Hitachi AIC Inc.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hitachi AIC Inc..The latest application filed is for "chip-type light emitting device and wiring substrate for the same".
- Hitachi AIC Inc. - Tokyo JP
- Hitachi AIC Inc. - JP JP
| Patent | Date |
|---|---|
| Chip-type light emitting device and wiring substrate for the same Grant 7,777,238 - Nishida , et al. August 17, 2 | 2010-08-17 |
| LED reflecting plate and LED device Grant 7,626,211 - Sugiura , et al. December 1, 2 | 2009-12-01 |
| Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device Grant 6,777,612 - Sugiura , et al. August 17, 2 | 2004-08-17 |
| Electronic component device and method of manufacturing the same Grant 6,600,214 - Ishikawa , et al. July 29, 2 | 2003-07-29 |
| Method of manufacturing multilayer printed wiring board Grant 5,826,330 - Isoda , et al. October 27, 1 | 1998-10-27 |
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