Hiyama; Shin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiyama; Shin.The latest application filed is for "substrate cooling unit, substrate processing apparatus, substrate processing method, method for manufacturing semiconductor device, and non-transitory computer-readable recording medium".

Company Profile

4.11.22

Hiyama; Shin - Toyama JP
HIYAMA; Shin - Toyama-shi JP
HIYAMA; Shin - Toyama-shi TOYAMA JP
HIYAMA, SHIN - TOKYO JP
Hiyama, Shin - Nakano-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate processing apparatus and temperature measurement unit Grant 11,424,146 - Aburatani , et al. August 23, 2	2022-08-23
Substrate Cooling Unit, Substrate Processing Apparatus, Substrate Processing Method, Method For Manufacturing Semiconductor Device, And Non-transitory Computer-readable Recording Medium App 20220208587 - SAITO; Takuya ; et al.	2022-06-30
Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device, And Baffle Structure Of The Substrate Processing Apparatus App 20210343507 - YANAI; Hidehiro ; et al.	2021-11-04
Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus Grant 11,101,111 - Yanai , et al. August 24, 2	2021-08-24
Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device, And Baffle Structure Of The Substrate Processing Apparatus App 20200381221 - YANAI; Hidehiro ; et al.	2020-12-03
Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus Grant 10,763,084 - Yanai , et al. Sep	2020-09-01
Plasma processing apparatus and method of manufacturing semiconductor device Grant 10,403,478 - Yanai , et al. Sep	2019-09-03
Substrate Processing Apparatus And Temperature Measurement Unit App 20190019699 - ABURATANI; Yukinori ; et al.	2019-01-17
Method for removing adhering matter and dry etching method Grant 10,153,153 - Kikuchi , et al. Dec	2018-12-11
Method of manufacturing semiconductor device Grant 10,121,651 - Ogawa , et al. November 6, 2	2018-11-06
Method of manufacturing semiconductor device Grant 10,014,171 - Aburatani , et al. July 3, 2	2018-07-03
Method Of Manufacturing Semiconductor Device App 20180182619 - OGAWA; Arito ; et al.	2018-06-28
Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device, And Baffle Structure Of The Substrate Processing Apparatus App 20180144908 - YANAI; Hidehiro ; et al.	2018-05-24
Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus Grant 9,911,580 - Yanai , et al. March 6, 2	2018-03-06
Method of Manufacturing Semiconductor Device App 20170372894 - ABURATANI; Yukinori ; et al.	2017-12-28
Method For Removing Adhering Matter And Dry Etching Method App 20170200602 - KIKUCHI; Akiou ; et al.	2017-07-13
Substrate Processing Apparatus And Method Of Manufacturing Semiconductor Device App 20160211151 - TSUBOTA; Yasutoshi ; et al.	2016-07-21
Substrate Processing Apparatus, Method For Manufacturing Semiconductor Device, And Recording Medium App 20160155630 - TSUBOTA; Yasutoshi ; et al.	2016-06-02
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium App 20160013053 - ASHIHARA; Hiroshi ; et al.	2016-01-14
Plasma Processing Apparatus And Method Of Manufacturing Semiconductor Device App 20150371832 - YANAI; Hidehiro ; et al.	2015-12-24
Substrate processing apparatus and method of manufacturing semiconductor device Grant 9,082,797 - Aburatani , et al. July 14, 2	2015-07-14
Method Of Manufacturing Semiconductor Device, Apparatus For Manufacturing Semiconductor Device, And Non-transitory Computer-readable Recording Medium App 20140235068 - ASHIHARA; Hiroshi ; et al.	2014-08-21
Plasma Processing Method And Plasma Ashing Apparatus App 20130019894 - KUDOU; Yutaka ; et al.	2013-01-24
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device App 20130012035 - Aburatani; Yukinori ; et al.	2013-01-10
Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device, And Baffle Structure Of The Substrate Processing Apparatus App 20120132228 - Yanai; Hidehiro ; et al.	2012-05-31
Substrate Processing Method And Substrate Processing Apparatus App 20100330773 - HIYAMA; Shin	2010-12-30
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus App 20090176381 - HIYAMA; Shin ; et al.	2009-07-09
Method of manufacturing semiconductor device App 20090093124 - Hiyama; Shin	2009-04-09
Plasma Cvd Device App 20030205202 - FUNAKI, KATSUNORI ; et al.	2003-11-06
Method for manufacturing semiconductor device, method for processing substrate, and substrate processing apparatus App 20020192984 - Hiyama, Shin ; et al.	2002-12-19

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