loadpatents
Patent applications and USPTO patent grants for HITACHI HIGH-TECH INSTRUMENTS CO., LTD..The latest application filed is for "method for mounting electronic component and device for mounting electronic component".
Patent | Date |
---|---|
Device for mounting electronic components Grant 9,756,770 - Ohyama , et al. September 5, 2 | 2017-09-05 |
Component mounting system Grant 9,325,572 - Saegusa , et al. April 26, 2 | 2016-04-26 |
Method For Mounting Electronic Component And Device For Mounting Electronic Component App 20150143693 - OHYAMA; Kazuyoshi ;   et al. | 2015-05-28 |
Terminal Communication Apparatus, And Distributed Control System App 20150127707 - SAEGUSA; Takashi ;   et al. | 2015-05-07 |
Component Supply Device and Component Installation Device App 20150121689 - Tanokuchi; Akito ;   et al. | 2015-05-07 |
Component Supply Device And Component Mounting Device App 20150115093 - TANOKUCHI; Akito ;   et al. | 2015-04-30 |
Feeder, Feeder Control Method And Electronic Component Mounting Device App 20150110588 - OHYAMA; Kazuyoshi ;   et al. | 2015-04-23 |
Calculation Device, Parts Installation Device, And Program App 20150081079 - Asakura; Ryoji ;   et al. | 2015-03-19 |
Frame feeding system and frame feeding method Grant 8,965,572 - Ohkubo , et al. February 24, 2 | 2015-02-24 |
Method For Mounting Electronic Component And Device For Mounting Electronic Component App 20150013154 - Imoto; Takuya ;   et al. | 2015-01-15 |
Die Bonder And Bonding Head Device Of The Same, And Also Collet Position Adjusting Method App 20140265094 - KOBASHI; Hideharu ;   et al. | 2014-09-18 |
Collet Cleaning Method and Die Bonder Using the Same App 20140251535 - ISHII; Yoshihide ;   et al. | 2014-09-11 |
Foreign substance removing device and die bonder equipped with the same Grant 8,783,319 - Yamagami , et al. July 22, 2 | 2014-07-22 |
Die bonder and bonding method Grant 8,727,202 - Nakajima , et al. May 20, 2 | 2014-05-20 |
Die Bonder and Method of Position Recognition of Die App 20140078289 - OMORI; Ryo ;   et al. | 2014-03-20 |
Die Bonder And Bonding Method App 20140069564 - TAKANO; Ryuichi ;   et al. | 2014-03-13 |
Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder App 20140074280 - ISHII; Yoshihide ;   et al. | 2014-03-13 |
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method App 20140060751 - YAMAMOTO; Keita ;   et al. | 2014-03-06 |
Tool management method of die bonder and die bonder Grant 8,593,261 - Takagi , et al. November 26, 2 | 2013-11-26 |
Industrial network system Grant 8,565,238 - Saegusa , et al. October 22, 2 | 2013-10-22 |
Die bonder, pickup method, and pickup device Grant 8,561,664 - Maki , et al. October 22, 2 | 2013-10-22 |
Die bonder and semiconductor manufacturing method Grant 8,540,001 - Kihara , et al. September 24, 2 | 2013-09-24 |
Two-Shaft Drive Mechanism and Die Bonder App 20130221764 - ISHII; Yoshihide ;   et al. | 2013-08-29 |
Die bonder and bonding method Grant 8,460,491 - Fukasawa , et al. June 11, 2 | 2013-06-11 |
Motor control system and motor control method Grant 8,456,126 - Tate , et al. June 4, 2 | 2013-06-04 |
Die Bonder and Bonding Method App 20130071956 - NAKAJIMA; Nobuhisa ;   et al. | 2013-03-21 |
Die Bonder and Bonding Method App 20130068824 - MOCHIZUKI; Masayuki ;   et al. | 2013-03-21 |
Die Bonder and Bonding Method App 20130068826 - Maki; Hiroshi ;   et al. | 2013-03-21 |
Die Bonder and Bonding Method App 20130068823 - MAKI; Hiroshi ;   et al. | 2013-03-21 |
Biaxial Drive Mechanism and Die Bonder App 20130014904 - HOSAKA; Koji ;   et al. | 2013-01-17 |
Die Bonder App 20130016205 - MAKITA; Yoshiaki ;   et al. | 2013-01-17 |
Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method App 20130014881 - FUKASAWA; Shingo ;   et al. | 2013-01-17 |
Frame Feeding System and Frame Feeding Method App 20130017040 - OHKUBO; Tatsuyuki ;   et al. | 2013-01-17 |
Component feeder Grant 8,353,424 - Ikeda , et al. January 15, 2 | 2013-01-15 |
Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method Grant 8,340,803 - Chida , et al. December 25, 2 | 2012-12-25 |
Electronic component mounting apparatus Grant 8,336,195 - Watanabe , et al. December 25, 2 | 2012-12-25 |
