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name:-0.013678073883057
name:-0.0089788436889648
name:-0.00053787231445312
Hisano; Akira Patent Filings

Hisano; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hisano; Akira.The latest application filed is for "sintered compact magnesium oxide target for sputtering, and method for producing same".

Company Profile
0.10.9
  • Hisano; Akira - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sintered Compact Magnesium Oxide Target For Sputtering, And Method For Producing Same
App 20180251889 - Hisano; Akira ;   et al.
2018-09-06
Sintered compact magnesium oxide target for sputtering, and method for producing same
Grant 10,066,290 - Hisano , et al. September 4, 2
2018-09-04
Sintered compact magnesium oxide target for sputtering, and method for producing same
Grant 9,988,709 - Hisano , et al. June 5, 2
2018-06-05
Sputtering target and process for producing same
Grant 9,034,154 - Nakamura , et al. May 19, 2
2015-05-19
Sintered Compact Magnesium Oxide Target for Sputtering, and Method for Producing Same
App 20140284212 - Hisano; Akira ;   et al.
2014-09-25
Sputtering target with few surface defects, and surface processing method thereof
Grant 8,663,402 - Nakamura , et al. March 4, 2
2014-03-04
Sputtering Target and Process for Producing Same
App 20110162971 - Nakamura; Yuichiro ;   et al.
2011-07-07
Sputtering Target with Few Surface Defects, and Surface Processing Method Thereof
App 20110132757 - Nakamura; Yuichiro ;   et al.
2011-06-09
Co-Cr-Pt-B alloy sputtering target
Grant 7,927,434 - Nakamura , et al. April 19, 2
2011-04-19
Sputtering target with few surface defects, and surface processing method thereof
Grant 7,909,949 - Nakamura , et al. March 22, 2
2011-03-22
AlRu sputtering target and manufacturing method thereof
Grant 7,767,139 - Hisano August 3, 2
2010-08-03
High-purity Ru powder, sputtering target obtained by sintering the same, thin film obtained by sputtering the target and process for producing high-purity Ru powder
Grant 7,578,965 - Shindo , et al. August 25, 2
2009-08-25
High- Purity Ru Powder, Sputtering Target Obtained by Sintering the Same, Thin Film Obtained by Sputtering the Target and Process for Producing High-Purity Ru Powder
App 20070240992 - Shindo; Yuichiro ;   et al.
2007-10-18
Co-cr-pt-b alloy sputtering target
App 20070187236 - Nakamura; Yuichiro ;   et al.
2007-08-16
AlRu Sputtering Target and Manufacturing Method thereof
App 20070175753 - Hisano; Akira
2007-08-02
Sputtering target with few surface defects, and surface processing method thereof
App 20070125645 - Nakamura; Yuichiro ;   et al.
2007-06-07
Airu spattering target and method for preparation thereof
App 20040144204 - Hisano, Akira
2004-07-29

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