconnect process with borderless contact Grant 6,020,255 - Tsai , et al. February 1, 2	2000-02-01
Isolation trench with a rounded top edge using an etch buffer layer Grant 5,674,775 - Ho , et al. October 7, 1	1997-10-07

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