Hisakado; Sadao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hisakado; Sadao.The latest application filed is for "substrate processing apparatus".

Company Profile

2.4.6

Hisakado; Sadao - Toyama JP
HISAKADO; Sadao - Toyama-shi JP
Hisakado; Sadao - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate processing apparatus Grant 11,396,700 - Hisakado , et al. July 26, 2	2022-07-26
Substrate Processing Apparatus App 20210147978 - HISAKADO; Sadao ; et al.	2021-05-20
Method Of Cleaning Member In Process Container, Method Of Manufacturing Semiconductor Device, Substrate Processing Apparatus, An App 20190255576 - KURIBAYASHI; Koei ; et al.	2019-08-22
Substrate processing apparatus and method for manufacturing a semiconductor device Grant 8,282,737 - Ozaki , et al. October 9, 2	2012-10-09
Substrate Processing Apparatus And Method For Manufacturing A Semiconductor Device App 20120006268 - Ozaki; Takashi ; et al.	2012-01-12
Substrate processing apparatus and method for manufacturing a semiconductor device Grant 8,057,599 - Ozaki , et al. November 15, 2	2011-11-15
Substrate processing apparatus and method for manufacturing a semiconductor device Grant 8,043,431 - Ozaki , et al. October 25, 2	2011-10-25
Substrate processing apparatus and method for manufacturing a semiconductor device App 20090188431 - Ozaki; Takashi ; et al.	2009-07-30
Semiconductor manufacturing apparatus App 20090053021 - Yamagishi; Norichika ; et al.	2009-02-26
Substrate-processing apparatus and method of producing a semiconductor device App 20060150904 - Ozaki; Takashi ; et al.	2006-07-13

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