HISENSE USA CORORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for HISENSE USA CORORATION.The latest application filed is for "dmd assembly and dlp projection device".
- HISENSE USA CORORATION - Suwanee GA US
| Patent | Date |
|---|---|
| Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group Grant 10,912,200 - Zhao , et al. February 2, 2 | 2021-02-02 |
| DMD assembly and DLP projection device Grant 10,718,999 - Hou , et al. | 2020-07-21 |
| DMD Assembly And DLP Projection Device App 20180356628 - Hou; Naiwen ; et al. | 2018-12-13 |
| Voice Control Method, Device And Terminal App 20180330734 - ZHANG; Dazhao ; et al. | 2018-11-15 |
| Method For Querying Information Of A Currently Broadcasted TV Program And Smart TV App 20180316959 - SONG; Hu ; et al. | 2018-11-01 |
| Printed Circuit Board And Optical Module App 20180270954 - ZHAO; Wei ; et al. | 2018-09-20 |
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