Hively; James W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hively; James W..The latest application filed is for "method of fabricating a microelectronic package having polymer esd protection".
- Hively; James W. - Sunnyvale CA
| Patent | Date |
|---|---|
| Method of fabricating a microelectronic package having polymer ESD protection Grant 5,970,321 - Hively October 19, 1 | 1999-10-19 |
| Microelectronic package with polymer ESD protection Grant 5,955,762 - Hively September 21, 1 | 1999-09-21 |
| Microelectronic device with thin film electrostatic discharge protection structure Grant 5,869,869 - Hively February 9, 1 | 1999-02-09 |
| Test socket for testing integrated circuit packages Grant 5,808,474 - Hively , et al. September 15, 1 | 1998-09-15 |
| Very high density wafer scale device architecture Grant 5,691,949 - Hively , et al. November 25, 1 | 1997-11-25 |
| Very high density wafer scale device architecture Grant 5,252,507 - Hively , et al. October 12, 1 | 1993-10-12 |
| Package for an integrated circuit structure Grant 5,223,741 - Bechtel , et al. June 29, 1 | 1993-06-29 |
| High density multichip package with interconnect structure and heatsink Grant 5,182,632 - Bechtel , et al. January 26, 1 | 1993-01-26 |
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