Hlaing; Ma Phoo Pwint

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hlaing; Ma Phoo Pwint.The latest application filed is for "semiconductor device and method of forming ewlb semiconductor package with vertical interconnect structure and cavity region".

Company Profile

0.10.8

Hlaing; Ma Phoo Pwint - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region Grant 9,620,557 - Chow , et al. April 11, 2	2017-04-11
Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration Grant 9,397,058 - Bao , et al. July 19, 2	2016-07-19
Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region App 20160104731 - Chow; Seng Guan ; et al.	2016-04-14
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region Grant 9,252,172 - Chow , et al. February 2, 2	2016-02-02
Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package Grant 9,171,769 - Chow , et al. October 27, 2	2015-10-27
Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump Grant 9,142,522 - Bao , et al. September 22, 2	2015-09-22
Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration App 20150091165 - Bao; Xusheng ; et al.	2015-04-02
Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration Grant 8,963,326 - Bao , et al. February 24, 2	2015-02-24
Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration App 20130140691 - Bao; Xusheng ; et al.	2013-06-06
Semiconductor Device and Method of Forming RDL Under Bump for Electrical Connection to Enclosed Bump App 20130134580 - Bao; Xusheng ; et al.	2013-05-30
Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region App 20120306038 - Chow; Seng Guan ; et al.	2012-12-06
Semiconductor Device and Method of Forming Openings Through Encapsulant to Reduce Warpage and Stress on Semiconductor Package App 20120139120 - Chow; Seng Guan ; et al.	2012-06-07

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