Pick-Up Method of Die Bonder and Die Bonder App 20120244647 - OKAMOTO; Naoki ;   et al. | 2012-09-27 |
Foreign Substance Removing Device and Die Bonder Equipped with the Same App 20120241096 - YAMAGAMI; Takashi ;   et al. | 2012-09-27 |
Electronic component mounting apparatus Grant 8,266,787 - Oyama , et al. September 18, 2 | 2012-09-18 |
Motor Control System and Motor Control Method App 20120212171 - TATE; Mitsuaki ;   et al. | 2012-08-23 |
Die Bonder and Semiconductor Manufacturing Method App 20120214258 - KIHARA; Masamichi ;   et al. | 2012-08-23 |
Method of mounting electronic component Grant 8,186,047 - Aoki , et al. May 29, 2 | 2012-05-29 |
Electronic component mounting method Grant 8,181,337 - Watanabe , et al. May 22, 2 | 2012-05-22 |
Tool Management Method of Die Bonder and Die Bonder App 20120075079 - TAKAGI; Susumu ;   et al. | 2012-03-29 |
Electronic component mounting apparatus Grant 8,127,435 - Mitsumochi , et al. March 6, 2 | 2012-03-06 |
Electronic component mounting apparatus Grant 8,099,860 - Watanabe , et al. January 24, 2 | 2012-01-24 |
Mounting apparatus for electronic components Grant 8,079,138 - Kashitani , et al. December 20, 2 | 2011-12-20 |
Mounting apparatus for electronic components Grant 8,079,137 - Ieizumi , et al. December 20, 2 | 2011-12-20 |
Industrial Network System App 20110200049 - SAEGUSA; Takashi ;   et al. | 2011-08-18 |
Electronic Component Mounting Apparatus, Component Supply Apparatus, and Electronic Component Mounting Method App 20110072654 - OYAMA; Kazuyoshi ;   et al. | 2011-03-31 |
Electronic Component Mounting Apparatus App 20110030203 - Mitsumochi; Yutaka ;   et al. | 2011-02-10 |
Setting device, component mounting system, program and calculating method Grant 7,885,723 - Chida , et al. February 8, 2 | 2011-02-08 |
Electronic component mounting apparatus with setting device setting measurement positions for printed board Grant 7,849,588 - Onishi December 14, 2 | 2010-12-14 |
Electronic component mounting apparatus Grant 7,841,073 - Mitsumochi , et al. November 30, 2 | 2010-11-30 |
Network I/o System And Network Configuring Method App 20100299415 - SAEGUSA; Takashi ;   et al. | 2010-11-25 |
Component Feeder App 20100186901 - IKEDA; Hiroshi ;   et al. | 2010-07-29 |
Electronic Component Mounting Apparatus App 20100186223 - Watanabe; Akio ;   et al. | 2010-07-29 |
Electronic component mounting method Grant 7,721,424 - Aoki , et al. May 25, 2 | 2010-05-25 |
Electronic component mounting apparatus Grant 7,712,208 - Watanabe , et al. May 11, 2 | 2010-05-11 |
Electronic Component Mounting Apparatus and Printed Circuit Board Processing Apparatus App 20090303485 - KURIBARA; Shigeru ;   et al. | 2009-12-10 |
Mounting Apparatus For Electronic Components App 20090241327 - KASHITANI; Hisayoshi ;   et al. | 2009-10-01 |
Mounting Apparatus For Electronic Components App 20090241326 - Ieizumi; Kazuyoshi ;   et al. | 2009-10-01 |
Electronic component mounting apparatus Grant 7,581,310 - Fukushima , et al. September 1, 2 | 2009-09-01 |
Electronic Component Mounting Method And Eletronic Component And Mounting Apparatus App 20090211086 - AOKI; Akira ;   et al. | 2009-08-27 |
Installation Head Actuator For Electronic Parts And Installation Device For Electronic Parts App 20090183361 - TAKAHIRA; Isao ;   et al. | 2009-07-23 |
Electronic component mounting apparatus Grant 7,546,678 - Asai , et al. June 16, 2 | 2009-06-16 |
Electronic component mounting method and electronic component mounting apparatus Grant 7,533,459 - Kano , et al. May 19, 2 | 2009-05-19 |
Electronic Component Mounting Apparatus App 20090119912 - Watanabe; Akio ;   et al. | 2009-05-14 |
Electronic component feeding device and electronic component mounting apparatus with electronic component feeding device Grant 7,513,389 - Kitajima , et al. April 7, 2 | 2009-04-07 |
Electronic component feeding device Grant 7,503,366 - Oyama , et al. March 17, 2 | 2009-03-17 |
Electronic Component Mounting Apparatus And Method Of Mounting Electronic Components App 20090031559 - KAWABATA; Yoshihiro ;   et al. | 2009-02-05 |
Method Of Mounting Electronic Component And Electronic Component Mounting Apparatus App 20080263858 - Onishi; Seiji | 2008-10-30 |
