Hiyoshi; Michiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiyoshi; Michiaki.The latest application filed is for "boiling cooling device".

Company Profile

2.23.14

Hiyoshi; Michiaki - Kanagawa KR
Hiyoshi; Michiaki - Seoul KR
Hiyoshi; Michiaki - Yokohama KR
Hiyoshi; Michiaki - Tokyo JP
Hiyoshi, Michiaki - Hyogo-ken JP
Hiyoshi, Michiaki - Yokohama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Boiling cooling device Grant 10,685,901 - Hiyoshi	2020-06-16
Power module and manufacturing method thereof Grant 10,541,188 - Hiyoshi Ja	2020-01-21
Boiling Cooling Device App 20190363035 - Hiyoshi; Michiaki	2019-11-28
Power Module And Manufacturing Method Thereof App 20180082920 - Hiyoshi; Michiaki	2018-03-22
Semiconductor device and a method of manufacturing same Grant 9,076,774 - Kumagai , et al. July 7, 2	2015-07-07
Power semiconductor module Grant 9,000,601 - Azuma , et al. April 7, 2	2015-04-07
Power module and manufacturing method thereof Grant 8,723,320 - Yoshida , et al. May 13, 2	2014-05-13
Semiconductor Device And A Method Of Manufacturing Same App 20130313711 - KUMAGAI; Yukihiro ; et al.	2013-11-28
Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module Grant 8,564,953 - Horiuchi , et al. October 22, 2	2013-10-22
Power module and vehicle-mounted inverter using the same Grant 8,519,561 - Azuma , et al. August 27, 2	2013-08-27
Semiconductor power module, inverter, and method of manufacturing a power module Grant 8,472,188 - Horiuchi , et al. June 25, 2	2013-06-25
Power Module and Manufacturing Method Thereof App 20130049201 - YOSHIDA; Isamu ; et al.	2013-02-28
Power Semiconductor Module App 20130001805 - AZUMA; Katsunori ; et al.	2013-01-03
Semiconductor Power Module, Inverter/Converter Including the same, and Method of Manufacturing a Cooling Jacket for Semiconductor Power Module App 20110188204 - HORIUCHI; Keisuke ; et al.	2011-08-04
Power Module and Vehicle-Mounted Inverter Using the Same App 20100327654 - AZUMA; Katsunori ; et al.	2010-12-30
Semiconductor Power Module, Inverter, And Method Of Manufacturing A Power Module App 20100208427 - Horiuchi; Keisuke ; et al.	2010-08-19
Portion of power module for power inverter Grant D598,846 - Satoh , et al. August 25, 2	2009-08-25
Voltage-driven power semiconductor device Grant 6,967,357 - Kon , et al. November 22, 2	2005-11-22
Hermetically sealed semiconductor power module and large scale module comprising the same Grant 6,967,402 - Hiyoshi November 22, 2	2005-11-22
Hermetically sealed semiconductor power module and large scale module comprising the same App 20040159940 - Hiyoshi, Michiaki	2004-08-19
Semiconductor device including intermediate wiring element Grant 6,770,964 - Hiyoshi August 3, 2	2004-08-03
Semiconductor device having junction-termination structure of resurf type Grant 6,765,239 - Hiyoshi , et al. July 20, 2	2004-07-20
Hermetically sealed semiconductor power module and large scale module comprising the same Grant 6,756,667 - Hiyoshi June 29, 2	2004-06-29
Pressure-contact type semiconductor device App 20040021149 - Kitazawa, Hideaki ; et al.	2004-02-05
Semiconductor device App 20030006497 - Hiyoshi, Michiaki ; et al.	2003-01-09
Semiconductor device including intermediate wiring element App 20020038873 - Hiyoshi, Michiaki	2002-04-04
Hermetically sealed semiconductor power module and large scale module comprising the same App 20020027283 - Hiyoshi, Michiaki	2002-03-07
Multichip press-contact type semiconductor device Grant 5,990,501 - Hiyoshi , et al. November 23, 1	1999-11-23
Multichip press-contact type semiconductor device Grant 5,866,944 - Hiyoshi , et al. February 2, 1	1999-02-02
Press-contact type semiconductor device Grant 5,360,985 - Hiyoshi , et al. November 1, 1	1994-11-01
Crimp-type semiconductor device having non-alloy structure Grant 5,140,406 - Matsuda , et al. August 18, 1	1992-08-18

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