Hisaeda; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hisaeda; Yutaka.The latest application filed is for "bonding material and bonding method using the same".

Company Profile

0.16.17

Hisaeda; Yutaka - Nuremberg DE
HISAEDA; Yutaka - Okayama JP
Hisaeda; Yutaka - Tokyo JP
Hisaeda; Yutaka - Honjo JP
HISAEDA; Yutaka - Honjo-shi JP
Hisaeda; Yutaka - Okayama-shi JP
Hisaeda; Yutaka - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding method using bonding material Grant 10,090,275 - Endoh , et al. October 2, 2	2018-10-02
Bonding material and bonding method using the same Grant 10,008,471 - Endoh , et al. June 26, 2	2018-06-26
Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste Grant 9,721,694 - Kaneda , et al. August 1, 2	2017-08-01
Bonding Material And Bonding Method Using The Same App 20160172328 - ENDOH; Keiichi ; et al.	2016-06-16
Bonding Material And Bonding Method Using The Same App 20160099087 - ENDOH; Keiichi ; et al.	2016-04-07
Bonding material and bonding method using the same Grant 9,240,256 - Endoh , et al. January 19, 2	2016-01-19
Fine Silver Particle Powder, Method For Manufacturing The Same, Silver Paste Using The Powder And Method Of Use Of The Paste App 20150243400 - KANEDA; Shuji ; et al.	2015-08-27
Fine silver particle powder, method for manufacturing the same, silver paste using the powder, and method of use of the paste Grant 9,034,214 - Kaneda , et al. May 19, 2	2015-05-19
Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method Grant 8,858,700 - Endoh , et al. October 14, 2	2014-10-14
Low-temperature-sinterable bonding material, and bonding method using the bonding material Grant 8,641,929 - Endoh , et al. February 4, 2	2014-02-04
Bonding Material And Bonding Body, And Bonding Method App 20130323529 - Kurita; Satoru ; et al.	2013-12-05
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles Grant 8,486,310 - Hisaeda , et al. July 16, 2	2013-07-16
Low-temperature-sinterable Bonding Material, And Bonding Method Using The Bonding Material App 20130081759 - Endoh; Keiichi ; et al.	2013-04-04
Bonding Material And Bonding Method Using The Same App 20120298009 - Endoh; Keiichi ; et al.	2012-11-29
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles Grant 8,293,144 - Hisaeda , et al. October 23, 2	2012-10-23
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles Grant 8,293,142 - Hisaeda , et al. October 23, 2	2012-10-23
Method for producing silver particle powder Grant 8,287,771 - Sato , et al. October 16, 2	2012-10-16
Bonding Material Using Metal Nanoparticles And Bonding Method App 20120103515 - Endoh; Keiichi ; et al.	2012-05-03
Silver Conductive Film And Production Method Thereof App 20120045573 - SATO; Kimitaka ; et al.	2012-02-23
Composition Containing Fine Silver Particles, Production Method Thereof, Method For Producing Fine Silver Particles, And Paste Having Fine Silver Particles App 20110278508 - HISAEDA; Yutaka ; et al.	2011-11-17
Composition Containing Fine Silver Particles, Production Method Thereof, Method For Producing Fine Silver Particles, And Paste Having Fine Silver Particles App 20110272642 - HISAEDA; Yutaka ; et al.	2011-11-10
Fine Silver Particle Powder, Method For Manufacturing The Same, Silver Paste Using The Powder, And Method Of Use Of The Paste App 20110253949 - Kaneda; Shuji ; et al.	2011-10-20
Fine Metal Particle-containing Composition And Method For Manufacturing The Same App 20110155968 - Iha; Kosuke ; et al.	2011-06-30
Composition Containing Fine Silver Particles, Production Method Thereof, Method For Producing Fine Silver Particles, And Paste Having Fine Silver Particles App 20100243967 - Hisaeda; Yutaka ; et al.	2010-09-30
Silver particle composite powder and process production thereof App 20100025639 - Ogi; Kozo ; et al.	2010-02-04
Silver Conductive Film and Production Method Thereof App 20090053469 - Sato; Kimitaka ; et al.	2009-02-26

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