Apparatus And Method For Mounting Electronic Component App 20080201940 - WATANABE; Akio ;   et al. | 2008-08-28 |
Mounting head of electronic component mounting apparatus Grant 7,401,401 - Usui , et al. July 22, 2 | 2008-07-22 |
Board positioning device and board positioning method Grant 7,376,486 - Kuribara , et al. May 20, 2 | 2008-05-20 |
Electronic component mounting apparatus and electronic component mounting method Grant 7,367,117 - Yoshii , et al. May 6, 2 | 2008-05-06 |
Electronic component mounting apparatus Grant 7,246,429 - Oyama July 24, 2 | 2007-07-24 |
Electronic component mounting apparatus App 20070130756 - Watanabe; Akio ;   et al. | 2007-06-14 |
Electronic component feeding device and electronic component counting apparatus having the same Grant 7,219,823 - Yanagida May 22, 2 | 2007-05-22 |
Component feeding apparatus Grant 7,216,790 - Nagao May 15, 2 | 2007-05-15 |
Electronic component mounting apparatus App 20070094868 - Ieizumi; Kazuyoshi ;   et al. | 2007-05-03 |
Electronic component mounting apparatus App 20070074387 - Ieizumi; Kazuyoshi ;   et al. | 2007-04-05 |
Electronic component mounting apparatus App 20070011869 - Watanabe; Akio ;   et al. | 2007-01-18 |
Electronic component mounting apparatus Grant 7,159,305 - Aoki , et al. January 9, 2 | 2007-01-09 |
Electronic component mounting method and electronic component mounting apparatus App 20060185162 - Aoki; Akira ;   et al. | 2006-08-24 |
Electronic component mounting system and electronic component mounting method Grant 7,054,707 - Moriya , et al. May 30, 2 | 2006-05-30 |
Mounting head of electronic component mounting apparatus App 20060103151 - Usui; Yoshinao ;   et al. | 2006-05-18 |
Electronic component mounting method Grant 7,017,263 - Yanagida March 28, 2 | 2006-03-28 |
Electronic component mounting apparatus App 20060021215 - Kano; Yoshinori ;   et al. | 2006-02-02 |
Electronic component mounting apparatus Grant 6,986,195 - Seto , et al. January 17, 2 | 2006-01-17 |
Electronic component mounting apparatus and electronic component mounting method App 20060000086 - Takemura; Ikuo ;   et al. | 2006-01-05 |
Electronic component mounting apparatus and electronic component mounting method App 20050274004 - Yoshii, Takashi ;   et al. | 2005-12-15 |
Electronic component mounting method and electronic component mounting apparatus App 20050250223 - Kano, Yoshinori ;   et al. | 2005-11-10 |
Electronic component feeding device App 20050224183 - Oyama, Kazuyoshi ;   et al. | 2005-10-13 |
Electronic component feeding device and electronic component mounting apparatus with electronic component feeding device App 20050210664 - Kitajima, Takahiro ;   et al. | 2005-09-29 |
Electronic component mounting apparatus App 20050177998 - Fukushima, Yoshiharu ;   et al. | 2005-08-18 |
Electronic component mounting apparatus App 20050166392 - Kurata, Kenji ;   et al. | 2005-08-04 |
Electronic component mounting system and electronic component mounting method App 20050165505 - Moriya, Yuji ;   et al. | 2005-07-28 |
Electronic component mounting apparatus App 20050132565 - Aoki, Akira ;   et al. | 2005-06-23 |
Electronic component mounting apparatus App 20050102826 - Asai, Jun ;   et al. | 2005-05-19 |
Board positioning device and board positioning method App 20050080508 - Kuribara, Shigeru ;   et al. | 2005-04-14 |
Electronic component mounting apparatus and electronic component mounting method App 20050071997 - Oyama, Kazuyoshi ;   et al. | 2005-04-07 |
Electronic component feeding device and electronic component counting apparatus having the same App 20050011926 - Yanagida, Tsutomu | 2005-01-20 |
Electronic component mounting method App 20050005435 - Yanagida, Tsutomu | 2005-01-13 |
Apparatus for mounting electronic components Grant 6,792,674 - Yoshii , et al. September 21, 2 | 2004-09-21 |
Electronic component-recognizing device Grant 6,788,805 - Fukushima , et al. September 7, 2 | 2004-09-07 |
Electronic component mounting apparatus App 20040139597 - Oyama, Kazuyoshi | 2004-07-22 |
Component feeding apparatus App 20040140338 - Nagao, Kazuhiro | 2004-07-22 |
Lift cam mechanism for electronic parts mounting apparatus Grant 6,622,379 - Kano September 23, 2 | 2003-09-23 |
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