HITOKAWA; Hiroshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for HITOKAWA; Hiroshi.The latest application filed is for "polymer, semiconductor composition comprising polymer, and method for manufacturing film using semiconductor composition".
- HITOKAWA; Hiroshi - Kakegawa-shi JP
- Hitokawa; Hiroshi - Kakegawa JP
| Patent | Date |
|---|---|
| Polymer, Semiconductor Composition Comprising Polymer, And Method For Manufacturing Film Using Semiconductor Composition App 20220119568 - HITOKAWA; Hiroshi ; et al. | 2022-04-21 |
| Bottom antireflective coating forming composition Grant 11,221,558 - Hitokawa , et al. January 11, 2 | 2022-01-11 |
| High heat resistance resist composition and pattern forming method using the same Grant 11,079,680 - Suzuki , et al. August 3, 2 | 2021-08-03 |
| Bottom Antireflective Coating Forming Composition App 20190171107 - HITOKAWA; Hiroshi ; et al. | 2019-06-06 |
| High Heat Resistance Resist Composition And Pattern Forming Method Using The Same App 20190033717 - SUZUKI; Masato ; et al. | 2019-01-31 |
| Method for producing surface-modified silica nanoparticles, and surface-modified silica nanoparticles Grant 10,106,428 - Yanagita , et al. October 23, 2 | 2018-10-23 |
| Method For Producing Surface-modified Silica Nanoparticles, And Surface-modified Silica Nanoparticles App 20170190586 - YANAGITA; HIROSHI ; et al. | 2017-07-06 |
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