HO; Chien-Hsin

Patent Applications and Registrations

Patent applications and USPTO patent grants for HO; Chien-Hsin.The latest application filed is for "interconnect structure without barrier layer on bottom surface of via".

Company Profile

3.4.5

HO; Chien-Hsin - Taichung City TW
Ho; Chien-Hsin - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect Structure without Barrier Layer on Bottom Surface of Via App 20220262675 - Kuo; Tz-Jun ; et al.	2022-08-18
Interconnect structure without barrier layer on bottom surface of via Grant 11,322,391 - Kuo , et al. May 3, 2	2022-05-03
Interconnect Structure Without Barrier Layer On Bottom Surface Of Via App 20200035546 - KUO; Tz-Jun ; et al.	2020-01-30
Interconnect structure without barrier layer on bottom surface of via Grant 10,453,740 - Kuo , et al. Oc	2019-10-22
Interconnect Structure Without Barrier Layer On Bottom Surface Of Via App 20190006230 - KUO; Tz-Jun ; et al.	2019-01-03
Method of forming an interconnection Grant 9,842,767 - Lee , et al. December 12, 2	2017-12-12
Method Of Semiconductor Integrated Circuit Fabrication App 20150017799 - Lee; Ming-Han ; et al.	2015-01-15
Method of semiconductor integrated circuit fabrication Grant 8,749,060 - Lee , et al. June 10, 2	2014-06-10
Method Of Semiconductor Integrated Circuit Fabrication App 20140084469 - Lee; Ming Han ; et al.	2014-03-27

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