Hitachi High-Tech Electronics Engineering Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hitachi High-Tech Electronics Engineering Co., Ltd..The latest application filed is for "inspection method and inspection apparatus".

Company Profile

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Hitachi High-Tech Electronics Engineering Co., Ltd. - Tokyo JP
Hitachi High-Tech Electronics Engineering Co., Ltd. - JP JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inspection method and inspection apparatus Grant 7,586,593 - Hamamatsu , et al. September 8, 2	2009-09-08
Apparatus and method for inspecting defects Grant 7,511,806 - Hamamatsu , et al. March 31, 2	2009-03-31
Inspecting method and apparatus for repeated micro-miniature patterns Grant 6,944,325 - Taguchi , et al. September 13, 2	2005-09-13
Method and its apparatus for inspecting particles or defects of a semiconductor device Grant 6,936,835 - Nishiyama , et al. August 30, 2	2005-08-30
ACF tape feeder machine, and method for feeding ACF tape Grant 6,911,101 - Onoshiro , et al. June 28, 2	2005-06-28
Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device Grant 6,897,956 - Noguchi , et al. May 24, 2	2005-05-24
Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk Grant 6,893,329 - Tajima , et al. May 17, 2	2005-05-17
Testing Apparatus For Conducting A Test On A Magnetic Recording Medium Or A Magnetic Head, Through Recording Test Data On The Magnetic Recording Medium And Reproducing Recorded Test Data Therefrom By Means Of The Magnetic Head Grant 6,894,489 - Makuuchi , et al. May 17, 2	2005-05-17
Surface inspection apparatus and method thereof Grant 6,894,302 - Ishimaru , et al. May 17, 2	2005-05-17
Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape Grant 6,887,330 - Onoshiro , et al. May 3, 2	2005-05-03
Surface inspection method and surface inspection apparatus Grant 6,888,918 - Horai , et al. May 3, 2	2005-05-03
Method of inspecting a semiconductor device and an apparatus thereof Grant 6,888,959 - Hamamatsu , et al. May 3, 2	2005-05-03
Method and apparatus for treating surface of substrate plate Grant 6,821,906 - Wada , et al. November 23, 2	2004-11-23
Apparatus and method for inspecting surface of semiconductor wafer or the like Grant 6,798,504 - Sato , et al. September 28, 2	2004-09-28

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